KR970043243A - 석출 경화형 동(Cu)합금의 제조방법 - Google Patents
석출 경화형 동(Cu)합금의 제조방법 Download PDFInfo
- Publication number
- KR970043243A KR970043243A KR1019950048018A KR19950048018A KR970043243A KR 970043243 A KR970043243 A KR 970043243A KR 1019950048018 A KR1019950048018 A KR 1019950048018A KR 19950048018 A KR19950048018 A KR 19950048018A KR 970043243 A KR970043243 A KR 970043243A
- Authority
- KR
- South Korea
- Prior art keywords
- alloy
- copper
- precipitation hardening
- cast
- manufacturing
- Prior art date
Links
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 10
- 239000000956 alloy Substances 0.000 title claims abstract description 10
- 239000010949 copper Substances 0.000 title claims abstract 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract 5
- 229910052802 copper Inorganic materials 0.000 title claims abstract 5
- 238000004519 manufacturing process Methods 0.000 title claims abstract 4
- 238000004881 precipitation hardening Methods 0.000 title abstract description 4
- 239000000203 mixture Substances 0.000 claims abstract 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract 3
- 238000000034 method Methods 0.000 claims abstract 3
- 229910052749 magnesium Inorganic materials 0.000 claims abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 3
- 229910001208 Crucible steel Inorganic materials 0.000 claims 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 2
- 239000012535 impurity Substances 0.000 claims 2
- 239000011777 magnesium Substances 0.000 claims 2
- 239000011574 phosphorus Substances 0.000 claims 2
- 229910052698 phosphorus Inorganic materials 0.000 claims 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims 1
- 229910006367 Si—P Inorganic materials 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 abstract 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D21/00—Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedure; Selection of compositions therefor
- B22D21/02—Casting exceedingly oxidisable non-ferrous metals, e.g. in inert atmosphere
- B22D21/025—Casting heavy metals with high melting point, i.e. 1000 - 1600 degrees C, e.g. Co 1490 degrees C, Ni 1450 degrees C, Mn 1240 degrees C, Cu 1083 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
- B21B2003/005—Copper or its alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
본 발명은 석출경화형 도합금의 제조시 용체화 처리 공정 없이도 우수한 전기전도도 및 기계적 성질을 갖는 동합금의 제조에 관한 것으로, Cu-Ni-Si-P또는 여기에 Mg를 첨가한 합금 조성이 되게 용해하거나, Cu-Fe-P-Zn계 합금조성이 되게 용해하고, 주조하여 얇은 두께를 갖는 주편을 얻고, 이 주편을 냉간가공 하고, 450-520℃온도에서 4-12시간 시효처리 하는 전기, 전자 부품용의 석출 경화형동(Cu)합금의 제조에 관한 기술이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 석출 경화형 합금의 일반적인 상태도,
제2도는 종래의 방법으로 제조된 Cu-Ni-Si-P-Mg 합금의 석출 처리후의 현미경 사진
Claims (2)
- 중량비로서, 니켈(Ni)0.05-3.0%, 실리콘(Si)0.01-1.0%, 인(P)0.01-0.16%로 조성하거나 여기에 마그네슘(Mg)0.02-0.2%첨가되고, 나머지는 동(Cu)과 불가피한 불순물로된 동합금에 있어서, 상기 합금의 조성이 되게 용해, 주조하여 30㎜이하의 두께를 갖는 주편을 얻고, 이 주편을 냉간압연하고, 450-540℃온도에서 4-12시간 시효처리 함을 특징으로 하는 전기, 전자 부품용의 석출 경화형동(Cu)합금의 제조 방법.
