KR970024035A - 더미볼을 이용한 비지에이(bga) 패키지 및 그 보수방법 - Google Patents

더미볼을 이용한 비지에이(bga) 패키지 및 그 보수방법 Download PDF

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KR970024035A
KR970024035A KR1019950036169A KR19950036169A KR970024035A KR 970024035 A KR970024035 A KR 970024035A KR 1019950036169 A KR1019950036169 A KR 1019950036169A KR 19950036169 A KR19950036169 A KR 19950036169A KR 970024035 A KR970024035 A KR 970024035A
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ball
dummy
bga package
solder
active
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KR1019950036169A
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KR0157906B1 (ko
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김영곤
김동유
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문정환
엘지반도체 주식회사
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Priority to KR1019950036169A priority Critical patent/KR0157906B1/ko
Priority to JP8002707A priority patent/JP2802605B2/ja
Priority to US08/636,441 priority patent/US5748450A/en
Publication of KR970024035A publication Critical patent/KR970024035A/ko
Priority to US09/025,110 priority patent/US6010058A/en
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Publication of KR0157906B1 publication Critical patent/KR0157906B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

본 발명은 BGA 패키지에서 도전성볼 대신에 전기적으로 연결되는 액티브볼과 전기적으로 연결되지 않은 더미볼을 배설함에 있어서, 액티브볼이 상기 더미볼에 대하여 90℃의 간격을 두고 방사상에 위치시킨 더미볼을 구비한 BGA 패키지에 관한 것이다. 이와 같이 구성된 BGA 패키지는 솔더 조인트부분에 불량이 발생할 경우, 첵커(checker)에 의해 결함이 있는 액티브볼을 찾는 단계와, 액티브볼과, 액티브볼의 주변에 있는 더미볼의 중간부에 해당되는 인쇄회로기판의 소정부위에 보수용 구멍을 형성시키는 단계와, 보수용 구멍에 솔더 페이스트 주입기를 삽입시킨 후, 솔더를 주사시키는 단계와, 더미볼과 액티브볼의 패드 익스텐션이 각기 솔더로 상호 연결시키는 단계를 거쳐서 용이하게 패키지를 보수할 수 있다. 그러므로, 본 발명에 따른 더미볼을 구비한 BGA 패키지는 전체공 정을 줄일 수 있고 아울러 재작업에 따른 낮은 신뢰도를 회피할 수 있는 장점이 있다.

Description

더미볼을 이용한 비지에이(BGA) 패키지 및 그 보수방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명의 일실시예에 따른 더미볼을 구비한 BGA 패키지가 부품실장을 위한 인쇄회로기판에 부착된 상태를 나타낸 단면도.

Claims (6)

  1. EMC의 하면으로 전기적 연결단자가 노출된 반도체 패키지와, 복수개의 도전성볼을 구비하며 상기 도전성볼의 상면이 반도체 패키지와 전기적으로 연결되는 절연필름과, 복수개의 패드를 가지며 상기 솔더볼의 하면과 전기적으로 연결된 인쇄회로기판을 구비한 비지에이(BGA) 패키지에 있어서, 상기 도전성볼중 전기적으로 연결될 필요가 없는 더미볼은, 전기적으로 연결되며 더미볼의 주위에 90℃의 간격을 두고 방사상으로 배치된 액티브볼의 중앙에 배설되는 것을 특징으로 하는 더미볼을 구비한 비지에이(BGA) 패키지.
  2. 제 1 항에 있어서, 상기 액티브 볼 및 더미볼이 연결될 회로 패턴에는 그 일측에 각기 보수용 패드 익스텐션이 상호 대향되게 각기 설치되는 것을 특징으로 하는 더미볼을 구비한 비지에이(BGA) 패키지.
  3. 제 1 항에 있어서, 상기 더미볼은 그 설치위치에 신호나 파워 패턴이 형성되지 않는 것을 특징으로 하는 더미볼을 구비한 비지에이(BGA) 패키지.
  4. 더미볼을 구비한 비지에이(BGA) 패키지의 보수방법에 있어서, 첵커(checker)에 의해 결함이 있는 액티브볼을 찾는 단계와, 상기 액티브볼과, 상기 액티브볼의 주변에 있는 더미볼의 중간부에 해당되는 인쇄회로기판의 소정부위에 보수용 구멍을 형성시키는 단계와, 상기 보수용 구멍에 솔더 페이스트 주입기를 삽입시킨 후, 솔더를 주사시키는 단계와, 상기 더미볼과 액티브볼의 패드 익스텐션이 각기 솔더로 상호 연결시키는 단계로 구성되는 것을 특징으로 하는 비지에이(BGA) 패키지의 보수방법.
  5. 제 4 항에 있어서, 상기 보수용 구멍을 형성시키는 단계에서, 인쇄회로기판은 상부나 하부중의 어느 한쪽 또는 양쪽으로 뚫어서 보수하는 것을 특징으로 하는 비지에이(BGA) 패키지의 보수방법.
  6. 제 4 항에 있어서, 상기 솔더를 주입하는 단계에서 솔더 페이스트 주입기는 그 주입방향이 결함이 있는 액티브볼을 향하여 설치되는 것을 특징으로 하는 비지에이(BGA) 패키지의 보수방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950036169A 1995-10-19 1995-10-19 더미볼을 이용한 비지에이 패키지 및 그 보수방법 KR0157906B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019950036169A KR0157906B1 (ko) 1995-10-19 1995-10-19 더미볼을 이용한 비지에이 패키지 및 그 보수방법
JP8002707A JP2802605B2 (ja) 1995-10-19 1996-01-11 ダミーボールを用いたｂｇａ半導体パッケージ及びその補修方法
US08/636,441 US5748450A (en) 1995-10-19 1996-04-23 BGA package using a dummy ball and a repairing method thereof
US09/025,110 US6010058A (en) 1995-10-19 1998-02-17 BGA package using a dummy ball and a repairing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950036169A KR0157906B1 (ko) 1995-10-19 1995-10-19 더미볼을 이용한 비지에이 패키지 및 그 보수방법

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KR970024035A true KR970024035A (ko) 1997-05-30
KR0157906B1 KR0157906B1 (ko) 1998-12-01

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100349561B1 (ko) * 1998-08-11 2002-08-21 후지쯔 가부시끼가이샤 Ｌｓｉ 패키지 및 그 인너리드 배선방법
KR100541397B1 (ko) * 1998-06-25 2006-05-09 삼성전자주식회사 절연된 더미 솔더 볼을 갖는 비지에이 패키지

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990025708A (ko) * 1997-09-13 1999-04-06 윤종용 인쇄회로기판의 랜드패턴
JP4311774B2 (ja) * 1998-03-11 2009-08-12 富士通株式会社 電子部品パッケージおよびプリント配線板
KR100339020B1 (ko) 1999-08-02 2002-05-31 윤종용 반도체칩 패키징 시스템 및 이를 이용한 반도체칩 패키징 방법
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