KR970059836U - 반도체세정액 분석장치 - Google Patents
반도체세정액 분석장치Info
- Publication number
- KR970059836U KR970059836U KR2019960007968U KR19960007968U KR970059836U KR 970059836 U KR970059836 U KR 970059836U KR 2019960007968 U KR2019960007968 U KR 2019960007968U KR 19960007968 U KR19960007968 U KR 19960007968U KR 970059836 U KR970059836 U KR 970059836U
- Authority
- KR
- South Korea
- Prior art keywords
- cleaning solution
- analysis device
- semiconductor cleaning
- solution analysis
- semiconductor
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019960007968U KR200143498Y1 (ko) | 1996-04-13 | 1996-04-13 | 반도체세정액 분석장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019960007968U KR200143498Y1 (ko) | 1996-04-13 | 1996-04-13 | 반도체세정액 분석장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970059836U true KR970059836U (ko) | 1997-11-10 |
KR200143498Y1 KR200143498Y1 (ko) | 1999-06-15 |
Family
ID=19453743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019960007968U KR200143498Y1 (ko) | 1996-04-13 | 1996-04-13 | 반도체세정액 분석장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR200143498Y1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112735980A (zh) * | 2020-12-25 | 2021-04-30 | 北京北方华创微电子装备有限公司 | 半导体清洗工艺的控制方法和半导体清洗设备 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3378543B2 (ja) * | 1999-11-26 | 2003-02-17 | 株式会社半導体先端テクノロジーズ | ウェーハ・キャリア洗浄方法 |
-
1996
- 1996-04-13 KR KR2019960007968U patent/KR200143498Y1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112735980A (zh) * | 2020-12-25 | 2021-04-30 | 北京北方华创微电子装备有限公司 | 半导体清洗工艺的控制方法和半导体清洗设备 |
Also Published As
Publication number | Publication date |
---|---|
KR200143498Y1 (ko) | 1999-06-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20080102 Year of fee payment: 10 |
|
LAPS | Lapse due to unpaid annual fee |