KR960043150A - 반도체 패키지용 리드프레임 - Google Patents

반도체 패키지용 리드프레임 Download PDF

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Publication number
KR960043150A
KR960043150A KR1019950011570A KR19950011570A KR960043150A KR 960043150 A KR960043150 A KR 960043150A KR 1019950011570 A KR1019950011570 A KR 1019950011570A KR 19950011570 A KR19950011570 A KR 19950011570A KR 960043150 A KR960043150 A KR 960043150A
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KR
South Korea
Prior art keywords
lead frame
semiconductor chip
paddle
size
semiconductor
Prior art date
Application number
KR1019950011570A
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English (en)
Other versions
KR0152953B1 (ko
Inventor
이만수
Original Assignee
문정환
Lg 반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 문정환, Lg 반도체주식회사 filed Critical 문정환
Priority to KR1019950011570A priority Critical patent/KR0152953B1/ko
Publication of KR960043150A publication Critical patent/KR960043150A/ko
Application granted granted Critical
Publication of KR0152953B1 publication Critical patent/KR0152953B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201—Structure
    • H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

본 발명은 리드 프레임의 패들위에 반도체 칩을 부착하는 다이본딩 공정에서의 리드 프레임에 관한 것으로, 리드 프레임(3)에 연결된 패들(2)의 상면에 반도체 칩(1)이 부착 고정되는 반도체 패키지용 리드 프레임에 있어서, 패들(11)의 크기를 종래와 같이 반도체 칩(10)의 크기보다 크게하지 않고, 반도체 칩(11)보다 작고 일정하게 하여 다이본딩을 할때 동일한 크기의 리드 프레임(12)에 여러 크기의 반도체 칩(11)을 부착할 수 있으며, 또한 와이어 본딩시 동일한 크기의 히터블럭을 사용할 수 있으므로 자재가 절감이 되고 작업효율이 향상되는 것이다.

Description

반도체 패키지용 리드프레임
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 3도는 본 발명 리드 프레임에 반도체 칩이 부착되어 있는 구성을 보인 개략사시도. 제 4도는 본 발명 리드 프레임의 패들에 여러 크기의 반도체 칩이 부착되어 있는 상태를 보인 구성도. 제 5도는 본 발명리드 프레임에 부착되어 있는 반도체 칩의 와이어 본딩하는 공정을 보인 개략사시도.

Claims (1)

  1. 리드 프레임에 연결된 패들위에 반도체 칩을 부착하여 다이본딩을 하는 반도체 패키지용 리드 프레임에 있어서, 반도체 칩의 크기보다 패들의 크기를 작고 일정하게 함으로써 동일한 크기의 리드 프레임 및 히터 블럭을 사용할수 있도록 한 것을 특징으로 하는 반도체 패키지용 리드 프레임.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950011570A 1995-05-11 1995-05-11 반도체 패키지용 리드프레임 KR0152953B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950011570A KR0152953B1 (ko) 1995-05-11 1995-05-11 반도체 패키지용 리드프레임

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950011570A KR0152953B1 (ko) 1995-05-11 1995-05-11 반도체 패키지용 리드프레임

Publications (2)

Publication Number Publication Date
KR960043150A true KR960043150A (ko) 1996-12-23
KR0152953B1 KR0152953B1 (ko) 1998-10-01

Family

ID=19414202

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950011570A KR0152953B1 (ko) 1995-05-11 1995-05-11 반도체 패키지용 리드프레임

Country Status (1)

Country Link
KR (1) KR0152953B1 (ko)

Also Published As

Publication number Publication date
KR0152953B1 (ko) 1998-10-01

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