KR970013148A - 도전성볼의 탑재장치 및 탑재방법 - Google Patents
도전성볼의 탑재장치 및 탑재방법 Download PDFInfo
- Publication number
- KR970013148A KR970013148A KR1019960035274A KR19960035274A KR970013148A KR 970013148 A KR970013148 A KR 970013148A KR 1019960035274 A KR1019960035274 A KR 1019960035274A KR 19960035274 A KR19960035274 A KR 19960035274A KR 970013148 A KR970013148 A KR 970013148A
- Authority
- KR
- South Korea
- Prior art keywords
- conductive ball
- mounting
- adsorption
- conductive
- work
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000001179 sorption measurement Methods 0.000 claims 8
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000004907 flux Effects 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract 3
- 238000007654 immersion Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Automatic Assembly (AREA)
Abstract
본 발명은, 범프부착워크의 제조공정에서 사용되는 도전성볼의 탑재장치 및 탑재방법에 관한 것으로서, 땜납볼 등의 도전성볼을 워크의 전극에 확실하게 탑재하는 도전성볼의 탑재장치 및 탑재방법을 제공하는 것을 목적으로 한 것이며 그 구성에 있어서, 탑재헤드(20)를 상자형의 본체(30)와, 본체(30)의 내부에 수납된 케이스(31)와, 케이스(31)의 하부의 흡착툴(32)로 구성한다. 본체(30)와 케이스(31)를 스프링재(40)에 의해 결합하고, 그 스프링힘에 의해 흡착툴(32)쪽의 자중을 상쇄한다. 본체(30)에 실린더(38)을 형성하고, 그 로드(39)를 케이스(30)에 결합하다. 실린더(38)에 의해, 흡착툴(32)의 흡착구멍(35)에 진공흡착된 땜납볼(1)을 워크(11)의 전극(12)에 밀어붙인다. 탑재헤드(20)는, 불사나(51), 너트(52), 모터(56)등으로 이루어진 상하동수단에 의해 상하동작을 행한다. 실린더(38)에 의한 흡착툴(32)의 압압력은, 땜납볼(1)이 전극(12)에 밀어붙여져서 찌부러지거나 흡착구멍(35)에 끼워져들어가지 않는 적당한 정도의 크기로 설정되어 있는 것을 특징으로 한 것이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명의 일실시예의 도전성불의 탑재장치의 탑재헤드부의 단면도
Claims (3)
- 워크의 위치결정부와, 도전성볼의 공급부와, 탑재헤드와 이 탑재헤드에 상하동작을 행하게하는 상하동수단과, 이 탑재헤드를 상기 워크의 위치결정부와 상기 도전성볼의 공급부사이를 이동시키는 이동수단을 구비한 도전성볼의 탑재장치로서, 상기 탑재헤드가, 본체와, 이 본체의 하부에 설치되어서 그 하면에 도전성볼의 흡착구멍이 형성된 흡착투울과, 이 흡착틀을 아래쪽으로 압압하는 압압수단과, 이 흡착틀을 위쪽으로 퉁겨서 그 스프링힘에 의해 흡착툴쪽의 자중을 상쇄하는 스프링재를 구비하고, 상기 압압수단의 압압력에 의해 도전성볼을 워크의 전극에 밀어붙이는 힘을 설정하도록 한 것을 특징으로 하는 도전성볼의 탑재장치.
- 제1항에 있어서, 상기 스프링제의 스프링힘을, 상기 흡착툴쪽의 자중과 동등하게 한 것을 특징으로 하는 도전성볼의 탑재장치.
