KR960704327A - 전도성 미세 입자 및 이로부터 제조된 압감성 접착테이프(conductive microparticles and pressure-sensitive adhesive tapes made therefrom) - Google Patents

전도성 미세 입자 및 이로부터 제조된 압감성 접착테이프(conductive microparticles and pressure-sensitive adhesive tapes made therefrom)

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KR960704327A
KR960704327A KR1019960700250A KR19960700250A KR960704327A KR 960704327 A KR960704327 A KR 960704327A KR 1019960700250 A KR1019960700250 A KR 1019960700250A KR 19960700250 A KR19960700250 A KR 19960700250A KR 960704327 A KR960704327 A KR 960704327A
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vinyl
pressure sensitive
sensitive adhesive
acrylate
meth
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KR1019960700250A
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English (en)
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구스타브 거트만
리차드 제이. 괴츠
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제럴드 에프. 체니벡
미네소타 마이닝 앤드 매뉴팩츄어링 컴패니
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Publication of KR960704327A publication Critical patent/KR960704327A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/122—Ionic conductors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
    • C08L2205/18—Spheres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L31/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid; Compositions of derivatives of such polymers
    • C08L31/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)

Abstract

본 발명은 평균 직경이 1㎛이상이고, 표면상에 이온성의 전도성 물질이 그라프트화되어 있는, 전도성이고, 중합체성이며, 본질적으로 점착성이고, 용매-불용성이며, 용매-분산성이고, 탄성중합체성인 압감성 접착제 미세 입자, 및 상기 미세 입자로부터 제조된 대전방지성의 압감성 접착 테이프에 관한 것이다.

Description

전도성 미세 입자 및 이로부터 제조된 압감성 접착테이프(CONDUTIVE MICROPARTICLES AND PRESSURE-SENSITIVE ADHESIVE TAPES MADE THEREFROM)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (13)

