WO2016119118A1 - 一种电子模块返修方法 - Google Patents

一种电子模块返修方法 Download PDF

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Publication number
WO2016119118A1
WO2016119118A1 PCT/CN2015/071612 CN2015071612W WO2016119118A1 WO 2016119118 A1 WO2016119118 A1 WO 2016119118A1 CN 2015071612 W CN2015071612 W CN 2015071612W WO 2016119118 A1 WO2016119118 A1 WO 2016119118A1
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WO
WIPO (PCT)
Prior art keywords
electronic module
bottom plate
suction device
repairing method
module
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PCT/CN2015/071612
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English (en)
French (fr)
Inventor
薛飞
马富强
丁海幸
陈晓晨
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201580001964.0A priority Critical patent/CN106165552B/zh
Priority to PCT/CN2015/071612 priority patent/WO2016119118A1/zh
Publication of WO2016119118A1 publication Critical patent/WO2016119118A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Definitions

  • the present invention relates to the field of electronic module maintenance, and in particular, to an electronic module repair method.
  • the LGA (Land Grid Array) module is a common wireless communication electronic module. Due to its low cost and easy development and upgrade advantages, it is increasingly used in some functional module products. When the LGA module fails and needs to be repaired and reworked, the LGA module needs to be heated to re-melt the solder joint between the LGA module and the backplane to disassemble the LGA module.
  • some large-sized, especially LGA modules with shields have been difficult to repair, because at high temperatures, the solder joints of the shields melt, and the solder joints in the molten state are insufficient for support.
  • the PCB (printed circuit board) board of the LGA module and the devices on the PCB board separate the shield from the PCB of the LGA module. Therefore, in the high temperature state, if the shield is used as the suction surface, the shield can be easily separated from the PCB of the LGA module, and the PCB of the LGA module cannot be removed.
  • the LGA module fails and needs to be replaced and repaired, the LGA module is mainly heated by a BGA (Land Grid Array) machine. After the solder joint of the LGA module is melted, the operator relies on manual use. The tweezers pick up the LGA module for repair, and then clean the backplane to mount the fully functional LGA module.
  • the above-mentioned manual use of tweezers to pick up the LGA module mainly has the following drawbacks:
  • the heating head is lifted, and the solder joint of the LGA module rapidly changes from a molten state to a solidified state. Therefore, the operator is usually required to remove the LGA module to be repaired with the tweezers in a ten-second period. The operation time is short, and if the operator moves slightly or hesitates, the disassembly will fail.
  • the gripping force of the operator cannot be precisely controlled. If the force is too large, the LGA module may be deformed and damaged. The LGA module that has been removed cannot be recycled and analyzed. If the force is too small, it cannot be The LGA module is removed.
  • the LGA module must be repeatedly heated, and the board is heated 2 to 3 times, and the pad is easily detached, resulting in damage to the disassembled LGA module.
  • the technical problem to be solved by the present invention is to provide a method for repairing an electronic module, which can not only realize automatic disassembly of the electronic module, but also reduce secondary damage or scrappage caused by manual operation, and also ensure that the entire electronic module is in a state of melting tin. It was successfully dismantled.
  • the present invention provides an electronic module rework method for reworking a failed electronic module.
  • the electronic module is soldered to the first backplane and includes a second backplane and a pick-up device soldered to the second backplane.
  • the electronic module rework method includes the steps of: fixedly connecting the suction device to the second bottom plate such that solder between the suction device and the second bottom plate is in a molten state, the suction device Still being integrally fixed with the second bottom plate; heating the electronic module to melt the solder between the electronic module and the first bottom plate; and the rework machine sucking the suction device of the electronic module a surface, the electronic module is detached from the first bottom plate to facilitate rework or replacement of the electronic module.
  • the step of “fixably connecting the suction device to the second bottom plate” includes: the suction device and the second bottom plate A heat curing glue is placed between them.
  • the The step of fixedly connecting the device to the second backplane includes: providing a plurality of escape holes on the first bottom plate; setting a plurality of pins on an edge of the pick-up device, and setting a plurality of respectively on the second bottom plate a through hole communicating with the plurality of escape holes; respectively passing the plurality of pins through the plurality of through holes; and bending the plurality of pins to buckle the second bottom plate, and The bent portions of the plurality of pins are respectively received in the plurality of escape holes.
  • the step of “fixably connecting the suction device to the second bottom plate” includes: setting a plurality of avoidances on the first bottom plate And a plurality of buckles respectively pass through the escape groove, one end of the plurality of buckles abuts against the second bottom plate, and the other end of the plurality of buckles abuts against the suction device. Thereby the second bottom plate and the suction device are clamped between the two ends of the plurality of buckles.
  • the plurality of buckles are U-shaped.
  • the electronic module rework method further includes: cleaning a pad of the first bottom plate; and soldering a functional electronic module to the first On a bottom plate.
  • the electronic module is Contact grid array module.
  • the pick-up device is Metal shield.
  • the ball grid array is used for rework
  • the machine draws the electronic module.
  • the electronic module is a contact grid array module.
