KR950033479A - 가스 및 습도센서 - Google Patents

가스 및 습도센서 Download PDF

Info

Publication number
KR950033479A
KR950033479A KR1019940026409A KR19940026409A KR950033479A KR 950033479 A KR950033479 A KR 950033479A KR 1019940026409 A KR1019940026409 A KR 1019940026409A KR 19940026409 A KR19940026409 A KR 19940026409A KR 950033479 A KR950033479 A KR 950033479A
Authority
KR
South Korea
Prior art keywords
gas
humidity sensor
substrate
insulated substrate
die bond
Prior art date
Application number
KR1019940026409A
Other languages
English (en)
Other versions
KR100313408B1 (ko
Inventor
요시노부 마쯔우라
토오루 노무라
토모히로 이노우에
Original Assignee
카와무라 쇼오지
피가로기켄 카부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 카와무라 쇼오지, 피가로기켄 카부시키가이샤 filed Critical 카와무라 쇼오지
Publication of KR950033479A publication Critical patent/KR950033479A/ko
Application granted granted Critical
Publication of KR100313408B1 publication Critical patent/KR100313408B1/ko

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00Metal working
    • Y10S29/01Method or apparatus with die casting
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00Metal working
    • Y10S29/038Spot welding with other step
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)

Abstract

가스센서기판의 다이본드를 개선하고, (1)다이본드강도의 분산, (2)와이어본드강도의 분산, (3)다이본드시의 기판으로의 크랙의 발생을 방지한다. 알루미나기판(2)의 이면에, 글라스층(12)과 금페이스층(10)을 적층하고 프레임(4)의 금도금층(14)에 평행갭을 용착한다. 평행갭 용착시의 열로 금페이스트층(10)은 금도금층(14)에 용착되어, 균일한 다이본드강도가 얻어지고 또 다이본드재료가 센서본체(16)측으로 비산하는 일이 없으며, 균일한 와이어본드강도가 얻어진다. 더우기, 다이본드시의 열충격이 기판(2)으로 전달되는 것을 글라스층(12)에서 방지되며 다이본드시의 크랙을 방지한다.

Description

가스 및 습도센서
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 실시예의 가스 및 습도센서의 단면도, 제2도는 실시예의 가스 및 습도센서의 기판을 표시하는 도면, 제3도는 실시예의 가스 및 습도센서의 요부단면도, 제4도는 제2실시예의 가스 및 습도센서의 단면도, 제5도는 제2실시예의 가스 및 습도센서의 요부측면도, 제6도는 제2실시예의 센서본체의 평면도, 제7도는 제2실시예에서의 글라스층(12)의 우무에 의한 크랙발생률의 변화를 표시하는 특성도, 제8도는 제2실시예에서의 와이어본드강도의 분포를 표시하는 특성도, 제9도는 제2실시예에서의 가지(36)의 유무에 의한 낙하내성의 변화를 표시하는 특성도.

Claims (5)

  1. 세라믹 절연기판 위에 센서본체를 형성하고, 전기한 절연기판의 이면을 프레임으로 다이본된 가스 및 습도센서에 있어서, 전기한 절연기판의 이면에 글라스층과 금속층을 적층하고, 이 금속층을 전기한 프레임에 용착한 것을 특징으로 하는 가스 및 습도센서.
  2. 제1항에 있어서, 다수의 프레임을 설치하여 그 1개에 전기한 절연기판을 용착함과 아울러, 그들의 프레임을 베이스에 고착하고 또한 센서본체와 접속된 복수의 전극패드를 절연기판에 설치하여, 이들의 전극패드를 전기한 프레임으로 와이어본딩하고, 더우기 기판을 용착한 프레임을 다른 프레임의 1개와 결합하는 가지를 설치한 것을 특징으로 하는 가스 및 습도센서.
  3. 제1항에 있어서, 와이어본딩에 사용한 와이어의 루우프높이(H)와 루우푸길이(G)와의 비를, 0.5이상 1.3이하로 한 것을 특징으로 하는 가스 및 습도센서.
  4. 제1항에 있어서, 전기한 센서본체가 히이터막과 2개의 같은 종류의 금속산화물 반도체의 막으로 이루어지며, 금속산화물 반도체막의 1개를 가스검출용으로 하고, 금속산화물 반도체막의 다른쪽을 글라스막으로 피복하여 수증기검출용으로 한 것을 특징으로 하는 가스 및 습도센서.
  5. 제4항에 있어서, 가스 및 습도센서를 조리기내에서 발생하는 가스와 수증기의 검출용센서로 한 것을 특징으로 하는 가스 및 습도센서.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940026409A 1994-05-16 1994-10-14 가스및습도센서 KR100313408B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12689094A JP3531971B2 (ja) 1994-05-16 1994-05-16 ガスまたは湿度を検出するセンサとその製造方法
JP94-126890 1994-05-16

Publications (2)

Publication Number Publication Date
KR950033479A true KR950033479A (ko) 1995-12-26
KR100313408B1 KR100313408B1 (ko) 2002-06-22

Family

ID=14946398

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940026409A KR100313408B1 (ko) 1994-05-16 1994-10-14 가스및습도센서

Country Status (3)

