KR970064180U - 불순물 제거기능을 갖는 웨이퍼 세정장치 - Google Patents

불순물 제거기능을 갖는 웨이퍼 세정장치

Info

Publication number
KR970064180U
KR970064180U KR2019960013041U KR19960013041U KR970064180U KR 970064180 U KR970064180 U KR 970064180U KR 2019960013041 U KR2019960013041 U KR 2019960013041U KR 19960013041 U KR19960013041 U KR 19960013041U KR 970064180 U KR970064180 U KR 970064180U
Authority
KR
South Korea
Prior art keywords
cleaning device
impurity removal
wafer cleaning
removal function
wafer
Prior art date
Application number
KR2019960013041U
Other languages
English (en)
Other versions
KR200158122Y1 (ko
Inventor
홍상희
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019960013041U priority Critical patent/KR200158122Y1/ko
Publication of KR970064180U publication Critical patent/KR970064180U/ko
Application granted granted Critical
Publication of KR200158122Y1 publication Critical patent/KR200158122Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR2019960013041U 1996-05-23 1996-05-23 불순물 제거기능을 갖는 웨이퍼 세정장치 KR200158122Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019960013041U KR200158122Y1 (ko) 1996-05-23 1996-05-23 불순물 제거기능을 갖는 웨이퍼 세정장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019960013041U KR200158122Y1 (ko) 1996-05-23 1996-05-23 불순물 제거기능을 갖는 웨이퍼 세정장치

Publications (2)

Publication Number Publication Date
KR970064180U true KR970064180U (ko) 1997-12-11
KR200158122Y1 KR200158122Y1 (ko) 1999-10-15

Family

ID=19456785

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019960013041U KR200158122Y1 (ko) 1996-05-23 1996-05-23 불순물 제거기능을 갖는 웨이퍼 세정장치

Country Status (1)

Country Link
KR (1) KR200158122Y1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101995688B1 (ko) 2019-02-14 2019-07-02 이선수 반도체 장비 부품의 이물질 제거 장치
KR102267914B1 (ko) * 2019-10-31 2021-06-22 세메스 주식회사 약액 공급 장치, 약액의 파티클 제거 방법, 노즐 유닛 및 기판 처리 장치

Also Published As

Publication number Publication date
KR200158122Y1 (ko) 1999-10-15

Similar Documents

Publication Publication Date Title
DE69637769D1 (de) Halbleitervorrichtung
DE69738008D1 (de) Halbleiterbauelement
DE69739242D1 (de) Halbleitervorrichtung
DE69806578T2 (de) Waferhaltevorrichtung
DE69727373D1 (de) Halbleitervorrichtung
DE69637698D1 (de) Halbleitervorrichtung
DE69637809D1 (de) Halbleiteranordnung
KR960019102U (ko) 웨이퍼 세척장치
DE69728850T2 (de) Halbleiteranordnung
KR970064180U (ko) 불순물 제거기능을 갖는 웨이퍼 세정장치
KR960015599U (ko) 웨이퍼 저면 세척장치
KR960032734U (ko) 웨이퍼 세정장치
KR960003092U (ko) 웨이퍼 세정장치
KR970059842U (ko) 웨이퍼 세정장치
DE29603048U1 (de) Abflußreinigungsgerät
KR980005384U (ko) 반도체 세정 장치
KR970015302U (ko) 반도체 웨이퍼 세정장치
KR960025327U (ko) 웨이퍼 세정장치
KR950031470U (ko) 웨이퍼 세정장치
KR970025814U (ko) 웨이퍼 이물질 제거장치
SE9600650D0 (sv) Anordning vid dammsugare
KR980005348U (ko) Uvo₃자동 클리너의 핸들러장치
DE69713658D1 (de) Halbleiterbauelement
KR950004794U (ko) 웨이퍼 세척장치
KR960006354U (ko) 웨이퍼 고정 장치

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20050620

Year of fee payment: 7

LAPS Lapse due to unpaid annual fee