  • the electronic module repairing method provided by the present invention when the electronic module soldered on the first bottom plate fails to be repaired, since the suction device of the electronic module and the second bottom plate are still fixed in a heated state, Even in the high temperature state, the solder between the suction device and the second substrate melts, and the suction device of the electronic module and the second substrate can remain intact to ensure that the electronic module is completely removed. It can be seen that the electronic module repairing method provided by the present invention automatically removes the electronic module in a high temperature state by using the rework machine, thereby avoiding manual operation, not only realizing automatic disassembly of the electronic module, but also avoiding manual operation. The secondary damage caused by the second module improves the maintenance rate of the electronic module and greatly avoids the occurrence of operator injury.
  • FIG. 1 is a schematic diagram of an electronic module rework fixing structure provided by a first embodiment of the present invention
  • FIG. 2 is a schematic exploded view of a rework repair structure of an electronic module according to a second embodiment of the present invention
  • FIG. 3 is a bottom view of the electronic module rework fixing structure of FIG. 2;
  • Figure 4 is an enlarged schematic view of a portion IV of the circle of Figure 3;
  • FIG. 5 is a schematic diagram of assembly of an electronic module rework fixing structure according to a third embodiment of the present invention.
  • Figure 6 is a bottom view of the electronic rework fixing structure of Figure 5;
  • FIG. 7 is a schematic flow chart of a method for repairing an electronic module provided by the present invention.
  • an electronic module rework fixing structure provided by the embodiment of the present invention includes a first bottom plate 200 and an electronic module 100 soldered on the first bottom plate 200 .
  • the electronic module 100 includes a second bottom plate 10 and a suction device 20 soldered to the second bottom plate 10.
  • the suction device 20 and the second bottom plate 10 are in a fixed state in a heated state.
  • the solder between the electronic template 100 and the first substrate 200 and the solder between the suction device 10 and the second substrate 10 of the electronic module 100 are generally in a molten state.
  • the suction device 20 and the second bottom plate 10 are fixed in a heated state.
  • the entire electronic module 100 can be detached from the first bottom plate 200 by simply sucking the surface of the suction device 20.
  • the electronic module 100 may be an LGA (Land Grid Array) module, and the first backplane 200 and the second backplane 10 may both be PCBs (Printed circuit). Board, printed circuit board). A plurality of electronic components (not shown) are mounted on the first bottom plate 200 and the second bottom plate 10.
  • LGA Land Grid Array
  • PCBs PCBs
  • a plurality of electronic components are mounted on the first bottom plate 200 and the second bottom plate 10.
  • the pick-up device 20 can be a metal shield for shielding the electronic components on the electronic module 100 to achieve electromagnetic shielding of the electronic module 100.
  • the pick-up device 20 can also be other components having a suction surface that are soldered to the second substrate 10, such as heat sink devices.
  • the rework machine can be a BGA (Ball Grid Array) rework machine.
  • the repair machine heats the electronic module 100 to melt the solder between the electronic module 100 and the first bottom plate 200, so as to be The electronic module 100 is detached from the first bottom plate 200.
  • Solder between the pick-up device 20 of the electronic module 100 and the second backplane 10 when the electronic module 100 is heated Melting also occurs at high temperatures.
  • the suction device 20 of the electronic module 100 and the second substrate 10 are fixed in a heated state, the solder between the suction device 20 and the second substrate 10 is melted even in a high temperature state, the electrons
  • the pick-up device 20 of the module 100 and the second backplane 10 can remain fixed to ensure that the electronic module 100 can be completely removed by the rework machine.
  • the present invention automatically removes the electronic module 100 in a heated state by using a rework machine, thereby avoiding manual operation, not only realizing automatic disassembly of the electronic module 100, but also avoiding secondary damage caused by manual operation and improving
  • the maintenance yield of the electronic module 100 is greatly avoided, and the occurrence of an operator injury accident is greatly avoided.
  • a heat curing adhesive 30 is disposed between the suction device 20 and the second bottom plate 10 .
  • the heat curing adhesive 30 is a colloid which is cured after heating. When the heat curing adhesive 30 is heated and reaches the freezing point temperature, the heat curing adhesive 30 is directly turned into a solid by the paste. In the embodiment, the heat curing adhesive 30 is red rubber, yellow rubber or the like. The heat curing adhesive 30 allows the suction device 20 and the second bottom plate 10 to be firmly bonded together in a heated state.
  • the rework machine heats the electronic module 100 to melt the solder joint between the electronic module 100 and the first bottom plate 200, the soldering between the suction device 20 and the second bottom plate 10 Melting also occurs at the point, and at this time, the heat curing adhesive 30 is cured in a heated state to fix the suction device 20 and the second bottom plate 10 together.
  • the rework machine sucks the surface of the suction device 20, since the suction device 20 and the second bottom plate 10 are still fixed in a high temperature state, the rework machine can disassemble the entire electronic module 100 together. .
  • the first bottom plate 200 is provided with a plurality of escape holes 210
  • the second bottom plate 10 is provided with a plurality of respectively
  • the through hole 11 through which the hole 210 communicates is avoided
  • the suction device 20 is provided with a plurality of pins 21.
