HK1012774A1 - Conductive microparticles and pressure-sensitive adhesive tapes made therefrom - Google Patents

Conductive microparticles and pressure-sensitive adhesive tapes made therefrom

Info

Publication number
HK1012774A1
HK1012774A1 HK98113696A HK98113696A HK1012774A1 HK 1012774 A1 HK1012774 A1 HK 1012774A1 HK 98113696 A HK98113696 A HK 98113696A HK 98113696 A HK98113696 A HK 98113696A HK 1012774 A1 HK1012774 A1 HK 1012774A1
Authority
HK
Hong Kong
Prior art keywords
pressure
sensitive adhesive
adhesive tapes
made therefrom
tapes made
Prior art date
Application number
HK98113696A
Other languages
English (en)
Inventor
Gustav Gutman
Richard J Goetz
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of HK1012774A1 publication Critical patent/HK1012774A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/122—Ionic conductors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
    • C08L2205/18—Spheres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L31/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid; Compositions of derivatives of such polymers
    • C08L31/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
HK98113696A 1993-07-28 1998-12-16 Conductive microparticles and pressure-sensitive adhesive tapes made therefrom HK1012774A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/098,166 US5378405A (en) 1993-07-28 1993-07-28 Conductive microparticles and pressure-sensitive adhesive tapes made therefrom
PCT/US1994/006628 WO1995004356A1 (en) 1993-07-28 1994-06-10 Conductive microparticles and pressure-sensitive adhesive tapes made therefrom

Publications (1)

Publication Number Publication Date
HK1012774A1 true HK1012774A1 (en) 1999-08-06

Family

ID=22267666

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98113696A HK1012774A1 (en) 1993-07-28 1998-12-16 Conductive microparticles and pressure-sensitive adhesive tapes made therefrom

Country Status (14)

Country Link
US (1) US5378405A (ko)
EP (1) EP0711448B1 (ko)
JP (1) JPH09501009A (ko)
KR (1) KR960704327A (ko)
CN (1) CN1127567A (ko)
CA (1) CA2165799A1 (ko)
DE (1) DE69405764T2 (ko)
ES (1) ES2107234T3 (ko)
HK (1) HK1012774A1 (ko)
MX (1) MX9404935A (ko)
MY (1) MY110775A (ko)
PH (1) PH30672A (ko)
SG (1) SG50662A1 (ko)
WO (1) WO1995004356A1 (ko)

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US5637368A (en) * 1992-06-04 1997-06-10 Minnesota Mining And Manufacturing Company Adhesive tape having antistatic properties
US5508107A (en) * 1993-07-28 1996-04-16 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesive tapes for electronics applications
US5914186A (en) * 1994-05-06 1999-06-22 Minnesota Mining And Manufacturing Company High temperature resistant antistatic pressure-sensitive adhesive tape
WO1995030720A1 (en) * 1994-05-06 1995-11-16 Minnesota Mining And Manufacturing Company High temperature resistant antistatic pressure-sensitive adhesive tape
US5562983A (en) * 1994-12-13 1996-10-08 Minnesota Mining And Manufacturing Company Adhesive closure system for oil-containing sheet material
US20010028953A1 (en) * 1998-11-16 2001-10-11 3M Innovative Properties Company Adhesive compositions and methods of use
AU6487996A (en) 1995-07-10 1997-02-10 Minnesota Mining And Manufacturing Company Screen printable adhesive compositions
AU6540496A (en) * 1995-08-22 1997-03-19 Minnesota Mining And Manufacturing Company Optically clear antistatic pressure-sensitive adhesive film
WO1997014510A1 (en) * 1995-10-17 1997-04-24 Minnesota Mining And Manufacturing Company Water-based microsphere adhesives
US5672297A (en) * 1995-10-27 1997-09-30 The Dow Chemical Company Conductive composite articles based on expandable and contractible particulate matrices
US6479073B1 (en) * 1996-10-07 2002-11-12 3M Innovative Properties Company Pressure sensitive adhesive articles and methods for preparing same
US5885708A (en) * 1997-02-14 1999-03-23 Minnesota Mining And Manufacturing Company Antistatic latex adhesives
US5841350A (en) * 1997-06-27 1998-11-24 Checkpoint Systems, Inc. Electronic security tag useful in electronic article indentification and surveillance system
WO1999029795A1 (en) * 1997-12-05 1999-06-17 Minnesota Mining And Manufacturing Company Optically clear antistatic pressure-sensitive adhesive film
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US6794475B1 (en) * 2000-06-30 2004-09-21 Noveon Ip Holdings Corp. Antistatic polymers, blends, and articles
CN100372619C (zh) * 2000-07-14 2008-03-05 日东电工株式会社 清洁片及其输运元件、以及衬底处理设备清洁方法
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US7226549B2 (en) * 2001-12-10 2007-06-05 Uchicago Argonne, Llc High cation transport polymer electrolyte
US7358295B2 (en) * 2002-04-05 2008-04-15 Lubrizol Advanced Materials, Inc. Hybrid polymer composition, and article therefrom
US7012735B2 (en) * 2003-03-27 2006-03-14 E Ink Corporaiton Electro-optic assemblies, and materials for use therein
JP2005314579A (ja) * 2004-04-30 2005-11-10 Nitto Denko Corp 粘着剤組成物、および粘着シート類
JP4531628B2 (ja) * 2004-09-16 2010-08-25 日東電工株式会社 粘着剤組成物、粘着シート類、および表面保護フィルム
JP4917267B2 (ja) * 2004-09-16 2012-04-18 日東電工株式会社 粘着剤組成物、粘着シート類、および表面保護フィルム
JP5259940B2 (ja) * 2005-09-05 2013-08-07 日東電工株式会社 粘着剤組成物、粘着シートおよび表面保護フィルム
KR100830814B1 (ko) 2005-10-14 2008-05-20 주식회사 엘지화학 아크릴계 점착제 조성물
JP5455362B2 (ja) * 2008-12-25 2014-03-26 チェイル インダストリーズ インコーポレイテッド 粘着剤組成物およびこれを用いた光学部材
JP5623020B2 (ja) 2009-02-27 2014-11-12 日東電工株式会社 粘着剤組成物、粘着剤層、及び、粘着シート
JP6022281B2 (ja) 2011-10-11 2016-11-09 住友理工株式会社 トランスデューサ
JP2016060776A (ja) * 2014-09-16 2016-04-25 綜研化学株式会社 有機無機複合樹脂粒子およびその製造方法
JP2019137821A (ja) * 2018-02-15 2019-08-22 積水化成品工業株式会社 導電性粘着ゲルシート
CN111500215B (zh) * 2020-04-30 2021-11-26 张家港保税区汇英聚福材料科技合伙企业(有限合伙) 一种压敏导电胶黏剂及其制备方法

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Also Published As

Publication number Publication date
DE69405764T2 (de) 1998-01-08
JPH09501009A (ja) 1997-01-28
EP0711448B1 (en) 1997-09-17
PH30672A (en) 1997-09-16
SG50662A1 (en) 1998-07-20
MX9404935A (es) 1995-01-31
US5378405A (en) 1995-01-03
CN1127567A (zh) 1996-07-24
CA2165799A1 (en) 1995-02-09
EP0711448A1 (en) 1996-05-15
MY110775A (en) 1999-03-31
KR960704327A (ko) 1996-08-31
DE69405764D1 (de) 1997-10-23
ES2107234T3 (es) 1997-11-16
WO1995004356A1 (en) 1995-02-09

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)