KR960028747A - 전기장치 - Google Patents

전기장치 Download PDF

Info

Publication number
KR960028747A
KR960028747A KR1019950072134A KR19950072134A KR960028747A KR 960028747 A KR960028747 A KR 960028747A KR 1019950072134 A KR1019950072134 A KR 1019950072134A KR 19950072134 A KR19950072134 A KR 19950072134A KR 960028747 A KR960028747 A KR 960028747A
Authority
KR
South Korea
Prior art keywords
circuit boards
connection
electrical
electrical device
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019950072134A
Other languages
English (en)
Korean (ko)
Inventor
슈프 칼
야레스 페터
칼 디터
하르쉬 마르쿠스
Original Assignee
랄프 흘거 베렌스; 만프레드 크네취
로베르트 보쉬 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 랄프 흘거 베렌스; 만프레드 크네취, 로베르트 보쉬 게엠베하 filed Critical 랄프 흘거 베렌스; 만프레드 크네취
Publication of KR960028747A publication Critical patent/KR960028747A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Combinations Of Printed Boards (AREA)
  • Control Of Electric Motors In General (AREA)
KR1019950072134A 1994-12-24 1995-12-21 전기장치 Withdrawn KR960028747A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4446594A DE4446594A1 (de) 1994-12-24 1994-12-24 Elektrisches Gerät
DEP4446594.7 1994-12-24

Publications (1)

Publication Number Publication Date
KR960028747A true KR960028747A (ko) 1996-07-22

Family

ID=6537118

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950072134A Withdrawn KR960028747A (ko) 1994-12-24 1995-12-21 전기장치

Country Status (5)

Country Link
JP (1) JPH08236893A (enrdf_load_stackoverflow)
KR (1) KR960028747A (enrdf_load_stackoverflow)
DE (1) DE4446594A1 (enrdf_load_stackoverflow)
GB (1) GB2296604A (enrdf_load_stackoverflow)
IT (2) ITMI950829U3 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100441568B1 (ko) * 2001-11-16 2004-07-23 한스타 디스플레이 코퍼레이션 열소산 구조물

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2119276C1 (ru) * 1997-11-03 1998-09-20 Закрытое акционерное общество "Техно-ТМ" Трехмерный гибкий электронный модуль
DE29819349U1 (de) * 1998-10-30 1999-12-09 Siemens AG, 80333 München Halbleiter-Schaltungsanordnung, insbesondere Hochstromumrichter mit niedriger Zwischenkreisspannung
JP4556174B2 (ja) 2004-12-15 2010-10-06 日本電気株式会社 携帯端末機器及び放熱方法
TWI357802B (en) * 2008-08-07 2012-02-01 Arcadyan Technology Corp Fixing cooling unit and electronic device having f
EP2180774B1 (en) * 2008-10-21 2013-08-07 Moxa Inc. Heat-dissipating structure for expansion board architecture
JP5161192B2 (ja) * 2009-11-06 2013-03-13 三菱電機株式会社 パワー回路配線構造
JP5652453B2 (ja) * 2012-09-28 2015-01-14 株式会社村田製作所 複合モジュールおよびこれを備えた電子機器
JP5765357B2 (ja) * 2013-03-22 2015-08-19 カシオ計算機株式会社 回路基板構造、及び電子機器
JP7072387B2 (ja) * 2018-01-11 2022-05-20 長野日本無線株式会社 基板連結装置及び基板連結方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1081526A (en) * 1965-05-17 1967-08-31 Standard Telephones Cables Ltd Housing assembly for circuit boards
GB1604368A (en) * 1978-05-31 1981-12-09 Ard Tech Ass Eng Printed circuit board support system
GB2137422B (en) * 1983-03-30 1986-10-29 Ferranti Plc Printed circuit board
GB2192758B (en) * 1986-07-18 1990-03-28 Anamartic Ltd A modular high-density packaging scheme for wsi components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100441568B1 (ko) * 2001-11-16 2004-07-23 한스타 디스플레이 코퍼레이션 열소산 구조물

Also Published As

Publication number Publication date
ITMI952531A1 (it) 1997-06-01
DE4446594A1 (de) 1996-06-27
GB9526253D0 (en) 1996-02-21
GB2296604A (en) 1996-07-03
ITMI952531A0 (enrdf_load_stackoverflow) 1995-12-01
IT1282804B1 (it) 1998-03-31
JPH08236893A (ja) 1996-09-13
ITMI950829U3 (it) 1997-06-02
ITMI952531A3 (it) 1996-06-24
ITMI950829V0 (it) 1995-12-01

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19951221

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid