KR960035614U - 반도체 소자테스트용 금속트레이 유니트 - Google Patents

반도체 소자테스트용 금속트레이 유니트

Info

Publication number
KR960035614U
KR960035614U KR2019950007446U KR19950007446U KR960035614U KR 960035614 U KR960035614 U KR 960035614U KR 2019950007446 U KR2019950007446 U KR 2019950007446U KR 19950007446 U KR19950007446 U KR 19950007446U KR 960035614 U KR960035614 U KR 960035614U
Authority
KR
South Korea
Prior art keywords
semiconductor device
tray unit
device testing
metal tray
metal
Prior art date
Application number
KR2019950007446U
Other languages
English (en)
Other versions
KR0122284Y1 (ko
Inventor
김두철
Original Assignee
미래산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미래산업주식회사 filed Critical 미래산업주식회사
Priority to KR2019950007446U priority Critical patent/KR0122284Y1/ko
Priority to JP4154696A priority patent/JP2854276B2/ja
Priority to US08/615,027 priority patent/US5786704A/en
Priority to DE19613611A priority patent/DE19613611B4/de
Publication of KR960035614U publication Critical patent/KR960035614U/ko
Application granted granted Critical
Publication of KR0122284Y1 publication Critical patent/KR0122284Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
KR2019950007446U 1995-04-13 1995-04-13 반도체 소자테스트용 금속트레이 유니트 KR0122284Y1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR2019950007446U KR0122284Y1 (ko) 1995-04-13 1995-04-13 반도체 소자테스트용 금속트레이 유니트
JP4154696A JP2854276B2 (ja) 1995-04-13 1996-02-28 半導体素子テスト用のトレーユニット
US08/615,027 US5786704A (en) 1995-04-13 1996-03-13 Metallic tray unit for testing a semiconductor device
DE19613611A DE19613611B4 (de) 1995-04-13 1996-04-04 Metallmagazineinheit zum Prüfen eines Halbleiterbauelements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950007446U KR0122284Y1 (ko) 1995-04-13 1995-04-13 반도체 소자테스트용 금속트레이 유니트

Publications (2)

Publication Number Publication Date
KR960035614U true KR960035614U (ko) 1996-11-21
KR0122284Y1 KR0122284Y1 (ko) 1998-08-17

Family

ID=19411234

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950007446U KR0122284Y1 (ko) 1995-04-13 1995-04-13 반도체 소자테스트용 금속트레이 유니트

Country Status (4)

Country Link
US (1) US5786704A (ko)
JP (1) JP2854276B2 (ko)
KR (1) KR0122284Y1 (ko)
DE (1) DE19613611B4 (ko)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6244121B1 (en) * 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
JP4299383B2 (ja) * 1998-06-25 2009-07-22 株式会社アドバンテスト Ｉｃ試験装置
US6598975B2 (en) * 1998-08-19 2003-07-29 Alcon, Inc. Apparatus and method for measuring vision defects of a human eye
JP3553460B2 (ja) * 1999-04-23 2004-08-11 ディーイー、エンド、ティー 株式会社 Ｌｃｄテスト装置
US6464513B1 (en) 2000-01-05 2002-10-15 Micron Technology, Inc. Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same
US6407566B1 (en) 2000-04-06 2002-06-18 Micron Technology, Inc. Test module for multi-chip module simulation testing of integrated circuit packages
US7045889B2 (en) * 2001-08-21 2006-05-16 Micron Technology, Inc. Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate
US7049693B2 (en) * 2001-08-29 2006-05-23 Micron Technology, Inc. Electrical contact array for substrate assemblies
US20050233770A1 (en) * 2002-02-06 2005-10-20 Ramsey Craig C Wireless substrate-like sensor
US20050224899A1 (en) * 2002-02-06 2005-10-13 Ramsey Craig C Wireless substrate-like sensor
US7289230B2 (en) * 2002-02-06 2007-10-30 Cyberoptics Semiconductors, Inc. Wireless substrate-like sensor
US20050224902A1 (en) * 2002-02-06 2005-10-13 Ramsey Craig C Wireless substrate-like sensor
US7893697B2 (en) * 2006-02-21 2011-02-22 Cyberoptics Semiconductor, Inc. Capacitive distance sensing in semiconductor processing tools
WO2007098149A2 (en) * 2006-02-21 2007-08-30 Cyberoptics Semiconductor, Inc. Capacitive distance sensing in semiconductor processing tools
DE112007002309T5 (de) * 2006-09-29 2009-07-30 Cyberoptics Semiconductor, Inc., Beaverton Substratähnlicher Teilchensensor
US7778793B2 (en) * 2007-03-12 2010-08-17 Cyberoptics Semiconductor, Inc. Wireless sensor for semiconductor processing systems
US20080246493A1 (en) * 2007-04-05 2008-10-09 Gardner Delrae H Semiconductor Processing System With Integrated Showerhead Distance Measuring Device
US20090015268A1 (en) * 2007-07-13 2009-01-15 Gardner Delrae H Device and method for compensating a capacitive sensor measurement for variations caused by environmental conditions in a semiconductor processing environment
JP2010151794A (ja) * 2008-11-27 2010-07-08 Panasonic Corp 電子部品試験装置
EP2480371B1 (en) * 2009-09-26 2017-06-28 Centipede Systems, Inc. Carrier for holding microelectronic devices
US8970244B2 (en) * 2009-09-26 2015-03-03 Centipede Systems, Inc. Transport apparatus for moving carriers of test parts