  • the plurality of pins 21 respectively pass through the plurality of through holes 11 and are bent, and the plurality of pins 21 are fastened to the second bottom plate 10, as shown in FIG. 4 Shown.
  • the plurality of pins 21 of the pick-up device 20 respectively pass through the plurality of through holes 11.
  • the pin 21 protruding from the suction device 20 may be slightly bent and fastened to the bottom of the second bottom plate 10 by using a tweezers, so that the plurality of pins 21 are folded. The bent portions are respectively received in the escape holes 210.
  • a plurality of pins 21 projecting from the suction device 20 may also be bent by the machine or other bending process equipment to buckle the bottom of the second bottom plate 10.
  • the plurality of pins 21 protruding from the suction device 20 may also be bent to fix the suction device 20 and the second bottom plate 10 before rework, for example, during assembly.
  • the rework machine heats the electronic module 100 to melt the solder joint between the electronic module 100 and the first bottom plate 200, the soldering between the suction device 20 and the second bottom plate 10 The point also melts.
  • the rework machine sucks the surface of the suction device 20, since the plurality of pins 21 of the suction device 20 are fastened to the second bottom plate 10, the suction device 20 and the second bottom plate 10 are fixed together. The rework machine can disassemble the entire electronic module 100 together.
  • the plurality of escape holes 210 are NPTH (Non Planting Though Hole), and the plurality of escape holes 210 are sized to freely bend the plurality of pins 21 and The extent to which the second bottom plate 10 is directly buckled.
  • each of the edges of the pick-up device 20 is provided with three pins 21, and correspondingly, the number of the avoidance holes 210 provided on each side of the first bottom plate 200 is three, and the second bottom plate 10 is provided. The number of through holes 11 provided at one side is also three. In other embodiments, each edge of the pick-up device 20 may also set the number of the pins 21 according to the size of the pick-up device 20, for example, 2, 4, or the like.
  • the electronic module repairing and fixing structure further includes a plurality of buckles 40, and the first bottom plate 200 is provided with a plurality of escape grooves 220.
  • the plurality of buckles 40 respectively pass through the escape groove 220, and one of the plurality of buckles 40 The other end of the plurality of buckles 40 abuts against the surface of the suction device 20 such that the second bottom plate 10 and the suction device 20 are clamped to the second bottom plate 10 Between the two ends of the plurality of buckles 40.
  • the suction device 20 and the second bottom plate 10 are fixed together by a buckle 40.
  • the rework machine heats the electronic module 100 to melt the solder joint between the electronic module 100 and the first bottom plate 200, since the suction device 20 and the second bottom plate 10 pass The buckle 40 is fixedly integrated.
  • the rework machine sucks the surface of the suction device 20, even if the solder joint between the suction device 20 and the second bottom plate 10 is melted, the entire electronic module 100 can be disassembled together. Come down.
  • the number of the relief grooves 220 may be three on each side of the first bottom plate 200. Accordingly, the number of the buckles 40 used on each side of the first bottom plate 200 may also be three. In other embodiments, the number of the avoidance slots 220 may be set according to the size of the electronic module 100, for example, two or four other numbers.
  • the buckle 40 has a U shape, and the buckle 40 is optionally made of an elastic material. In other embodiments, the shape of the buckle 40 can also be designed according to actual needs.
  • the present invention also provides an electronic module rework method for reworking a failed electronic module 100.
  • the electronic module repair method includes the following steps.
  • step S100 the suction device 20 of the electronic module 100 is fixedly connected to the second bottom plate 10, so that the solder between the suction device 20 and the second bottom plate 10 is in a molten state.
  • the suction device 20 and the second bottom plate 10 are still fixed in one body.
  • step S100 is to heat the curing adhesive 30 between the suction device 20 and the second bottom plate 10.
  • the heat curing adhesive 30 is applied between the edge of the suction device 20 and the second bottom plate 10, as shown in FIG.
  • the rework machine heats the electronic module 100 to melt the solder joint between the electronic module 100 and the first bottom plate 200, the soldering between the suction device 20 and the second bottom plate 10 Melting occurs at the point, and at this time, the heat curing adhesive
  • the curing in the heated state 30 fixes the suction device 20 and the second bottom plate 10 together.
  • the heat curing adhesive 30 is red plastic. In other embodiments, the heat curing adhesive 30 may also be yellow glue.
  • step S100 includes the following four steps, namely, steps 1 to 4.
  • a plurality of escape holes 210 are disposed on the first bottom plate 200.
  • the relief hole 210 is an NPTH (Non Planting Though Hole), and the relief hole 210 is sized to freely bend the pin 21 and directly buckle the second hole. The extent of the bottom plate 10.
  • step 2 a plurality of pins 21 are disposed on the edge of the pick-up device 20, and a plurality of through holes 11 respectively communicating with the plurality of escape holes 210 are disposed on the second bottom plate 10.
  • step 3 the pins 21 are respectively passed through the through holes 11.
  • Step 4 the plurality of pins 21 are bent to buckle the second bottom plate 10, and the bent portions of the plurality of pins 21 are respectively received in the escape hole 210, so that the suction device 20 is fixed to the second bottom plate 10 integrally.
