KR970043210A - 석출물 성장 억제형 고강도,고전도성 동(Cu)합금 및 그 제조방법 - Google Patents
석출물 성장 억제형 고강도,고전도성 동(Cu)합금 및 그 제조방법 Download PDFInfo
- Publication number
- KR970043210A KR970043210A KR1019950048017A KR19950048017A KR970043210A KR 970043210 A KR970043210 A KR 970043210A KR 1019950048017 A KR1019950048017 A KR 1019950048017A KR 19950048017 A KR19950048017 A KR 19950048017A KR 970043210 A KR970043210 A KR 970043210A
- Authority
- KR
- South Korea
- Prior art keywords
- alloy
- copper
- less
- high strength
- high conductivity
- Prior art date
Links
- 239000010949 copper Substances 0.000 title claims abstract 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract 10
- 229910052802 copper Inorganic materials 0.000 title claims abstract 10
- 229910045601 alloy Inorganic materials 0.000 title claims abstract 9
- 239000000956 alloy Substances 0.000 title claims abstract 9
- 238000004519 manufacturing process Methods 0.000 title claims abstract 7
- 239000002244 precipitate Substances 0.000 title claims abstract 7
- 230000009036 growth inhibition Effects 0.000 title claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract 3
- 239000012535 impurity Substances 0.000 claims abstract 3
- 229910052759 nickel Inorganic materials 0.000 claims abstract 3
- 239000002245 particle Substances 0.000 claims abstract 3
- 238000001556 precipitation Methods 0.000 claims abstract 3
- 229910052710 silicon Inorganic materials 0.000 claims abstract 3
- 239000010703 silicon Substances 0.000 claims abstract 3
- 206010053759 Growth retardation Diseases 0.000 claims abstract 2
- 238000000137 annealing Methods 0.000 claims abstract 2
- 230000002401 inhibitory effect Effects 0.000 claims 3
- 239000011777 magnesium Substances 0.000 claims 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229910017052 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- 238000004090 dissolution Methods 0.000 claims 1
- 230000006698 induction Effects 0.000 claims 1
- 229910052749 magnesium Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 claims 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims 1
- 230000000704 physical effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 3
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 2
- 238000005096 rolling process Methods 0.000 abstract 2
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 abstract 1
- 238000005266 casting Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
- B21B2003/005—Copper or its alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
본 발명은 Cu-Ni-Si계 동(Cu)합금에서 입자를 미세분산 석출되게 함과 함께 용체화 처리 공정 없이도 내연화성을 비롯한 우수한 기계적 및 물리적 특성을 갖는 고전도성 동합금과 그 제조방법에 관한 것으로, 니켈(Ni)0.5~4.0wt%, 실리콘(Si) 0.1~1.0wt%, 주석(Sn) 0.05-0.8wt%이고, 나머지는 동(Cu)가 불가피한 불순물로 되고, 석출입자가 0.5㎛이하인 석출물 성장 억제형 고강도, 고전도성 동합금으로 구성되며, 상기한 합금을 제조함에 있어서는 상기 조성이 되게 용해주조 후, 주괴를 면삭하여 냉간압연하고, 이를 450~520℃에서 5~12시간 석출처리 후 냉간압연하고 350~550℃ 및 90초 이하에서 인장소둔 하여서된 제조방법으로 이루어진 기술이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 온도에 따른 물리적 성질을 나타낸 그래프
Claims (5)
- 니켈(Ni)0.5~4.0wt%, 실리콘(Si) 0.1~1.0wt%, 주석(Sn) 0.05-0.8wt%이고, 나머지는 동(Cu)가 불가피한 불순물로 되고, 석출입자가 0.5㎛이하인것을 특징으로 하는 석출물 성장 억제형 고강도, 고전도성 동(Cu)합금.
- 제1항에 있어서, Ni 함량을 철(Fe) 또는 코발트(Co)로서 1중량%까지 대체함을 특징으로 하는 석출물 성장 억제형 고강도, 고전도성 동(Cu)합금.
