KR950702220A - 표면 실장용 도전성 접착제(Surface Mount Conductive Adhesives) - Google Patents

표면 실장용 도전성 접착제(Surface Mount Conductive Adhesives)

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Publication number
KR950702220A
KR950702220A KR1019940704635A KR19940704635A KR950702220A KR 950702220 A KR950702220 A KR 950702220A KR 1019940704635 A KR1019940704635 A KR 1019940704635A KR 19940704635 A KR19940704635 A KR 19940704635A KR 950702220 A KR950702220 A KR 950702220A
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South Korea
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weight
adhesive composition
conductive adhesive
parts
composition according
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KR1019940704635A
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English (en)
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KR100289781B1 (ko
Inventor
엘. 프렌첼 리챠드
알렌 스코트
Original Assignee
로버트 에이. 쿨버슨
아체슨 인더스트리이스 인코포레이티드
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Publication of KR950702220A publication Critical patent/KR950702220A/ko
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Publication of KR100289781B1 publication Critical patent/KR100289781B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/06—Sulfur
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/147—Polyurethanes; Polyureas
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)

Abstract

본 발명은 표면 실장용 도전성 접착제 조성물에 있어서, (가) 아크릴레이트계 우레탄수지, 아크릴수지 및 이들의 혼합물 중에서 선택되는 결합제 수지, 2 내지 15중량부; (나) 아크릴레이트 단량체, 2 내지 15중량부; (다) 유리 라디칼 개시제, 0.01 내지 3중량부; 및 (라) 미분된 은 입자, 72 내지 95중량부를 포함하여 이루어지는 것을 특징으로 하는 도전성 접착제 조성물을 제공한다.

Description

표면 실장용 도전성 접착제(Surface Mount Conductive Adhesives)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (12)

  1. 표면 실장용 도전성 접착제 조성물에 있어서, (가) 아크릴레이트계 우레탄수지, 아크릴수지 및 이들의 혼합물 중에서 선택되는 결합제 수지, 2 내지 15중량부; (나) 아크릴레이트 단량체, 2 내지 15중량부; (다) 유리 라디칼 개시제, 0.01 내지 3중량부; 및 (라) 미분된 은 입자, 72 내지 95중량부를 포함하여 이루어지는 것을 특징으로 하는 도전성 접착제 조성물.
  2. 제1항에 있어서, (마) 리올로지 조절제 0.1 내지 10중량을 더욱 포함하여 이루어지는 것을 특징으로 하는 도전성 접착제 조성물.
  3. 제1항에 있어서, 상기한 결합제 수지가 아크릴수지인 것을 특징으로 하는 도전성 접착제 조성물.
  4. 제1항에 있어서, 상기한 결합제 수지가 아크릴레이트계 우레탄수지인 것을 특징으로 하는 도전성 접착제 조성물.
  5. 제1항에 있어서, 상기한 아크릴레이트 단량체가 디아크릴레이트 단량체인 것을 특징으로 하는 도전성 접착제 조성물.
  6. 제5항에 있어서, 상기한 디아크릴레이트 단량체가 트리프로필렌글리콜 디아크릴레이트인 것을 특징으로 하는 도전성 접착제 조성물.
  7. 제1항에 있어서, 상기한 유리 라디칼 개시제가 2,5-디메틸-1,5-비스(2-에틸 헥산오일 퍼옥시) 및 이들의 혼합물인 것을 특징으로 하는 도전성 접착제 조성물.
  8. 제1항에 있어서, 상기한 은 입자가 평균 입경이 0.1 내지 10미크론인 플레이크인 것을 특징으로 하는 도전성 접착제 조성물.
  9. 제1항에 있어서, 상기한 미경화된 상태의 도전성 접착제 조성물은 25℃에서의 점도가 10,000 내지 70,000센티포아즈이고, 표면 저항이 1오옴-cm이하인 것을 특징으로 하는 도전성 접착제 조성물.
  10. 스크린-인쇄 가능한 표면 실장용 도전성 접착제 조성물에 있어서, (가) 아크릴레이트계 우레탄수지, 아크릴수지 및 이들의 혼합물 중에서 선택되는 결합제 수지, 4 내지 12중량부; (나) 디아크릴레이트 단량체, 3 내지 13중량부; (다) 2,5-디메틸-1,5-비스(2-에틸 헥산오일 퍼옥시), 0.1 내지 1중량부; 및 (라) 평균입경이 25℃에서 0.1 내지 10미크론인 은 플레이크 75 내지 88중량부를 포함하여 이루어지고, 상기한 미경화된 상태의 도전성 접착제 조성물은 25℃에서의 점도가 10,000 내지 70,000센티포아즈이고, 표면 저항이 1오옴-cm이하인 것을 특징으로 하는 도전성 접착제 조성물.
  11. 제14항에 있어서, (마)리올로지 조절제, 0.1 내지 10중량부를 더욱 포함하여 이루어지는 것을 특징으로 하는 도전성 접착제 조성물.
  12. 경화전에 하기 특성을 갖는 표면 실장용 도전성 접착제 조성물에 의해 기판상에 표면 실장된 전기 요소로서, 상기한 표면 실장용 도전성 접착제 조성물이, (가) 아크릴레이트계 우레탄수지, 아크릴수지 및 이들의 혼합물 중에서 선택되는 결합제 수지, 2 내지 15중량부; (나) 아크릴레이트 단량체, 2 내지 15중량부; (다) 유리 라디칼 개시제, 0.01 내지 3중량부; 및 (라) 미분된 은 입자, 72 내지 95중량부를 포함하여 이루어지는 것을 특징으로 하는 전기 요소.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940704635A 1993-04-19 1994-04-01 표면 실장용 도전성 접착제 KR100289781B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/047,518 US5395876A (en) 1993-04-19 1993-04-19 Surface mount conductive adhesives
US8/047518 1993-04-19
US08/047518 1993-04-19
PCT/US1994/003631 WO1994025518A1 (en) 1993-04-19 1994-04-01 Surface mount conductive adhesives

Publications (2)

Publication Number Publication Date
KR950702220A true KR950702220A (ko) 1995-06-19
KR100289781B1 KR100289781B1 (ko) 2001-05-15

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Country Status (8)

Country Link
US (1) US5395876A (ko)
EP (1) EP0647251B1 (ko)
JP (1) JP3459012B2 (ko)
KR (1) KR100289781B1 (ko)
AU (1) AU6529594A (ko)
SG (1) SG45204A1 (ko)
TW (1) TW313584B (ko)
WO (1) WO1994025518A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150041748A (ko) * 2013-10-09 2015-04-17 히타치가세이가부시끼가이샤 회로 접속 재료, 회로 부재의 접속 구조체 및 회로 부재의 접속 구조체의 제조 방법

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5698623A (en) * 1994-04-28 1997-12-16 Jacobs; Richard L. Resin precursors having thixotropic properties and fillers stabilized against settling
JP3019139B2 (ja) * 1995-03-30 2000-03-13 株式会社住友金属エレクトロデバイス 導電性ペースト及びそれを用いたセラミック回路基板
JPH0959553A (ja) * 1995-08-30 1997-03-04 Dainippon Printing Co Ltd 透明導電性インキ
US5759737A (en) * 1996-09-06 1998-06-02 International Business Machines Corporation Method of making a component carrier
SE508139C2 (sv) * 1996-12-20 1998-08-31 Ericsson Telefon Ab L M Metod och anordning för anslutning av elektrisk komponent till kretskort
SE508138C2 (sv) * 1996-12-20 1998-08-31 Ericsson Telefon Ab L M Metod och anordning för anslutning av elektrisk komponent till kretskort
EP0979854B1 (en) 1997-03-31 2006-10-04 Hitachi Chemical Company, Ltd. Circuit connecting material, and structure and method of connecting circuit terminal
US7618713B2 (en) * 1997-03-31 2009-11-17 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
US6121358A (en) * 1997-09-22 2000-09-19 The Dexter Corporation Hydrophobic vinyl monomers, formulations containing same, and uses therefor
JP3384324B2 (ja) * 1998-05-11 2003-03-10 株式会社スリーボンド ハードディスクドライブの磁気ヘッドの製造用接着剤組成物
US6218446B1 (en) * 1999-01-11 2001-04-17 Dymax Corporation Radiation curable formulation for producing electrically conductive resinous material, method of use, and article produced
US7157507B2 (en) * 1999-04-14 2007-01-02 Allied Photochemical, Inc. Ultraviolet curable silver composition and related method
US6290881B1 (en) 1999-04-14 2001-09-18 Allied Photochemical, Inc. Ultraviolet curable silver composition and related method
US6762249B1 (en) * 1999-08-25 2004-07-13 Hitachi Chemical Company, Ltd. Wiring-connecting material and process for producing circuit board with the same
AU1819001A (en) * 1999-10-06 2001-05-10 Uv Specialties, Inc. Uv curable compositions for producing electroluminescent coatings
US6767577B1 (en) 1999-10-06 2004-07-27 Allied Photochemical, Inc. Uv curable compositions for producing electroluminescent coatings