  • the pin 21 extending from the suction device 20 is bent and fastened to the bottom of the second bottom plate 10 by using a tweezers.
  • a machine or other bending process device bends the pins 21 of the suction device 20 to buckle the bottom of the second bottom plate 10.
  • the pin 21 extending from the pick-up device 20 may also be bent to fix the pick-up device 20 to the second bottom plate 10 prior to rework, such as during assembly.
  • step S100 includes the following two steps, namely, step 1' and step 2'.
  • a plurality of escape grooves 220 are provided on the first bottom plate 200.
  • the plurality of buckles 40 are inserted into the escape groove 220 , and one end of the plurality of buckles 40 is abutted against the second bottom plate 10 , and the other end of the buckle 40 is abutted against the The device 20 is aspirated. That is The second bottom plate 10 and the suction device 20 are clamped between the two ends of the plurality of buckles 40 to fix the suction device 20 and the second bottom plate 10 integrally.
  • the plurality of buckles 40 are all U-shaped.
  • step S110 the electronic module 100 is subjected to a heat treatment to melt the solder between the electronic module 100 and the first bottom plate 200 .
  • the rework machine selects a suitable nozzle and nozzle according to the set program, and heats the electronic module 100.
  • the solder between the suction device 20 and the second substrate 10 also melts.
  • step S120 the rework machine sucks the surface of the suction device 20 of the electronic module 100, and detaches the entire electronic module 100 from the first bottom plate 200 to facilitate rework or replacement of the electronic module 100.
  • the nozzle of the rework machine sucks the surface of the suction device 20 of the electronic module 100 according to the set program, because the suction device 20 and the second bottom plate 10 are fixed together. Therefore, even if the solder between the suction device 20 and the second bottom plate 10 is in a molten state, the rework machine can completely disassemble the electronic module 100. The maintenance personnel can repair the disassembled electronic module 100 that has failed to achieve the purpose of secondary utilization.
  • the electronic module repairing method provided by the present invention further includes step S130 and step S140.
  • step S130 the pads of the first substrate 200 are cleaned, and a conductive material is printed on the first substrate 200.
  • the conductive material is a solder paste.