- 중량%로서, 니켈(Ni)0.5~4.0wt%, 실리콘(Si) 0.1~1.0wt%, 주석(Sn) 0.05-0.8wt%이고, 나머지는 동(Cu)가 불가피한 불순물로 조성되게 용해, 주조하여 주괴를 얻고, 이 주괴를 면삭 후 냉간압연하고, 450~520℃에서 5~12시간 석출처리하여 냉간압연하고, 이어서 350~550℃ 및 90초 이하에서 인장소둔(Tension Annealing)함을 특징으로 하는 석출물 성장 억제형 고강도, 고전도성 동(Cu)합금의 제조방법.
- 제3항에 있어서, 용해시 탈산제로서 아연(Zn) 1중량% 이하, 인(P), 마그네슘(Mg), 지르코늄(Zr)을 각각 0.1중량%이하 첨가함을 특징으로 하는 석출물 성장 억제형 고강도, 고전도성 동(Cu)합금의 제조방법.
- 제3항에 있어서, 상기 제조 공정을 거친 합금의 석출물 입자가 0.5㎛이하인 것을 특징으로 하는 석출물 성장 억제형 고강도, 고전도성 동(Cu)합금의 제조방법.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950048017A KR0157257B1 (ko) | 1995-12-08 | 1995-12-08 | 석출물 성장 억제형 고강도, 고전도성 동합금 및 그 제조방법 |
DE19643378A DE19643378C5 (de) | 1995-12-08 | 1996-10-21 | Produkt aus einer Kupferlegierung und Verfahren zu dessen Herstellung |
US08/756,358 US5846346A (en) | 1995-12-08 | 1996-11-26 | High strength high conductivity Cu-alloy of precipitate growth suppression type and production process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950048017A KR0157257B1 (ko) | 1995-12-08 | 1995-12-08 | 석출물 성장 억제형 고강도, 고전도성 동합금 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970043210A true KR970043210A (ko) | 1997-07-26 |
KR0157257B1 KR0157257B1 (ko) | 1998-11-16 |
Family
ID=19438783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950048017A KR0157257B1 (ko) | 1995-12-08 | 1995-12-08 | 석출물 성장 억제형 고강도, 고전도성 동합금 및 그 제조방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5846346A (ko) |
KR (1) | KR0157257B1 (ko) |
DE (1) | DE19643378C5 (ko) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6251199B1 (en) | 1999-05-04 | 2001-06-26 | Olin Corporation | Copper alloy having improved resistance to cracking due to localized stress |
JP2000349085A (ja) * | 1999-06-01 | 2000-12-15 | Nec Corp | 半導体装置及び半導体装置の製造方法 |
JP3520034B2 (ja) * | 2000-07-25 | 2004-04-19 | 古河電気工業株式会社 | 電子電気機器部品用銅合金材 |
JP3520046B2 (ja) * | 2000-12-15 | 2004-04-19 | 古河電気工業株式会社 | 高強度銅合金 |
US7090732B2 (en) * | 2000-12-15 | 2006-08-15 | The Furukawa Electric, Co., Ltd. | High-mechanical strength copper alloy |
JP4177266B2 (ja) | 2002-03-12 | 2008-11-05 | 古河電気工業株式会社 | 耐応力緩和特性に優れた高強度高導電性銅合金線材 |
US7291231B2 (en) * | 2002-05-17 | 2007-11-06 | Metglas, Inc. | Copper-nickel-silicon two phase quench substrate |
US6764556B2 (en) | 2002-05-17 | 2004-07-20 | Shinya Myojin | Copper-nickel-silicon two phase quench substrate |
US7182823B2 (en) | 2002-07-05 | 2007-02-27 | Olin Corporation | Copper alloy containing cobalt, nickel and silicon |
US7291232B2 (en) * | 2003-09-23 | 2007-11-06 | Luvata Oy | Process for high strength, high conductivity copper alloy of Cu-Ni-Si group |
WO2006093140A1 (ja) * | 2005-02-28 | 2006-09-08 | The Furukawa Electric Co., Ltd. | 銅合金 |
DE102005031805A1 (de) * | 2005-07-07 | 2007-01-18 | Sms Demag Ag | Verfahren und Fertigungslinie zum Herstellen von Metallbändern aus Kupfer oder Kupferlegierungen |
JP5053242B2 (ja) * | 2007-11-30 | 2012-10-17 | 古河電気工業株式会社 | 銅合金材の製造方法及びその装置 |
