KR960023261A - 유기방청처리구리박 - Google Patents
유기방청처리구리박 Download PDFInfo
- Publication number
- KR960023261A KR960023261A KR1019950046294A KR19950046294A KR960023261A KR 960023261 A KR960023261 A KR 960023261A KR 1019950046294 A KR1019950046294 A KR 1019950046294A KR 19950046294 A KR19950046294 A KR 19950046294A KR 960023261 A KR960023261 A KR 960023261A
- Authority
- KR
- South Korea
- Prior art keywords
- copper foil
- layer
- organic
- rust preventive
- benzotriazole
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/82—After-treatment
- C23C22/83—Chemical after-treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0591—Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12542—More than one such component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12542—More than one such component
- Y10T428/12549—Adjacent to each other
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12611—Oxide-containing component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12785—Group IIB metal-base component
- Y10T428/12792—Zn-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
Abstract
본 발명은, 회로기판재료로서 사용되는 구리박의 제성능을 저하시키는 일없이, 레진스폿의 발생을 방지한 유기방청처리구리박을 제공하는 것을 목적으로 하며, 그 구성에 있어서, 구리박의 기재와의 비접착면에, 금속 방청층을 가지고, 이 금속방청층위에 벤조트리아졸 또는 그 유도체, 아미노트리아졸 또는 그 이성체 또는 유도체로부터 선택되는 적어도 2종의 혼합체에 의한 유기방청처리층이 형성되어 있거나, 이 금속방청층위에 크로메이트처리층, 이 크로메이트처리층위에 벤조트리아졸 또는 그 유도체, 아미노트리아졸 또는 그 이성체 또는 유도체로부터 선택되는 적어도 2종의 혼합체에 의한 유기방청처리층이 형성되어 있는 것을 특징으로 한 것이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (2)
- 구리박의 기재와의 비접착면에, 금속방청층을 가지고, 이 금속방청층위에 벤조트리아졸 또는 그 유도체, 아미노트리아졸 또는 그 이성체 또는 유도체로부터 선택되는 적어도 2종의 혼합체에 의한 유기방청처리층이 형성되어 있는 것을 특징으로 하는 유기방청처리구리박.
- 구리박의 기재와의 비접착면에 금속방청층을 가지고 이 금속방청층위에 크로메이트처리층, 이 크로메이트처리층위에 벤조트리아졸 또는 그 유도체, 아미노트리아졸 또는 이성체 또는 유도체로부터 선택되는 적어도 2종의 혼합체에 의한 유기방청처리층이 형성되어 있는 것을 특징으로 하는 유기방청처리구리박.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32929494A JP3224704B2 (ja) | 1994-12-05 | 1994-12-05 | 有機防錆処理銅箔 |
JP94-329294 | 1994-12-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960023261A true KR960023261A (ko) | 1996-07-18 |
KR0158973B1 KR0158973B1 (ko) | 1999-01-15 |
Family
ID=18219861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950046294A KR0158973B1 (ko) | 1994-12-05 | 1995-12-04 | 유기방청처리구리박 |
Country Status (12)
Country | Link |
---|---|
US (1) | US6071629A (ko) |
EP (1) | EP0716164B1 (ko) |
JP (1) | JP3224704B2 (ko) |
KR (1) | KR0158973B1 (ko) |
CN (1) | CN1059244C (ko) |
DE (1) | DE69502375T2 (ko) |
ES (1) | ES2115294T3 (ko) |
FI (1) | FI955831A (ko) |
HK (1) | HK1010792A1 (ko) |
MY (1) | MY118391A (ko) |
SG (1) | SG34317A1 (ko) |
TW (1) | TW303393B (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6299721B1 (en) | 1998-12-14 | 2001-10-09 | Gould Electronics Incl | Coatings for improved resin dust resistance |
JP3370624B2 (ja) * | 1999-08-24 | 2003-01-27 | 三井金属鉱業株式会社 | キャリア箔付電解銅箔及びその電解銅箔を使用した銅張積層板 |
JP4556312B2 (ja) * | 2000-09-21 | 2010-10-06 | 株式会社村田製作所 | セラミック積層電子部品およびその製造方法 |
JP4379854B2 (ja) * | 2001-10-30 | 2009-12-09 | 日鉱金属株式会社 | 表面処理銅箔 |
JP2004238647A (ja) * | 2003-02-04 | 2004-08-26 | Furukawa Techno Research Kk | 平滑化銅箔とその製造方法 |
US6964884B1 (en) * | 2004-11-19 | 2005-11-15 | Endicott Interconnect Technologies, Inc. | Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same |
US7383629B2 (en) * | 2004-11-19 | 2008-06-10 | Endicott Interconnect Technologies, Inc. | Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof |
JP5919656B2 (ja) * | 2011-06-14 | 2016-05-18 | 大日本印刷株式会社 | 太陽電池用集電シートの配線パターン形成用の導電性基材 |
EP2722417B1 (en) | 2011-06-14 | 2018-06-27 | Dai Nippon Printing Co., Ltd. | Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells |
US9508951B2 (en) | 2012-07-24 | 2016-11-29 | Mitsui Mining & Smelting Co., Ltd. | Electrode foil and organic light-emitting device |
CN107719223A (zh) * | 2017-09-21 | 2018-02-23 | 柳州环山科技有限公司 | 一种可防锈快速多向旋拧拉钩 |
CN108503910B (zh) * | 2018-03-14 | 2020-10-09 | 沈阳防锈包装材料有限责任公司 | 防锈橡胶及其制备方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3645772A (en) * | 1970-06-30 | 1972-02-29 | Du Pont | Process for improving bonding of a photoresist to copper |
US3716421A (en) * | 1971-03-19 | 1973-02-13 | Gte Sylvania Inc | Compositions for improved solderability of copper |
US3803049A (en) * | 1971-06-14 | 1974-04-09 | Sherwin Williams Co | Benzotriazole and tolyltriazole mixtures |
US4357396A (en) * | 1981-01-26 | 1982-11-02 | Ppg Industries, Inc. | Silver and copper coated articles protected by treatment with mercapto and/or amino substituted thiadiazoles or mercapto substituted triazoles |
AU550412B2 (en) * | 1981-03-20 | 1986-03-20 | Goodyear Tire And Rubber Company, The | Tyre cord |
JPS60218484A (ja) * | 1984-04-12 | 1985-11-01 | Denki Kagaku Kogyo Kk | 表面処理方法 |
US4902734A (en) * | 1985-12-02 | 1990-02-20 | Ciba-Geigy Corporation | Acid-curable thermoset enamels containing a triazole |
US4705642A (en) * | 1986-06-09 | 1987-11-10 | Texaco Inc. | Haze, oxidation, and corrosion resistant diesel engine lubricant |
DE3620025A1 (de) * | 1986-06-13 | 1987-12-17 | Henkel Kgaa | Verwendung von acylierten 3-amino-1,2,4-triazolen als korrosionsinhibitoren fuer buntmetalle |
JPH03211298A (ja) * | 1990-01-12 | 1991-09-17 | Chiyoda Kagaku Kenkyusho:Kk | めっき性に優れる銅又は銅合金の表面処理剤 |
AU7845191A (en) * | 1990-06-18 | 1991-12-19 | Merck & Co., Inc. | Inhibitors of HIV reverse transcriptase |
US5746947A (en) * | 1990-06-20 | 1998-05-05 | Calgon Corporation | Alkylbenzotriazole compositions and the use thereof as copper and copper alloy corrosion inhibitors |
DE4039271A1 (de) * | 1990-12-08 | 1992-06-11 | Basf Ag | Verfahren zum schutz von kupfer- und kupferlegierungsoberlfaechen vor korrosion |
JPH068417A (ja) * | 1992-06-26 | 1994-01-18 | Canon Inc | インクジェット記録装置 |
JPH0685455A (ja) | 1992-08-28 | 1994-03-25 | Nikko Guurudo Foil Kk | 印刷回路用銅箔の表面処理方法 |
JPH0685417A (ja) | 1992-08-28 | 1994-03-25 | Nikko Guurudo Foil Kk | 印刷回路用銅箔の表面処理方法 |
BR9304871A (pt) * | 1992-11-30 | 1994-06-21 | Nalco Chemical Co | Processo para evitar a corrosao das superficies de latao em contacto com a água, que contém microorganismos, de um sistema ou torre de refrigeraçáo de água |
JP3329572B2 (ja) * | 1994-04-15 | 2002-09-30 | 福田金属箔粉工業株式会社 | 印刷回路用銅箔およびその表面処理方法 |
TW256858B (en) * | 1994-08-30 | 1995-09-11 | Mitsui Mining & Smelting Co | Copper foil for printed circuit board |
JP3618124B2 (ja) * | 1994-10-27 | 2005-02-09 | 旭化成ケミカルズ株式会社 | 硬化剤組成物及び一液塗料用組成物 |
-
1994
- 1994-12-05 JP JP32929494A patent/JP3224704B2/ja not_active Expired - Fee Related
-
1995
- 1995-01-10 TW TW084100146A patent/TW303393B/zh not_active IP Right Cessation
- 1995-06-21 MY MYPI95001673A patent/MY118391A/en unknown
- 1995-06-27 DE DE69502375T patent/DE69502375T2/de not_active Expired - Fee Related
- 1995-06-27 ES ES95110001T patent/ES2115294T3/es not_active Expired - Lifetime
- 1995-06-27 EP EP95110001A patent/EP0716164B1/en not_active Expired - Lifetime