  • step S140 a fully functional electronic module 100 is soldered to the first backplane 200, thereby achieving the purpose of replacing the failed electronic module 100.
  • whether the functionally complete electronic module 100 needs to be reinstalled on the first backplane 200 may be determined according to actual requirements, thereby omitting steps S130 and S140.
  • the electronic module repair method provided by the present invention the pick-up device 20 and the The second bottom plate 10 is still fixed in the molten state, and the surface of the suction device 20 is automatically sucked at a high temperature by the rework machine to achieve the purpose of smoothly disassembling the entire electronic module 100.
  • the electronic module repairing method provided by the invention automatically removes the electronic module 100 by using the rework machine, which greatly reduces the low repair yield caused by the operation error caused by the manual operation, and reduces the number of scraps of the electronic module 100. At the same time, there is no need for the operator to contact the faulty product at high temperature, which greatly reduces the occurrence of work-related accidents caused by high temperature.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本发明公开一种电子模块返修方法，用于返修出现故障的电子模块。电子模块返修方法包括以下步骤：将吸取器件与第二底板固定连接，从而使所述吸取器件与所述第二底板之间的焊锡在熔融的状态下，所述吸取器件与所述第二底板仍固定于一体；对电子模块进行加热处理，使电子模块与第一底板之间的焊锡融化；返修机台吸取电子模块的吸取器件的表面，将电子模块从第一底板上拆卸下来以利于返修或更换电子模块。本发明提供的电子模块返修方法，由于电子模块的吸取器件与第二底板在加热状态下是固定的，即使在高温状态下，吸取器件与第二底板之间的焊点发生熔融，电子模块的吸取器件与第二底板仍然可以保持完整一体，保证电子模块被完整地拆卸下来。

Description

一种电子模块返修方法 技术领域
本发明涉及电子模块维修领域，尤其涉及一种电子模块返修方法。
背景技术
LGA(Land Grid Array,接点栅格阵列)模块是一种常见的无线通信电子模块，因其低成本及容易实现开发升级的优势，越来越多地被应用在一些功能模块产品上。当LGA模块出现故障需要拆卸返修时，则需对LGA模块加热使LGA模块与底板之间的焊点处于重融状态，以便拆卸LGA模块。但是，一些大尺寸的，特别是带屏蔽罩的LGA模块的返修一直存在较大的困难，原因在于，在高温状态下，屏蔽罩的焊点发生熔融，熔融状态下的焊点拉力不足于支撑LGA模块的PCB(printed circuit board,印刷电路板)板及PCB板上的器件而使屏蔽罩与LGA模块的PCB板分离。因此，在高温的状态下，若将屏蔽罩作为吸取面，则很容易导致屏蔽罩与LGA模块的PCB板分离，从而无法将LGA模块的PCB板拆卸下来。
现有技术中，当LGA模块出现故障需要更换维修时，主要靠BGA(Land Grid Array，球栅阵列)机台对LGA模块加热，待LGA模块的焊点融锡后，由操作员依靠手工采用镊子夹取LGA模块返修，然后再对底板进行清理后贴装功能完整的LGA模块。上述人工采用镊子夹取LGA模块的方式主要存在以下缺陷：
1、BGA机台对LGA模块加热融锡后，加热头抬升，LGA模块的焊点迅速由熔融状态变成凝固状态。因此，要求操作员通常要在十几秒的时间内将欲返修的LGA模块用镊子夹取下来，操作时间短，操作员动作若稍有迟缓或犹豫，则会造成拆卸失败。
2、操作员的夹取力度也无法精确控制，若力度太大，则容易造成LGA模块变形损坏，对拆卸下来的LGA模块无法进行二次回收利用及故障分析，若力度太小，则无法将LGA模块拆卸下来。
3、如果操作员无法在规定的时间内将LGA模块拆卸下来，则必须重复加热所述LGA模块，单板加热2～3次，焊盘就容易脱落，从而导致拆卸下来的LGA模块损坏报废。
4、此种人工操作方式，很容易造成烫伤等工伤事故的发生，操作员的安全无法保证。
发明内容
本发明所要解决的技术问题在于提供一种电子模块返修方法，不仅能实现电子模块的自动拆卸，减少人工操作造成的二次损坏或报废，而且还可以确保在融锡的状态下，整个电子模块被顺利拆卸下来。