  1. 평균 직경이 1㎛이상이고, 이온성의 전도성 물질이 하나의 표면상에 그라프트화되어 있으며, 전도성이고, 중합체성이며, 본질적으로 점착성이고, 용매-불용성이며, 용매-분산성이고, 탄성중합체인 압감성 접착제 미세 입자.
  2. 제1항에 있어서, a) 하나 이상의 알킬 (메트)아크릴레이트 또는 비닐 에스테르 70부 이상, 및 b) 이에 대응하여 상기 a)와 함께 100부가 되도록, 하나 이상의 극성 단량체 30부 이하를 함유하는 단량체들의 중합체를 포함하며, 상기 이온성의 전도성 물질은 폴리에틸렌 옥사이드, 폴리페닐렌 옥사이드, 폴리페닐렌 설파이드, 폴리에틸렌 설파이드, 폴리에틸렌이민, 폴리프로필렌 옥사이드, 폴리부틸렌 옥사이드, 폴리부틸렌 설파이드, 및 폴리부틸렌 이민으로 구성되는 군에서 선택되는 중합체 전해질 베이스 중합체로 형성된 중합체 전해질을 포함하고, 상기 중합체 전해질 베이스 중합체는 0.1 내지 10부의 양으로 첨가되는 것을 특징으로 하는 전도성의 압감성 접착제 미세 입자.
  3. 제1항에 있어서, 상기 이온성의 전도성 물질이 중합체 전해질 베이스 단위체 1몰당 하나 이상의 알칼리 금속염 또는 알칼리 토금속염 0.01 내지 10몰을 추가로 포함하는 전도성의 압감성 접착제 미세 입자.
  4. 제3항에 있어서, 상기 염이 LiCl, LiNO3, LiCF3SO3, LiSO4, LioH, KOH, NaSCN, Nal, BaSO3CF3, 및 NH4OH로 구성되는 군에서 선택되는 전도성의 압감성 접착제 미세 입자.
  5. 제2항에 있어서, 상기 단량체가 단량체 100부를 산출하도록, a) 하나 이상의 알킬 (메트)아크릴레이트 또는 비닐 에스테르 85부 이상, 및 b) 이에 대응하여 상기 a)와 함께 100부가 되도록, 하나 이상의 극성 단량체 15부 이하를 함유하며, 상기 이온성의 전도성 물질은 중합체 전해질 베이스 중합체는 0.1 내지 10부로부터 형성된 중합체 전해질 물질을 포함하는 전도성의 압감성 접착제 미세 입자.
  6. 제5항에 있어서, 상기 알킬 (메트)아크릴레이트가 이소옥틸 (메트)아크릴레이트, 2-에틸헥실 (메트)아클리레이트, 이소노닐 (메트)아클리레이트, 이소아밀 (메트)아클리레이트, 이소데실 (메트)아클리레이트, 및 부틸 (메트)아클리레이트로 구성되는 군에서 선택되며, 상기 극성 단량체가 N-비닐-2-피롤리돈, N-비닐 카프로락탐, 아크릴로니트릴, 비닐 아크릴레이트, 디알릴 프탈레이트, 아크릴산, 메타크릴산, 이타콘산, 히드록시알킬 아크릴레이트, 시아노알킬 아크릴레이트, 아크릴아미드, 및 치환된 아크릴아미드로 구성되는 군에서 선택되는 전도성의 압감성 접착제 미세 입자.
  7. 제5항에 있어서, 상기 비닐 에스테르가 비닐 2-에틸헥사노에이트, 비닐 카프로에이트, 비닐 라우레이트, 비닐 펠라르고네이트, 비닐 헥사노에이트, 비닐 프로피오네이트, 비닐 데카노에이트, 및 비닐 옥타노에이트로 구성되는 군에서 선택되며, 상기 극성 단량체가 N-비닐-2-피롤리돈, N-비닐 카프로락탐, 아크릴로니트릴, 비닐 아크릴레이트, 디알릴 프탈레이트, 아크릴산, 메타크릴산, 이타콘산, 히드록시알킬 아크릴레이트, 시아노알킬 아크릴레이트, 아크릴아미드, 및 치환된 아크릴아미드로 구성되는 군에서 선택되는 전도성의 압감성 접착제 미세 입자.
  8. 제1항 또는 제2항에 있어서, 상기 미세 입자가 표면 및 하나 이상의 내부 공극을 가지며, 평균 직경이 1 내지 250㎛인 전도성의 압감성 접착제 미세 입자.
  9. 제1항 내지 제3항중 어느 한 항에 의한, 전도성이고, 중합체성이며, 본질적으로 점착성이고, 용매-불용성이며, 용매-분산성이고, 탄성중합체성인 압감성 접착제 미세 입자를 함유하는, 대전방지성이며, 입자성인 압감성 접착제.
  10. 제9항에 있어서, 상기 중합체 전해질 베이스 중합체가 폴리에틸렌 옥사이드인, 대전방지성이며, 입자성인 압감성 접착제.
  11. 제9항에 있어서, 알칼리 금속염 및 알칼리 토금속염으로 구성되는 군에서 선택되는 금속염을 추가로 함유하는, 대전방지성이며, 입자성인 압감성 접착제.
  12. 제9항 또는 제10항중 어느 한 항에 의한 압감성 접착제가 하나 이상의 주표면상에 피복된 기재를 포함하는 대전방지성의 압감성 접착 테이프.
  13. 제9항 또는 제10항중 어느 한 항에 의한 압감성 접착제가 하나 이상의 주표면상에 피복되어 있는 대전방지성의 압감성 접착 라벨.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960700250A 1993-07-28 1994-06-10 전도성 미세 입자 및 이로부터 제조된 압감성 접착테이프(conductive microparticles and pressure-sensitive adhesive tapes made therefrom) KR960704327A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/098,166 US5378405A (en) 1993-07-28 1993-07-28 Conductive microparticles and pressure-sensitive adhesive tapes made therefrom
US08/098166 1993-07-28
PCT/US1994/006628 WO1995004356A1 (en) 1993-07-28 1994-06-10 Conductive microparticles and pressure-sensitive adhesive tapes made therefrom

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US (1) US5378405A (ko)
EP (1) EP0711448B1 (ko)
JP (1) JPH09501009A (ko)
KR (1) KR960704327A (ko)
CN (1) CN1127567A (ko)
CA (1) CA2165799A1 (ko)
DE (1) DE69405764T2 (ko)
ES (1) ES2107234T3 (ko)
HK (1) HK1012774A1 (ko)
MX (1) MX9404935A (ko)
MY (1) MY110775A (ko)
PH (1) PH30672A (ko)
SG (1) SG50662A1 (ko)
WO (1) WO1995004356A1 (ko)

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DE69405764D1 (de) 1997-10-23
HK1012774A1 (en) 1999-08-06
CA2165799A1 (en) 1995-02-09
MY110775A (en) 1999-03-31
EP0711448A1 (en) 1996-05-15
PH30672A (en) 1997-09-16
DE69405764T2 (de) 1998-01-08
EP0711448B1 (en) 1997-09-17
SG50662A1 (en) 1998-07-20
WO1995004356A1 (en) 1995-02-09
CN1127567A (zh) 1996-07-24
JPH09501009A (ja) 1997-01-28
US5378405A (en) 1995-01-03
MX9404935A (es) 1995-01-31

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