- 1995-12-01 SG SG1995002003A patent/SG34317A1/en unknown
- 1995-12-04 KR KR1019950046294A patent/KR0158973B1/ko not_active IP Right Cessation
- 1995-12-04 CN CN95120208A patent/CN1059244C/zh not_active Expired - Fee Related
- 1995-12-04 FI FI955831A patent/FI955831A/fi unknown
-
1997
- 1997-01-17 US US08/785,688 patent/US6071629A/en not_active Expired - Fee Related
-
1998
- 1998-11-06 HK HK98111824A patent/HK1010792A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1059244C (zh) | 2000-12-06 |
JPH08158074A (ja) | 1996-06-18 |
ES2115294T3 (es) | 1998-06-16 |
SG34317A1 (en) | 1996-12-06 |
DE69502375T2 (de) | 1998-10-29 |
US6071629A (en) | 2000-06-06 |
EP0716164A1 (en) | 1996-06-12 |
CN1131205A (zh) | 1996-09-18 |
HK1010792A1 (en) | 1999-06-25 |
JP3224704B2 (ja) | 2001-11-05 |
DE69502375D1 (de) | 1998-06-10 |
MY118391A (en) | 2004-10-30 |
FI955831A0 (fi) | 1995-12-04 |
FI955831A (fi) | 1996-06-06 |
KR0158973B1 (ko) | 1999-01-15 |
EP0716164B1 (en) | 1998-05-06 |
TW303393B (ko) | 1997-04-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR960023261A (ko) | 유기방청처리구리박 | |
ES2189529T3 (es) | Combinaciones de inhiidores para el transporte de acidos biliares en el ileon y agentes complejantes para indicaciones cardiovasculares. | |
DE69422591T2 (de) | Antikorrosionsfilm mit aufgearbeitetem Harz | |
RU94033487A (ru) | 3-арил-бензофураноны в качестве стабилизаторов | |
ES2068803T1 (es) | Aditivo para evitar la corrosion de metales en materiales de construccion, procedimiento para la fabricacion de materiales de construccion utilizando el inhibidor de corrosion y materiales de construccion que contienen el inhibidor de corrosion. | |
ATE215625T1 (de) | Verwendung einer zusammensetzung oder vormischung basierend auf flüchtigen korrosionsinhibitoren, zusammensetzung oder vormischung, gegenstände, die diese enthalten | |
EP0806448A3 (en) | Gas barrier resin film | |
MXPA03009934A (es) | Pelicula de acido polilactico (pla) con buenas propiedades antiestaticas. | |
ES2018355B3 (es) | Producto compuesto con envoltura tubular para el tratamiento de baños metalicos fundidos. | |
ECSP931000A (es) | Aditivo adecuado para usarse en fluidos de perforacion, completacion o reacondicionamiento | |
CL2004000219A1 (es) | Compuestos derivados de 2-iminotiazolidina; composicion farmaceutica que lo comprende; un proceso para la preparacion de dicha composicion; y su uso para el tratamiento de la obesidad. | |
KR960031584A (ko) | 세정제조성물 및 세정방법 | |
KR900009949A (ko) | 공비 혼합 조성물 및 그것으로 고체 표면을 세척하는 방법 | |
DE59611506D1 (de) | Tränk-, verguss- und überzugsmassen | |
ES2100170T3 (es) | Agentes antiincrustantes de baja toxicidad no organoestannicos. | |
KR920006112A (ko) | 방수 고무 시이트 | |
KR890015815A (ko) | 1,1-디플루오로-2,2-디클로로에탄 및 아세톤의 공비 조성물들 | |
TW256858B (en) | Copper foil for printed circuit board | |
ES2135509T3 (es) | Composicion liquida que tiene un efecto de repelencia de polillas. | |
ATE325712T1 (de) | Mehrschichtstrukturen | |
BR9812551A (pt) | Substratos termoplásticos de hidrocarnonetos saturados amorfos de aderência melhorada | |
ATE191398T1 (de) | Wand- oder möbelverkleidung, insbesondere wandtapete | |
ES2123943T3 (es) | Sistema de lacas de dos componentes. | |
KR970058473A (ko) | 전자파 차폐 재료 | |
IT1264533B1 (it) | Pigmento antivegetativo a base di chelati metallici |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20090724 Year of fee payment: 12 |
|
LAPS | Lapse due to unpaid annual fee |