KR960008558B1 - Low resistance contact structure and manufacturing method of high integrated semiconductor device - Google Patents

Low resistance contact structure and manufacturing method of high integrated semiconductor device Download PDF

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Publication number
KR960008558B1
KR960008558B1 KR93010423A KR930010423A KR960008558B1 KR 960008558 B1 KR960008558 B1 KR 960008558B1 KR 93010423 A KR93010423 A KR 93010423A KR 930010423 A KR930010423 A KR 930010423A KR 960008558 B1 KR960008558 B1 KR 960008558B1
Authority
KR
South Korea
Prior art keywords
layer
semiconductor device
contact structure
low resistance
integrated semiconductor
Prior art date
Application number
KR93010423A
Other languages
English (en)
Other versions
KR940022708A (ko
Inventor
Sang-Inn Lee
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority to KR93010423A priority Critical patent/KR960008558B1/ko
Publication of KR940022708A publication Critical patent/KR940022708A/ko
Application granted granted Critical
Publication of KR960008558B1 publication Critical patent/KR960008558B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45—Ohmic electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
    • H01L21/28525—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System the conductive layers comprising semiconducting material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45—Ohmic electrodes
    • H01L29/456—Ohmic electrodes on silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
KR93010423A 1993-03-02 1993-06-09 Low resistance contact structure and manufacturing method of high integrated semiconductor device KR960008558B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR93010423A KR960008558B1 (en) 1993-03-02 1993-06-09 Low resistance contact structure and manufacturing method of high integrated semiconductor device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR930002962 1993-03-02
KR93-2962 1993-03-02
KR93010423A KR960008558B1 (en) 1993-03-02 1993-06-09 Low resistance contact structure and manufacturing method of high integrated semiconductor device

Publications (2)

Publication Number Publication Date
KR940022708A KR940022708A (ko) 1994-10-21
KR960008558B1 true KR960008558B1 (en) 1996-06-28

Family

ID=19351437

Family Applications (1)

Application Number Title Priority Date Filing Date
KR93010423A KR960008558B1 (en) 1993-03-02 1993-06-09 Low resistance contact structure and manufacturing method of high integrated semiconductor device

Country Status (7)

Country Link
US (1) US5563448A (ko)
JP (1) JP3644983B2 (ko)
KR (1) KR960008558B1 (ko)
CA (1) CA2116746C (ko)
DE (1) DE4406861B4 (ko)
GB (1) GB2275822B (ko)
RU (1) RU2155417C2 (ko)

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US5668055A (en) * 1995-05-05 1997-09-16 Applied Materials, Inc. Method of filling of contact openings and vias by self-extrusion of overlying compressively stressed matal layer
US6239492B1 (en) * 1996-05-08 2001-05-29 Micron Technology, Inc. Semiconductor structure with a titanium aluminum nitride layer and method for fabricating same
JP2970555B2 (ja) * 1996-10-28 1999-11-02 日本電気株式会社 半導体装置の製造方法及び製造装置
US6121126A (en) 1998-02-25 2000-09-19 Micron Technologies, Inc. Methods and structures for metal interconnections in integrated circuits
US5920121A (en) * 1998-02-25 1999-07-06 Micron Technology, Inc. Methods and structures for gold interconnections in integrated circuits
US6143655A (en) * 1998-02-25 2000-11-07 Micron Technology, Inc. Methods and structures for silver interconnections in integrated circuits
US6075291A (en) * 1998-02-27 2000-06-13 Micron Technology, Inc. Structure for contact formation using a silicon-germanium alloy
US6492694B2 (en) 1998-02-27 2002-12-10 Micron Technology, Inc. Highly conductive composite polysilicon gate for CMOS integrated circuits
US6815303B2 (en) * 1998-04-29 2004-11-09 Micron Technology, Inc. Bipolar transistors with low-resistance emitter contacts
KR100559029B1 (ko) * 1998-12-29 2006-06-16 주식회사 하이닉스반도체 반도체 소자의 메탈 콘택 형성 방법
US6535413B1 (en) * 2000-08-31 2003-03-18 Micron Technology, Inc. Method of selectively forming local interconnects using design rules
KR100393208B1 (ko) 2001-01-15 2003-07-31 삼성전자주식회사 도핑된 다결정 실리콘-저매니움막을 이용한 반도체 소자및 그 제조방법
TWI262561B (en) * 2001-06-12 2006-09-21 Promos Technologies Inc Method of forming ultra-shallow junction devices and its application in a memory device
US6511905B1 (en) * 2002-01-04 2003-01-28 Promos Technologies Inc. Semiconductor device with Si-Ge layer-containing low resistance, tunable contact
KR100442106B1 (ko) * 2002-06-26 2004-07-27 삼성전자주식회사 도전성 콘택 구조 및 그 제조방법
US7084423B2 (en) 2002-08-12 2006-08-01 Acorn Technologies, Inc. Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
US6833556B2 (en) 2002-08-12 2004-12-21 Acorn Technologies, Inc. Insulated gate field effect transistor having passivated schottky barriers to the channel
JP4997913B2 (ja) * 2006-10-17 2012-08-15 日産自動車株式会社 半導体装置および半導体装置の製造方法
JP2010161250A (ja) * 2009-01-09 2010-07-22 Tokyo Electron Ltd 半導体装置の製造方法及び半導体装置
JP2010231172A (ja) * 2009-03-04 2010-10-14 Seiko Epson Corp 光学物品およびその製造方法
JP2012032690A (ja) 2010-08-02 2012-02-16 Seiko Epson Corp 光学物品およびその製造方法
EP2461352B1 (en) 2010-12-06 2013-07-10 Imec Method of manufacturing low resistivity contacts on n-type germanium
WO2013077954A1 (en) 2011-11-23 2013-05-30 Acorn Technologies, Inc. Improving metal contacts to group iv semiconductors by inserting interfacial atomic monolayers
US9620611B1 (en) 2016-06-17 2017-04-11 Acorn Technology, Inc. MIS contact structure with metal oxide conductor
US10170627B2 (en) 2016-11-18 2019-01-01 Acorn Technologies, Inc. Nanowire transistor with source and drain induced by electrical contacts with negative schottky barrier height
JP2021136269A (ja) * 2020-02-25 2021-09-13 キオクシア株式会社 半導体装置
KR20220030456A (ko) 2020-09-01 2022-03-11 삼성전자주식회사 반도체 장치

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
US3473093A (en) * 1965-08-18 1969-10-14 Ibm Semiconductor device having compensated barrier zones between n-p junctions
US3599060A (en) * 1968-11-25 1971-08-10 Gen Electric A multilayer metal contact for semiconductor device
JPS59175763A (ja) * 1983-03-25 1984-10-04 Fujitsu Ltd 半導体装置
US4738937A (en) * 1985-10-22 1988-04-19 Hughes Aircraft Company Method of making ohmic contact structure
US4796081A (en) * 1986-05-02 1989-01-03 Advanced Micro Devices, Inc. Low resistance metal contact for silicon devices
JPS62259469A (ja) * 1986-05-06 1987-11-11 Hitachi Ltd 半導体装置
JPS6373660A (ja) * 1986-09-17 1988-04-04 Fujitsu Ltd 半導体装置
US4994410A (en) * 1988-04-04 1991-02-19 Motorola, Inc. Method for device metallization by forming a contact plug and interconnect using a silicide/nitride process
US5126805A (en) * 1989-11-24 1992-06-30 Gte Laboratories Incorporated Junction field effect transistor with SiGe contact regions
JP3061406B2 (ja) * 1990-09-28 2000-07-10 株式会社東芝 半導体装置
JPH04196420A (ja) * 1990-11-28 1992-07-16 Nec Corp 半導体装置の構造及び製造方法
US5108954A (en) * 1991-09-23 1992-04-28 Micron Technology, Inc. Method of reducing contact resistance at silicide/active area interfaces and semiconductor devices produced according to the method
US5422307A (en) * 1992-03-03 1995-06-06 Sumitomo Electric Industries, Ltd. Method of making an ohmic electrode using a TiW layer and an Au layer
US5242847A (en) * 1992-07-27 1993-09-07 North Carolina State University At Raleigh Selective deposition of doped silion-germanium alloy on semiconductor substrate
US5232873A (en) * 1992-10-13 1993-08-03 At&T Bell Laboratories Method of fabricating contacts for semiconductor devices

Also Published As

Publication number Publication date
GB2275822B (en) 1997-10-08
CA2116746C (en) 2006-12-12
CA2116746A1 (en) 1994-09-03
KR940022708A (ko) 1994-10-21
US5563448A (en) 1996-10-08
JPH06302542A (ja) 1994-10-28
JP3644983B2 (ja) 2005-05-11
GB9403816D0 (en) 1994-04-20
RU2155417C2 (ru) 2000-08-27
GB2275822A (en) 1994-09-07
DE4406861B4 (de) 2005-01-20
DE4406861A1 (de) 1994-09-08

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