- 중량비로서, 철(Fe)1.5-3.0%, 인(P)0.01-0.5%, 아연(Zn)0.01-0.5%,이고 나머지는 동(Cu)과 불가피한 불순물로된 동합금에 있어서, 상기 합금의 조성이 되게 용해, 주조하여 30㎜이하의 두께를 갖는 주편을 얻고, 이 주편을 냉간압연하고, 450-540℃온도에서 4-12시간 시효처리 함을 특징으로 하는 전기, 전자 부품용의 석출 경화형동(Cu)합금의 제조 방법.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950048018A KR0157258B1 (ko) | 1995-12-08 | 1995-12-08 | 석출 경화형 동합금의 제조방법 |
DE19643379A DE19643379C5 (de) | 1995-12-08 | 1996-10-21 | Verfahren zum Herstellen und Weiterverarbeiten einer Kupferlegierung |
JP8311041A JPH09176808A (ja) | 1995-12-08 | 1996-11-21 | 析出硬化形の銅合金の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950048018A KR0157258B1 (ko) | 1995-12-08 | 1995-12-08 | 석출 경화형 동합금의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970043243A true KR970043243A (ko) | 1997-07-26 |
KR0157258B1 KR0157258B1 (ko) | 1998-11-16 |
Family
ID=19438785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950048018A KR0157258B1 (ko) | 1995-12-08 | 1995-12-08 | 석출 경화형 동합금의 제조방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPH09176808A (ko) |
KR (1) | KR0157258B1 (ko) |
DE (1) | DE19643379C5 (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2751990B1 (fr) * | 1996-07-30 | 1998-10-02 | Griset Ets | Alliage a base de cuivre a conductivite electrique et a temperature d'adoucissement elevees pour des applications dans l'electronique |
WO2010140915A1 (ru) * | 2009-06-04 | 2010-12-09 | Kostln Sergei Alekseevich | Способ получения дисперсионно твердеющего низколегированного сплава на медной основе и способ производства из него металлопродукции |
DE102010056146A1 (de) * | 2010-12-20 | 2012-06-21 | Kienle + Spiess Gmbh | Verfahren zur Herstellung von Produkten, die Kupfer oder Kupferlegierung aufweisen, für elektrische Anwendungen |
KR101472348B1 (ko) * | 2012-11-09 | 2014-12-15 | 주식회사 풍산 | 전기전자 부품용 동합금재 및 그의 제조 방법 |
US11965398B2 (en) * | 2019-06-27 | 2024-04-23 | Schlumberger Technology Corporation | Wear resistant self-lubricating additive manufacturing parts and part features |
CN114981459A (zh) * | 2020-12-23 | 2022-08-30 | 韩国材料研究院 | 包含g相的铜-镍-硅-锰合金及其制备方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3522112A (en) * | 1967-06-26 | 1970-07-28 | Olin Corp | Process for treating copper base alloy |
DE3417273C2 (de) * | 1984-05-10 | 1995-07-20 | Poong San Metal Corp | Kupfer-Nickel-Legierung für elektrisch leitendes Material für integrierte Schaltkreise |
US4594221A (en) * | 1985-04-26 | 1986-06-10 | Olin Corporation | Multipurpose copper alloys with moderate conductivity and high strength |
US4728372A (en) * | 1985-04-26 | 1988-03-01 | Olin Corporation | Multipurpose copper alloys and processing therefor with moderate conductivity and high strength |
DE4126079C2 (de) * | 1991-08-07 | 1995-10-12 | Wieland Werke Ag | Bandgießverfahren für ausscheidungsbildende und/oder spannungsempfindliche und/oder seigerungsanfällige Kupferlegierungen |
-
1995
- 1995-12-08 KR KR1019950048018A patent/KR0157258B1/ko not_active IP Right Cessation
-
1996
- 1996-10-21 DE DE19643379A patent/DE19643379C5/de not_active Expired - Fee Related
- 1996-11-21 JP JP8311041A patent/JPH09176808A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE19643379C5 (de) | 2004-09-23 |
DE19643379C2 (de) | 1998-11-19 |
DE19643379A1 (de) | 1997-06-12 |
KR0157258B1 (ko) | 1998-11-16 |
JPH09176808A (ja) | 1997-07-08 |
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