- 하면에 형성된 흡착구멍에 도전성볼을 진공흡착한 흡착툴을 상하동수단의 구동에 의해 하강시켜서, 도전성볼을 워크의 전극위에 착지시키는 공정과, 흡착툴을 약간 상승시키므로써 도전성볼과 전극사이에 플럭스를 개재시켜서 도전성볼을 전극으로부터 약간 상승시키는 공정과, 진공흡착상태를 해제하는 동시에 흡착툴을 상승시키므로써, 도전성볼은 플럭스의 점착력에 의해 전극위에 재차 착지시켜서 탑재하는 공정을 포함하는 것을 특징으로 하는 도전성볼의 탑재방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP95-215877 | 1995-08-24 | ||
JP21587795A JP3196582B2 (ja) | 1995-08-24 | 1995-08-24 | 導電性ボールの搭載装置および搭載方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970013148A true KR970013148A (ko) | 1997-03-29 |
KR100214098B1 KR100214098B1 (ko) | 1999-08-02 |
Family
ID=16679744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960035274A KR100214098B1 (ko) | 1995-08-24 | 1996-08-24 | 도전성볼의 탑재장치 및 탑재방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5768775A (ko) |
JP (1) | JP3196582B2 (ko) |
KR (1) | KR100214098B1 (ko) |
TW (1) | TW332792B (ko) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3228140B2 (ja) * | 1996-08-19 | 2001-11-12 | 松下電器産業株式会社 | 導電性ボールの搭載方法 |
US6059176A (en) * | 1997-04-11 | 2000-05-09 | Pac Tech Packaging Technologies G.M.B.H. | Device and a method for applying a plurality of solder globules to a substrate |
JP2850901B2 (ja) * | 1997-06-02 | 1999-01-27 | 日本電気株式会社 | ボール配列治具及びその製造方法 |
KR100479914B1 (ko) * | 1997-09-22 | 2005-06-16 | 삼성테크윈 주식회사 | 볼그리드어레이패키지용볼흡착장치 |
US6325272B1 (en) * | 1998-10-09 | 2001-12-04 | Robotic Vision Systems, Inc. | Apparatus and method for filling a ball grid array |
JP3024113B1 (ja) * | 1999-01-27 | 2000-03-21 | 株式会社日鉄マイクロメタル | 金属球配列方法及び配列装置 |
TW451359B (en) * | 1999-03-16 | 2001-08-21 | Matsushita Electric Ind Co Ltd | Mounting equipment and mounting method of conductive balls |
JP4598240B2 (ja) | 1999-06-24 | 2010-12-15 | アスリートFa株式会社 | ボール搭載装置及びボール搭載方法 |
US6386433B1 (en) | 1999-08-24 | 2002-05-14 | Kulicke & Soffa Investments, Inc. | Solder ball delivery and reflow apparatus and method |
US6227437B1 (en) | 1999-08-24 | 2001-05-08 | Kulicke & Soffa Industries Inc. | Solder ball delivery and reflow apparatus and method of using the same |
US6607118B2 (en) | 2001-04-30 | 2003-08-19 | Asm Assembly Automation Limited | Apparatus and method for ball release |
US6830175B2 (en) * | 2003-02-05 | 2004-12-14 | Carl T. Ito | Solder ball dispenser |
KR100643908B1 (ko) | 2005-09-16 | 2006-11-10 | 한국기계연구원 | 진공 솔더볼 흡착장치 및 이를 이용해 솔더볼을 기판 상에융착시키기 위한 방법 |
JP5462712B2 (ja) * | 2010-05-24 | 2014-04-02 | 株式会社日立製作所 | マイクロバンプ形成装置 |
KR101278331B1 (ko) * | 2010-10-07 | 2013-06-25 | 삼성전기주식회사 | 솔더 볼 흡착용 지그 |
CN102794523A (zh) * | 2012-09-03 | 2012-11-28 | 安徽精实电子科技有限公司 | 用于焊接制程的沾锡设备 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62166548A (ja) * | 1986-01-20 | 1987-07-23 | Oki Electric Ind Co Ltd | 半田バンプ形成方法 |
JPH05129374A (ja) * | 1991-06-24 | 1993-05-25 | Fujitsu Ltd | 半田ボールの搭載方法 |
JPH05299424A (ja) * | 1992-04-23 | 1993-11-12 | Fujitsu Ltd | 半田ボールの電極パッドへの載置方法とその装置 |
US5464652A (en) * | 1992-11-19 | 1995-11-07 | Hughes Aircraft Company | Green ceramic via metallization technique |
JP3290788B2 (ja) * | 1993-12-14 | 2002-06-10 | 富士通株式会社 | プリント基板の半田膜形成装置 |
JP3217571B2 (ja) * | 1993-12-31 | 2001-10-09 | 古河電気工業株式会社 | はんだボールの搬送供給装置 |
US5431332A (en) * | 1994-02-07 | 1995-07-11 | Motorola, Inc. | Method and apparatus for solder sphere placement using an air knife |
JP3528264B2 (ja) * | 1994-08-19 | 2004-05-17 | ソニー株式会社 | ソルダーボールのマウント装置 |
-
1995
- 1995-08-24 JP JP21587795A patent/JP3196582B2/ja not_active Expired - Lifetime
-
1996
- 1996-08-13 TW TW085109833A patent/TW332792B/zh not_active IP Right Cessation
- 1996-08-23 US US08/701,839 patent/US5768775A/en not_active Expired - Lifetime
- 1996-08-24 KR KR1019960035274A patent/KR100214098B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100214098B1 (ko) | 1999-08-02 |
US5768775A (en) | 1998-06-23 |
JPH0964100A (ja) | 1997-03-07 |
JP3196582B2 (ja) | 2001-08-06 |
TW332792B (en) | 1998-06-01 |
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