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3354394A (en) * 1964-08-06 1967-11-21 Texas Instruments Inc Receptacle for transistors or integrated circuits to be tested
US3568263A (en) * 1969-10-07 1971-03-09 Illinois Tool Works Fastener
US3963315A (en) * 1975-04-07 1976-06-15 Lockhead Missiles & Space Company, Inc. Semiconductor chip carrier and testing fixture
US5024747A (en) * 1979-12-21 1991-06-18 Varian Associates, Inc. Wafer coating system
JPS5785229A (en) * 1980-11-17 1982-05-27 Toshiba Corp Casette holding device for electron beam exposure
US4537059A (en) * 1983-08-12 1985-08-27 Advanced Micro Devices, Inc. Automatic brushing machine
JPS60116250U (ja) * 1984-01-11 1985-08-06 太陽誘電株式会社 電気部品の収容装置
SU1226696A1 (ru) * 1984-04-05 1986-04-23 Предприятие П/Я В-8574 Многоконтактное подключающее устройство
US4940935A (en) * 1989-08-28 1990-07-10 Ried Ashman Manufacturing Automatic SMD tester
JP2547022Y2 (ja) * 1990-10-12 1997-09-03 株式会社アドバンテスト Ｉｃ試験装置
JP2637647B2 (ja) * 1991-08-30 1997-08-06 山一電機 株式会社 Ｉｃキャリア又はｉｃソケット
JP2821046B2 (ja) * 1991-09-05 1998-11-05 三菱電機エンジニアリング株式会社 半導体素子用特性検査装置
JP3307470B2 (ja) * 1993-04-05 2002-07-24 三菱電機株式会社 半導体検査装置
US5539676A (en) * 1993-04-15 1996-07-23 Tokyo Electron Limited Method of identifying probe position and probing method in prober
JP2963603B2 (ja) * 1993-05-31 1999-10-18 東京エレクトロン株式会社 プローブ装置のアライメント方法
US5523696A (en) * 1993-06-14 1996-06-04 International Business Machines Corp. Method and apparatus for testing integrated circuit chips
JPH07165287A (ja) * 1993-12-09 1995-06-27 Gold Kogyo Kk 精密部品搬送用トレー

Also Published As

Publication number Publication date
DE19613611A1 (de) 1996-10-17
JP2854276B2 (ja) 1999-02-03
JPH08295392A (ja) 1996-11-12
DE19613611B4 (de) 2006-02-23
US5786704A (en) 1998-07-28
KR0122284Y1 (ko) 1998-08-17

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