KR970059836U - 반도체세정액 분석장치 - Google Patents
반도체세정액 분석장치Info
- Publication number
- KR970059836U KR970059836U KR2019960007968U KR19960007968U KR970059836U KR 970059836 U KR970059836 U KR 970059836U KR 2019960007968 U KR2019960007968 U KR 2019960007968U KR 19960007968 U KR19960007968 U KR 19960007968U KR 970059836 U KR970059836 U KR 970059836U
- Authority
- KR
- South Korea
- Prior art keywords
- cleaning solution
- analysis device
- semiconductor cleaning
- solution analysis
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019960007968U KR200143498Y1 (ko) | 1996-04-13 | 1996-04-13 | 반도체세정액 분석장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019960007968U KR200143498Y1 (ko) | 1996-04-13 | 1996-04-13 | 반도체세정액 분석장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970059836U true KR970059836U (ko) | 1997-11-10 |
KR200143498Y1 KR200143498Y1 (ko) | 1999-06-15 |
Family
ID=19453743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019960007968U KR200143498Y1 (ko) | 1996-04-13 | 1996-04-13 | 반도체세정액 분석장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR200143498Y1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112735980A (zh) * | 2020-12-25 | 2021-04-30 | 北京北方华创微电子装备有限公司 | 半导体清洗工艺的控制方法和半导体清洗设备 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3378543B2 (ja) * | 1999-11-26 | 2003-02-17 | 株式会社半導体先端テクノロジーズ | ウェーハ・キャリア洗浄方法 |
-
1996
- 1996-04-13 KR KR2019960007968U patent/KR200143498Y1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112735980A (zh) * | 2020-12-25 | 2021-04-30 | 北京北方华创微电子装备有限公司 | 半导体清洗工艺的控制方法和半导体清洗设备 |
Also Published As
Publication number | Publication date |
---|---|
KR200143498Y1 (ko) | 1999-06-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20080102 Year of fee payment: 10 |
|
LAPS | Lapse due to unpaid annual fee |