KR960030435A - 신규한 바이폴라 트랜지스터 및 그의 제조방법 - Google Patents

신규한 바이폴라 트랜지스터 및 그의 제조방법 Download PDF

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KR960030435A
KR960030435A KR1019950000788A KR19950000788A KR960030435A KR 960030435 A KR960030435 A KR 960030435A KR 1019950000788 A KR1019950000788 A KR 1019950000788A KR 19950000788 A KR19950000788 A KR 19950000788A KR 960030435 A KR960030435 A KR 960030435A
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layer
electrode
single crystal
base
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KR1019950000788A
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KR0155220B1 (ko
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손정환
홍성철
권영세
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심상철
한국과학기술원
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73Bipolar junction transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0821Collector regions of bipolar transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41708Emitter or collector electrodes for bipolar transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42304Base electrodes for bipolar transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66234Bipolar junction transistors [BJT]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1004Base region of bipolar transistors

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Bipolar Transistors (AREA)

Abstract

본 발명은 바이폴라 트랜지스터(bipolar transistor) 및 그의 제조 방법에 관한 것이다. 좀 더 구체적으로, 본 발명은 베이스와 콜렉터간의 정전용량이 대폭적으로 감소된 바이폴라 트랜지스터 및 선택적 에피택시 공정을 이용하여 전기 바이폴라 트랜지스터를 제조하는 방법에 관한 것이다. 본 발병의 바이폴라 트랜지스터는 선택적 에피택시 공정시 에피층의 성장을 방해하도록 단결정 기판(41) 상에 수평방향(단결정기판의 110방향)과 10°내지 40°의 각을 이루면서 유전체 박막으로 형성된 마스크(20); 전기 마스크(20)의 상부에 형성되며 베이스-콜렉터간의 정전용량을 감소시켜 주기 위한 빈 공간(31); 단결정 기판 위에 형성된 서브 콜렉터층(42), 콜렉터층(43), 베이스층(44), 에미터층(45), 및 에미터 캡층(46);및, 에미터 전극(48), 베이스전극(49) 및 콜렉터 전극(47)을 포함하여, 마스크 형성공정, 선택적 에피택시공정, 식각 및 전극형성공정에 의해 제조되고, 본 발명에 의해 콜렉터가 절연기판 내부에 묻히지 않는 구조를 지니면서도 효과적으로 베이스-콜렉터간의 정전용량을 대폭적으로 감소시킴으로써, 동작속도가 향상된 바이폴라 트랜지스터를 간단한 공정에 의해 제조할 수 있다는 것이 확인되었다.

Description

신규한 바이폴라 트랜지스터 및 그의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도는 본 발명의 바이폴라 트랜지스터에 대한 제조공정을 순차적으로 도시한 제조과정이다.

Claims (4)

  1. 선택적 에피택시 공정시 에피층의 성장을 방해하도록 단결정 기판(41) 상에 수평방샹(단결정기판의 110방향)과 10°내지 40°의 각을 이루면서 유전체박막으로 형성된 마스크(20); 전기 마스크(20)의 상부에 형성되며 베이스-콜렉터간의 정전용량을 감소시켜 주기 위한 빈 공간(31); 단결정 기판 위에 형성된 서브 콜렉터층(42), 콜렉터층(43), 베이스층(44), 에미터층(45), 및 에미터 캡층(46);및, 에미터 전극(48), 베이스전극(49) 및 콜렉터 전극(47)을 포함하는 바이폴라 트랜지스터.
  2. (i) 단결정 기판 상에 유전체 박막을 사용하여 수평방향(단결정 기판의 110방향)과 10°내지 40°의 각을 이루어 마스크를 형성하는 공정; (ii) 전기 마스크의 상부에 빈 공간이 형성되도록 선택적 에피택시 공정에 의해 서브 콜렉터층, 콜렉터층, 베이스층, 에미터층 및 에미터 캡층을 형성하는 공정; 및, (iii) 에미터 전극, 베이스 전극 및 콜렉터 전극을 형성하기 위한 식각 및 전극형성공정을 포함하는 바이폴라 트랜지스터 제조방법.
  3. 제2항에 있어서, 단결정 기판으로는 GaAs기판, InP기판, GaP기판 및 Si기판으로부터 선택된 1종의 기판을 사용하는 것을 특징으로 하는 바이폴라 트랜지스터 제조방법.
  4. 제2항에 있어서, 선택적 에피택시 공정으로는 유기금속화학 증착법, 분자선 에피택시 공정, 기상에피택시 공정 및 액상에피택시 공정으로부터 선택된 1종을 사용하는 것을 특징으로 하는 바이폴라 트랜지스터의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950000788A 1995-01-18 1995-01-18 신규한 바이폴라 트랜지스터 및 그의 제조방법 KR0155220B1 (ko)

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KR1019950000788A KR0155220B1 (ko) 1995-01-18 1995-01-18 신규한 바이폴라 트랜지스터 및 그의 제조방법

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KR1019950000788A KR0155220B1 (ko) 1995-01-18 1995-01-18 신규한 바이폴라 트랜지스터 및 그의 제조방법

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KR960030435A true KR960030435A (ko) 1996-08-17
KR0155220B1 KR0155220B1 (ko) 1998-10-15

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