KR101241735B1 (ko) | 2008-09-05 | 2013-03-08 | 엘지이노텍 주식회사 | 리드 프레임 및 그 제조방법 |
JP5657311B2 (ja) * | 2010-08-30 | 2015-01-21 | Dowaメタルテック株式会社 | 銅合金板材およびその製造方法 |
CN102041366B (zh) * | 2010-11-11 | 2012-12-26 | 中国计量学院 | 直接时效法制备高强高导Cu-Ni-Al导体材料 |
RU2484175C1 (ru) * | 2011-10-24 | 2013-06-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Уфимский государственный авиационный технический университет" | УЛЬТРАМЕЛКОЗЕРНИСТЫЙ МЕДНЫЙ СПЛАВ СИСТЕМЫ Cu-Cr И СПОСОБ ЕГО ПОЛУЧЕНИЯ |
CN102719698B (zh) * | 2012-06-21 | 2014-04-09 | 铜陵金威铜业有限公司 | 一种CuNiSiMg合金材料和其制备方法以及该合金材料制备带材的方法 |
RU2585606C1 (ru) * | 2014-11-28 | 2016-05-27 | Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский технологический университет "МИСиС" | Способ обработки низколегированных медных сплавов |
KR102590060B1 (ko) * | 2016-03-31 | 2023-10-18 | 도와 메탈테크 가부시키가이샤 | Cu-Ni-Si계 구리 합금 판재 및 제조법 |
KR102363597B1 (ko) * | 2018-03-13 | 2022-02-15 | 후루카와 덴키 고교 가부시키가이샤 | 구리 합금 판재 및 그 제조 방법 및 전기 전자기기용 방열 부품 및 실드 케이스 |
CN112214875B (zh) * | 2020-09-11 | 2022-03-22 | 东方电气集团东方汽轮机有限公司 | 一种通过沉淀颗粒相尺寸评估工件真实服役温度的方法 |
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US1658186A (en) * | 1925-02-21 | 1928-02-07 | Electro Metallurg Co | Copper alloy and process of producing and treating the same |
JPS5727051A (en) * | 1980-07-25 | 1982-02-13 | Nippon Telegr & Teleph Corp <Ntt> | Copper nickel tin alloy for integrated circuit conductor and its manufacture |
JPS6058783B2 (ja) * | 1982-01-20 | 1985-12-21 | 日本鉱業株式会社 | 半導体機器のリ−ド材用銅合金の製造方法 |
JPS6045698B2 (ja) * | 1982-01-20 | 1985-10-11 | 日本鉱業株式会社 | 半導体機器用リ−ド材 |
JPS58124254A (ja) * | 1982-01-20 | 1983-07-23 | Nippon Mining Co Ltd | 半導体機器のリ−ド材用銅合金 |
JPS599144A (ja) * | 1982-07-05 | 1984-01-18 | Furukawa Electric Co Ltd:The | 半導体機器のリ−ド材用銅合金 |
US4656003A (en) * | 1984-10-20 | 1987-04-07 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy and production of the same |
JPS6199647A (ja) * | 1984-10-20 | 1986-05-17 | Kobe Steel Ltd | 半導体用リ−ドフレ−ム材およびその製造法 |
US4728372A (en) * | 1985-04-26 | 1988-03-01 | Olin Corporation | Multipurpose copper alloys and processing therefor with moderate conductivity and high strength |
JP2714560B2 (ja) * | 1988-12-24 | 1998-02-16 | 日鉱金属株式会社 | ダイレクトボンディング性の良好な銅合金 |
JPH03188247A (ja) * | 1989-12-14 | 1991-08-16 | Nippon Mining Co Ltd | 曲げ加工性の良好な高強度高導電銅合金の製造方法 |
JP3275377B2 (ja) * | 1992-07-28 | 2002-04-15 | 三菱伸銅株式会社 | 微細組織を有する電気電子部品用Cu合金板材 |
-
1995
- 1995-12-08 KR KR1019950048017A patent/KR0157257B1/ko not_active IP Right Cessation
-
1996
- 1996-10-21 DE DE19643378A patent/DE19643378C5/de not_active Expired - Fee Related
- 1996-11-26 US US08/756,358 patent/US5846346A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5846346A (en) | 1998-12-08 |
DE19643378C5 (de) | 2010-12-16 |
DE19643378C2 (de) | 2003-07-24 |
DE19643378A1 (de) | 1997-06-12 |
KR0157257B1 (ko) | 1998-11-16 |
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