为了实现上述目的，本发明实施方式提供如下技术方案。
第一方面，本发明提供了一种电子模块返修方法，用于返修出现故障的电子模块。所述电子模块焊接在第一底板上，且包括第二底板及焊接在所述第二底板上的吸取器件。所述电子模块返修方法包括以下步骤：将所述吸取器件与所述第二底板固定连接，从而使所述吸取器件与所述第二底板之间的焊锡在熔融的状态下，所述吸取器件与所述第二底板仍固定于一体；对所述电子模块进行加热处理，使所述电子模块与所述第一底板之间的焊锡融化；及返修机台吸取所述电子模块的吸取器件的表面，将所述电子模块从所述第一底板上拆卸下来，以利于返修或更换所述电子模块。
结合第一方面，在第一方面第一种可能的实现方式中，所述“将所述吸取器件与所述第二底板固定连接”的步骤包括：在所述吸取器件与所述第二底板之间设置加热固化胶。
结合第一方面，在第一方面第二种可能的实施方式中，所述“将所述吸取 器件与所述第二底板固定连接”的步骤包括：在所述第一底板上设置多个避让孔；在所述吸取器件的边缘设置多个引脚，所述第二底板上设置多个分别与所述多个避让孔相通的通孔；将所述多个引脚分别穿过所述多个通孔；及将所述多个引脚折弯以扣住所述第二底板，且所述多个引脚的折弯部分分别收容在所述多个避让孔内。
结合第一方面，在第一方面第三种可能的实施方式中，所述“将所述吸取器件与所述第二底板固定连接”的步骤包括:在所述第一底板上设置多个避让槽；及将多个卡扣分别穿过所述避让槽，所述多个卡扣的一端抵持于所述第二底板，所述多个卡扣的另一端抵持于所述吸取器件，从而使所述第二底板与所述吸取器件夹持于所述多个卡扣的两端之间。
结合第一方面第三种可能的实施方式，在第一方面第四种可能的实施方式中，所述多个卡扣均呈U型。
结合第一方面，在第一方面第五种可能的实施方式中，所述电子模块返修方法还包括：清理所述第一底板的焊盘；及将一个功能完整的电子模块焊接在所述第一底板上。
结合第一方面或结合第一方面第一种可能实施的方式至第一方面第五种可能实施的方式之任意一种，在第一方面第六种可能的实施方式中，所述电子模块为接点栅格阵列模块。
结合第一方面或结合第一方面第一种可能实施的方式至第一方面第五种可能实施的方式之任意一种，在第一方面第七种可能的实施方式中，所述吸取器件为金属屏蔽罩。
结合第一方面或结合第一方面第一种可能实施的方式至第一方面第五种可能实施的方式之任意一种，在第一方面第八种可能的实施方式中，采用球栅阵列返修机台吸取所述电子模块。
结合第一方面第八种可能的实施方式，在第一方面第九种可能的实施方式 中，所述电子模块为接点栅格阵列模块。
本发明提供的电子模块返修方法，当焊接在所述第一底板上的电子模块发生故障需要返修时，由于所述电子模块的吸取器件与第二底板在加热状态下是仍然是固定一体的，即使在高温状态下，吸取器件与第二底板之间的焊锡发生熔融，所述电子模块的吸取器件与第二底板仍然可以保持完整一体，以保证所述电子模块被完整地拆卸下来。由此可见，本发明提供的电子模块返修方法，通过采用返修机台在高温状态下自动拆卸所述电子模块，避免了人工操作，不仅实现了电子模块的自动拆卸，同时还可以避免由于人工操作造成的二次损坏，提高了电子模块的维修良率，而且大大避免了操作员工伤事故的发生。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明第一种实施方式提供的电子模块返修固定结构的示意图；
图2是本发明第二种实施方式提供的电子模块返修固定结构的爆炸示意图；
图3是图2中电子模块返修固定结构的底部示意图；
图4是图3中圆IV部分的放大示意图；
图5是本发明第三种实施方式提供的电子模块返修固定结构的组装示意图；
图6是图5中电子返修固定结构的底部示意图；
图7是本发明提供的电子模块返修方法的流程示意图。
具体实施方式
下面将结合本发明实施方式中的附图，对本发明实施方式中的技术方案进 行清楚地描述。
请一并参照图1至图6，本发明具体实施方式提供的电子模块返修固定结构包括第一底板200及焊接在所述第一底板200上的电子模块100。所述电子模块100包括第二底板10及焊接在所述第二底板10上的吸取器件20。所述吸取器件20与第二底板10在加热状态下呈固定一体的状态。本实施方式中加热状态通常为所述电子模板100与所述第一底板200之间的焊锡及所述电子模块100的吸取器件10与第二底板10之间的焊锡均呈熔化状态。所述电子模块100在返修过程中，即便电子模块100的吸取器件10与第二底板10之间的焊锡均呈熔化状态，由于所述吸取器件20与第二底板10在加热状态下呈固定一体的状态，返修机台只需吸取所述吸取器件20的表面，就可以将整个所述电子模块100从所述第一底板200拆卸下来。
在本实施方式中，可选的，所述电子模块100可以为LGA(Land Grid Array,接点栅格阵列)模块，所述第一底板200及所述第二底板10可以均为PCB(Printed circuit board,印刷电路板)。所述第一底板200及所述第二底板10上均安装有多个电子元器件(未图示)。
本实施方式中，所述吸取器件20可以为金属屏蔽罩，所述金属屏蔽罩用于遮蔽所述电子模块100上的电子元器件，以达到对所述电子模块100实现电磁屏蔽的目的。在其它的实施方式中，所述吸取器件20也可以为其它的具有吸取面的焊接在所述第二底板10上的其它器件，例如散热器件等其它元器件。
在本实施方式中，所述返修机台可以为BGA(Ball Grid Array，球栅阵列)返修机台。
当焊接在所述第一底板200上的电子模块100发生故障需要返修时，返修机台对电子模块100进行加热以使得电子模块100与第一底板200之间的焊锡发生融化，以便将所述电子模块100从所述第一底板200拆卸下来。当电子模块100被加热时，所述电子模块100的吸取器件20与第二底板10之间的焊锡 在高温的状态下也会发生熔化。但是，由于所述电子模块100的吸取器件20与第二底板10在加热的状态下是固定的，即使在高温状态下，吸取器件20与第二底板10之间的焊锡发生熔融，所述电子模块100的吸取器件20与第二底板10仍然可以保持固定，以保证所述电子模块100能被返修机台完整地拆卸下来。
同时，本发明通过采用返修机台在加热状态下自动拆卸所述电子模块100，避免了人工操作，不仅实现了电子模块100的自动拆卸，同时还可以避免由于人工操作造成的二次损坏，提高了电子模块100的维修良率，而且大大避免了操作员工伤事故的发生。
请参照图1，在本发明提供的第一种实施方式中，所述吸取器件20与所述第二底板10之间设有加热固化胶30。加热固化胶30为加热后固化的胶体，当对加热固化胶30加热并达到其凝固点的温度时，加热固化胶30则由膏状体直接变成固体。本实施方式中，所述加热固化胶30为红胶、黄胶等。加热固化胶30使得吸取器件20与所述第二底板10在加热的状态下也能够牢固地结合在一起。
当返修机台对所述电子模块100进行加热，使所述电子模块100与所述第一底板200之间的焊点熔融时，所述吸取器件20与所述第二底板10之间的焊点也发生熔化，而此时，所述加热固化胶30在加热状态下固化使所述吸取器件20与所述第二底板10固定在一起。当返修机台吸取所述吸取器件20的表面时，由于所述吸取器件20与所述第二底板10在高温的状态下仍然固定于一体，返修机台就可以将整个电子模块100一起拆卸下来。
请同时参照图2、图3及图4，在第二种实施方式中，所述第一底板200上设有多个避让孔210，所述第二底板10上设有多个分别与所述避让孔210相通的通孔11，所述吸取器件20设有多个引脚21。所述多个引脚21分别穿过所述多个通孔11并折弯，所述多个引脚21扣住所述第二底板10，如图4 所示。
具体地，当所述电子模块100正常运行时，所述吸取器件20的多个引脚21分别穿过所述多个通孔11。当需要返修所述电子模块100时，可以先用镊子轻轻将所述吸取器件20伸出的引脚21折弯扣住所述第二底板10的底部，使得所述多个引脚21的折弯部分分别收容于所述避让孔210内。当然，也可以由机器或其它的折弯工艺设备将所述吸取器件20伸出的多个引脚21折弯扣住所述第二底板10的底部。其它实施方式中，也可以在返修前，例如在组装过程中，将所述吸取器件20伸出的多个引脚21折弯以将所述吸取器件20与所述第二底板10固定。
当返修机台对所述电子模块100进行加热，使所述电子模块100与所述第一底板200之间的焊点熔融时，所述吸取器件20与所述第二底板10之间的焊点也发生熔化。当返修机台吸取所述吸取器件20的表面时，由于所述吸取器件20的多个引脚21扣住所述第二底板10使所述吸取器件20与所述第二底板10固定在一起，所述返修机台就可以将整个电子模块100一起拆卸下来。
在本实施方式中，所述多个避让孔210为NPTH(Non Planting Though Hole,非沉铜孔)，所述多个避让孔210大小要达到可以使所述多个引脚21自由折弯并直接扣住所述第二底板10的程度。
本实施方式中，所述吸取器件20的每一个边缘设有3个引脚21，相应的，所述第一底板200每一边设置的避让孔210数量为3个，所述第二底板10每一边设置的通孔11的数量也为3个。在其它实施方式中，所述吸取器件20的每一个边缘也可以根据所述吸取器件20的尺寸大小设置所述引脚21的数量，例如2个、4个等其它数量。
请同时参照图5及图6，在本发明的第三种实施方式中，所述电子模块返修固定结构还包括多个卡扣40，所述第一底板200上设有多个避让槽220。安装时，所述多个卡扣40的分别穿过所述避让槽220内，所述多个卡扣40的一 端抵持于所述第二底板10，所述多个卡扣40的另一端抵持于所述吸取器件20的表面，使得所述第二底板10与所述吸取器件20夹持于所述多个卡扣40的两端之间。
当需要返修所述电子模块100时，将所述吸取器件20与所述第二底板10采用卡扣40固定在一起。当返修机台对所述电子模块100进行加热，使所述电子模块100与所述第一底板200之间的焊点熔融时，由于所述吸取器件20的与所述第二底板10是通过卡扣40固定为一体，当返修机台吸取所述吸取器件20的表面时，即便吸取器件20与所述第二底板10之间的焊点也发生熔化，也可以将整个电子模块100一起拆卸下来。
具体的，在所述第一底板200的每一边上设置避让槽220的数量可以为3个，相应地，所述第一底板200的每一边使用的卡扣40数量也可以为3个。在其它的实施方式中，也可以根据所述电子模块100的尺寸设置所述避让槽220的数量，例如2个、4个等其它数量。
具体的，所述卡扣40呈U型，可选的所述卡扣40由弹性材质制成。在其它实施方式中，也可以根据实际的需求设计所述卡扣40的形状。
本发明还提供了一种电子模块返修方法，用于返修出现故障的电子模块100。请参照图7，所述电子模块返修方法包括以下步骤。
在步骤S100中，将所述电子模块100的所述吸取器件20与所述第二底板10固定连接，从而使所述吸取器件20与所述第二底板10之间的焊锡在熔融的状态下，所述吸取器件20与所述第二底板10仍固定于一体。
在第一种实施方式中，步骤S100为在所述吸取器件20与所述第二底板10之间点加热固化胶30。所述加热固化胶30涂覆在所述吸取器件20的边缘与所述第二底板10之间，如图1所示。当返修机台对所述电子模块100进行加热，使所述电子模块100与所述第一底板200之间的焊点熔融时，所述吸取器件20与所述第二底板10之间的焊点也发生熔化，而此时，所述加热固化胶 30在加热状态下固化使所述吸取器件20与所述第二底板10固定在一起。在本实施方式中，所述加热固化胶30为红胶。在其它实施方式中，所述加热固化胶30也可以为黄胶。
在第二种实施方式中，步骤S100包括以下四个步骤，即，步骤1至步骤4。
步骤1，在所述第一底板200上设置多个避让孔210。在本实施方式中，所述避让孔210为NPTH(Non Planting Though Hole,非沉铜孔)，所述避让孔210大小要达到可以使所述引脚21自由折弯并直接扣住所述第二底板10的程度。
在步骤2，在所述吸取器件20的边缘设置多个引脚21，所述第二底板10上设置多个分别与所述多个避让孔210相通的通孔11。
步骤3，将所述引脚21分别穿过所述通孔11。
步骤4，将所述多个引脚21折弯以扣住所述第二底板10，且所述多个引脚21的折弯部分分别收容在所述避让孔210内，从而使所述吸取器件20与所述第二底板10固定于一体。本实施方式中，在需要返修出现故障的所述电子模块100时，采用镊子轻轻将所述吸取器件20伸出的引脚21折弯扣住所述第二底板10的底部，当然也可以由机器或其它的折弯工艺设备将所述吸取器件20伸出的引脚21折弯扣住所述第二底板10的底部。在其它实施方式中，也可以在返修前，例如在组装过程中，将所述吸取器件20伸出的引脚21折弯以将所述吸取器件20与所述第二底板10固定。
在第三种实施方式中，步骤S100包括以下两个步骤，即，步骤1’和步骤2’。
步骤1’中，在所述第一底板200上设置多个避让槽220。
步骤2’中，将多个卡扣40穿过所述避让槽220内，多个卡扣40的一端抵持于所述第二底板10，所述卡扣40的另一端抵持于所述吸取器件20。也就是 说，将所述第二底板10与所述吸取器件20夹持于所述多个卡扣40的两端之间，使所述吸取器件20与所述第二底板10固定于一体。
本实施方式中，所述多个卡扣40均呈U形。
请参照图7，在步骤S110中，对所述电子模块100进行加热处理，使所述电子模块100与所述第一底板200之间的焊锡熔化。此时，返修机台根据设定好的程式选择合适的喷嘴和吸嘴，并对所述电子模块100进行加热处理。此时，所述吸取器件20与所述第二底板10之间的焊锡也会发生熔化。
在步骤S120中，返修机台吸取所述电子模块100的所述吸取器件20的表面，将整个所述电子模块100从所述第一底板200上拆卸下来以利于返修或更换所述电子模块100。具体地，所述返修机台的吸嘴按照所述设定好的程式吸取所述电子模块100的吸取器件20的表面，由于所述吸取器件20与所述第二底板10是固定在一起的，因此，即使所述吸取器件20与所述第二底板10之间的焊锡处于熔化状态，所述返修机台仍然可以将所述电子模块100完整地拆卸下来。维修人员即可对拆卸下来的出现故障的所述电子模块100进行维修，以达到二次利用的目的。
作为本发明的进一步改进，在本实施方式中，本发明提供的电子模块返修方法还包括步骤S130及步骤S140。
具体地，在步骤S130中，清理所述第一底板200的焊盘，并在所述第一底板200上印刷导电材料。本实施方式中，所述导电材料为锡膏。
在步骤S140中，将一个功能完整的电子模块100焊接在所述第一底板200上，从而达到了更换出现故障的所述电子模块100的目的。
当然，在其它的实施方式中，也可以根据实际的需求来决定是否需要在第一底板200上重新安装功能完整的电子模块100，从而省略步骤S130及步骤S140。
由此可见，本发明提供的电子模块返修方法，将所述吸取器件20与所述 第二底板10在融锡的状态下仍然固定于一体，采用返修机台在高温下自动吸取所述吸取器件20的表面以达到顺利拆卸整个电子模块100的目的。
本发明提供的电子模块返修方法采用返修机台自动拆卸所述电子模块100，大大减少了由于人工操作带来的操作失误而造成的低返修良率，减少了电子模块100报废的数量。同时，无需操作人员在高温下接触故障产品，大大减少了由于高温造成的工伤事件的发生。
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。

Claims (10)

  1. 一种电子模块返修方法，用于返修出现故障的电子模块，所述电子模块焊接在第一底板上，且所述电子模块包括第二底板及焊接在所述第二底板上的吸取器件，其特征在于，所述电子模块返修方法包括以下步骤：
    将所述吸取器件与所述第二底板固定连接，从而使所述吸取器件与所述第二底板之间的焊锡在熔融的状态下，所述吸取器件与所述第二底板仍固定于一体；
    对所述电子模块进行加热处理，使所述电子模块与所述第一底板之间的焊锡融化；及
    返修机台吸取所述电子模块的吸取器件的表面，将所述电子模块从所述第一底板上拆卸下来，以利于返修或更换所述电子模块。
  2. 如权利要求1所述的电子模块返修方法，其特征在于，所述“将所述吸取器件与所述第二底板固定连接”的步骤包括：
    在所述吸取器件与所述第二底板之间设置加热固化胶。
  3. 如权利要求1所述的电子模块返修方法，其特征在于，所述“将所述吸取器件与所述第二底板固定连接”的步骤包括：
    在所述第一底板上设置多个避让孔，所述第二底板上设置多个分别与所述多个避让孔相通的通孔；
    在所述吸取器件的边缘设置多个引脚；
    将所述多个引脚分别穿过所述多个通孔；及
    将所述多个引脚折弯以扣住所述第二底板，且所述多个引脚的折弯部分分别收容在所述多个避让孔内。
  4. 如权利要求1所述的电子模块返修方法，其特征在于，所述“将所述吸取器件与所述第二底板固定连接”的步骤包括:
    在所述第一底板上设置多个避让槽；及
    将多个卡扣分别穿过所述避让槽，所述多个卡扣的一端抵持于所述第二底板，所述多个卡扣的另一端抵持于所述吸取器件，从而使所述第二底板与所述吸取器件夹持于所述多个卡扣的两端之间。
  5. 如权利要求4所述的电子模块返修方法，其特征在于，所述多个卡扣均呈U型。
  6. 如权利要求1所述的电子模块返修方法，其特征在于，还包括：
    清理所述第一底板的焊盘；及
    将一个功能完整的电子模块焊接在所述第一底板上。
  7. 如权利要求1-6任意一项所述的电子模块返修方法，其特征在于，所述电子模块为接点栅格阵列模块。
  8. 如权利要求1-6任意一项所述的电子模块返修方法，其特征在于，所述吸取器件为金属屏蔽罩。
  9. 如权利要求1-6任意一项所述的电子模块返修方法，其特征在于，采用球栅阵列返修机台吸取所述电子模块。
  10. 如权利要求9所述的电子模块返修方法，其特征在于，所述电子模块为接点栅格阵列模块。
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