US6509389B1 (en) 1999-11-05 2003-01-21 Uv Specialties, Inc. UV curable compositions for producing mar resistant coatings and method for depositing same
US6500877B1 (en) 1999-11-05 2002-12-31 Krohn Industries, Inc. UV curable paint compositions and method of making and applying same
AU4139501A (en) 1999-12-06 2001-06-12 Krohn Industries, Inc. Uv curable compositions for producing multilayer pain coatings
US20060100302A1 (en) * 1999-12-06 2006-05-11 Krohn Roy C UV curable compositions for producing multilayer paint coatings
US6805917B1 (en) 1999-12-06 2004-10-19 Roy C. Krohn UV curable compositions for producing decorative metallic coatings
CA2392990A1 (en) * 1999-12-06 2001-06-07 Roy C. Krohn Uv curable lubricant compositions
EP1263891A1 (en) * 2000-01-13 2002-12-11 UV Specialties, Inc. Uv curable ferromagnetic compositions
WO2001051567A1 (en) 2000-01-13 2001-07-19 Uv Specialties, Inc. Uv curable transparent conductive compositions
AU2001293252A1 (en) * 2000-09-06 2002-03-22 Allied Photochemical, Inc. Uv curable silver chloride compositions for producing silver coatings
US7323499B2 (en) * 2000-09-06 2008-01-29 Allied Photochemical, Inc. UV curable silver chloride compositions for producing silver coatings
US6815642B2 (en) 2001-12-19 2004-11-09 Delphi Technologies, Inc. Apparatus and method for heating a steering wheel
JP4995403B2 (ja) * 2002-05-02 2012-08-08 スリーエム イノベイティブ プロパティズ カンパニー アクリル系熱伝導性組成物形成用組成物、熱伝導性シート並びにその製造方法
CN1685584A (zh) * 2002-07-31 2005-10-19 瑞约伐克股份有限公司 检测再充电电池存在的方法与装置
CN1303175C (zh) * 2002-09-04 2007-03-07 纳美仕有限公司 导电性粘接剂及使用它的电路
WO2004101678A1 (ja) * 2003-05-19 2004-11-25 Nippon Shokubai Co., Ltd. 熱伝導性材料用樹脂組成物および熱伝導性材料
US6946628B2 (en) * 2003-09-09 2005-09-20 Klai Enterprises, Inc. Heating elements deposited on a substrate and related method
US20050244587A1 (en) * 2003-09-09 2005-11-03 Shirlin Jack W Heating elements deposited on a substrate and related method
US20050101686A1 (en) * 2003-11-07 2005-05-12 Krohn Roy C. UV curable composition for forming dielectric coatings and related method
US20050101685A1 (en) * 2003-11-07 2005-05-12 Allied Photochemical, Inc. UV curable composition for forming dielectric coatings and related method
US20050176841A1 (en) * 2003-12-30 2005-08-11 Krohn Roy C. UV curable ink compositions
DE102005027652A1 (de) * 2005-06-15 2006-12-21 Robert Bosch Gmbh Elektrisch leitfähige, mechanisch flexible Verbindung zwischen elektrischen bzw. elektronischen Bauteilen
US7582403B2 (en) 2006-07-17 2009-09-01 E. I. Du Pont De Nemours And Company Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom
JP4650456B2 (ja) * 2006-08-25 2011-03-16 日立化成工業株式会社 回路接続材料、これを用いた回路部材の接続構造及びその製造方法
JP5560544B2 (ja) * 2007-08-29 2014-07-30 日立化成株式会社 接着剤組成物、フィルム状接着剤、回路接続用接着剤、接続体及び半導体装置
EP2431438B1 (en) 2010-09-20 2012-11-28 Henkel AG & Co. KGaA Electrically conductive adhesives
KR101398825B1 (ko) * 2012-09-04 2014-05-27 삼성유리공업 주식회사 납땜이음용 전도성 접착코팅제
KR101551758B1 (ko) * 2012-12-11 2015-09-09 제일모직주식회사 이방 도전성 필름용 조성물 및 이방 도전성 필름
CN103923578A (zh) 2013-01-10 2014-07-16 杜邦公司 包括含氟弹性体的导电粘合剂
CN103928077B (zh) 2013-01-10 2017-06-06 杜邦公司 含有共混弹性体的导电粘合剂
KR101492890B1 (ko) 2013-02-05 2015-02-13 (주) 파루 표면실장용 발광소자의 전도성 접착제
WO2014196444A1 (ja) * 2013-06-03 2014-12-11 昭和電工株式会社 マイクロ波加熱用導電性樹脂組成物
CN103497692A (zh) * 2013-09-29 2014-01-08 苏州华周胶带有限公司 一种强效丙烯酸酯黏合剂
CN103497728B (zh) * 2013-10-18 2015-06-24 北京海斯迪克新材料有限公司 室温储存型丙烯酸酯底部填充胶及其制备方法
JP7242704B2 (ja) * 2018-04-26 2023-03-20 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 太陽電池を接着するための導電性接着剤
US20200095480A1 (en) * 2018-09-20 2020-03-26 Tektronix, Inc. Uv curable conductive adhesive
US11961629B1 (en) * 2022-12-08 2024-04-16 Geckos Technology Corp. Antioxidant conductive thermal paste and method of manufacturing the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2111072A (en) * 1981-12-08 1983-06-29 Johnson Matthey Plc Ultra violet-curable ink or paint containing electrically conductive metal particles
US4518524A (en) * 1983-06-27 1985-05-21 Acheson Industries, Inc. Silver coating composition for use in electronic applications and the like
JPS6162558A (ja) * 1984-09-04 1986-03-31 Muromachi Kagaku Kogyo Kk 導電性を有する樹脂組成物
US4740532A (en) * 1985-04-30 1988-04-26 Amp Incorporated Photocurable dielectric composition of acrylated urethane prepolymer
JPS62177074A (ja) * 1986-01-30 1987-08-03 Mitsubishi Rayon Co Ltd 導電性印刷インキ組成物
JPH02202959A (ja) * 1989-02-02 1990-08-13 Showa Highpolymer Co Ltd 帯電防止用塗料組成物
US5043102A (en) * 1989-11-29 1991-08-27 Advanced Products, Inc. Conductive adhesive useful for bonding a semiconductor die to a conductive support base

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150041748A (ko) * 2013-10-09 2015-04-17 히타치가세이가부시끼가이샤 회로 접속 재료, 회로 부재의 접속 구조체 및 회로 부재의 접속 구조체의 제조 방법

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US5395876A (en) 1995-03-07
EP0647251A1 (en) 1995-04-12
JPH07508555A (ja) 1995-09-21
SG45204A1 (en) 1998-01-16
JP3459012B2 (ja) 2003-10-20
TW313584B (ko) 1997-08-21
WO1994025518A1 (en) 1994-11-10
AU6529594A (en) 1994-11-21
EP0647251B1 (en) 1999-07-07
KR100289781B1 (ko) 2001-05-15
EP0647251A4 (en) 1997-04-16

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