Country Link
US (1) US5493897A (ko)
JP (1) JP3531971B2 (ko)
KR (1) KR100313408B1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030003171A (ko) * 2002-11-27 2003-01-09 (주)니즈 기판의 구성 층간의 열전도도 차이를 이용한펄스구동방식의 가스센서 제조
KR20030013234A (ko) * 2001-08-07 2003-02-14 삼성전자주식회사 전자레인지

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6318151B1 (en) * 1999-07-26 2001-11-20 Abbott Laboratories Self-contained sterilant monitoring assembly and method of using same
US6450007B1 (en) * 1999-12-01 2002-09-17 Honeywell International Inc. Robust single-chip hydrogen sensor
US6730270B1 (en) 2000-02-18 2004-05-04 Honeywell International Inc. Manufacturable single-chip hydrogen sensor
US6634213B1 (en) 2000-02-18 2003-10-21 Honeywell International Inc. Permeable protective coating for a single-chip hydrogen sensor
JP2002296214A (ja) * 2001-03-29 2002-10-09 Denso Corp ガスセンサの検査方法及び製造方法
US6927583B2 (en) * 2001-05-17 2005-08-09 Siemens Vdo Automotive Inc. Fuel sensor
KR20040016605A (ko) * 2002-08-19 2004-02-25 (주)니즈 가스센서 감지소자 조립방법
US20040084308A1 (en) * 2002-11-01 2004-05-06 Cole Barrett E. Gas sensor
JP4462864B2 (ja) * 2003-07-18 2010-05-12 フィガロ技研株式会社 ガスセンサの製造方法
US8739623B2 (en) 2012-03-09 2014-06-03 The University Of Kentucky Research Foundation Moisture sensors on conductive substrates
EP2796488A4 (en) * 2012-08-01 2014-11-26 Nat Inst For Materials Science IN HIGH TIMES PROTON-CONDUCTIVE POLYMERIC FILM, MANUFACTURING METHOD AND HUMIDITY SENSOR

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4204248A (en) * 1978-11-20 1980-05-20 General Electric Company Heat transfer mounting arrangement for a solid state device connected to a circuit board
CH626479A5 (ko) * 1979-07-05 1981-11-13 Suisse Horlogerie
FR2492981A1 (fr) * 1980-07-22 1982-04-30 Socapex Sonde d'analyse de gaz
US4751611A (en) * 1986-07-24 1988-06-14 Hitachi Chemical Co., Ltd. Semiconductor package structure
JPH0799361B2 (ja) * 1986-12-23 1995-10-25 フイガロ技研株式会社 ガスセンサ
US4993148A (en) * 1987-05-19 1991-02-19 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a circuit board
JP2755594B2 (ja) * 1988-03-30 1998-05-20 株式会社 東芝 セラミックス回路基板
JPH03136338A (ja) * 1989-10-23 1991-06-11 Mitsubishi Electric Corp 半導体装置およびその製造のためのロウ付け方法
US5095404A (en) * 1990-02-26 1992-03-10 Data General Corporation Arrangement for mounting and cooling high density tab IC chips
JPH0732042B2 (ja) * 1990-10-11 1995-04-10 富士通株式会社 スルーホール接続形電子デバイスとその実装方法
US5105258A (en) * 1990-11-21 1992-04-14 Motorola, Inc. Metal system for semiconductor die attach
US5311404A (en) * 1992-06-30 1994-05-10 Hughes Aircraft Company Electrical interconnection substrate with both wire bond and solder contacts
US5339216A (en) * 1993-03-02 1994-08-16 National Semiconductor Corporation Device and method for reducing thermal cycling in a semiconductor package
US5345363A (en) * 1993-04-07 1994-09-06 Intel Corporation Method and apparatus of coupling a die to a lead frame with a tape automated bonded tape that has openings which expose portions of the tape leads
US5423119A (en) * 1994-07-08 1995-06-13 Hualon Microelectronics Corporation Method for manufacturing a hybrid circuit charge-coupled device image sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030013234A (ko) * 2001-08-07 2003-02-14 삼성전자주식회사 전자레인지
KR20030003171A (ko) * 2002-11-27 2003-01-09 (주)니즈 기판의 구성 층간의 열전도도 차이를 이용한펄스구동방식의 가스센서 제조

Also Published As

Publication number Publication date
JPH07311173A (ja) 1995-11-28
KR100313408B1 (ko) 2002-06-22
JP3531971B2 (ja) 2004-05-31
US5493897A (en) 1996-02-27

Similar Documents

Publication Publication Date Title
KR950033479A (ko) 가스 및 습도센서
KR860003655A (ko) 반도체장치와 그 제조방법
JPH11160163A (ja) 回路板を有する電気的センサ特に温度センサ
JPH07153896A (ja) 樹脂封止型半導体装置及びその製造方法
JP2944585B2 (ja) ワイヤボンディング方法及びワイヤボンディング用ヒータープレート
JPH03218658A (ja) リードフレーム及び半導体装置
JPH0521526A (ja) Tabインナーリードの接合装置
US3284606A (en) Heat sink material and applications thereof
JPS613050A (ja) 酸素センサ−の検出基板
JPS57164552A (en) Lead-frame for semiconductor device
JPS5799749A (en) Semiconductor device
JP3003943B2 (ja) ガスセンサ
JPS56101752A (en) Semiconductor device
JP2544761Y2 (ja) 半導体レーザ用ヒートシンク
JPS57111041A (en) Semiconductor device
JPH0335152A (ja) ガスセンサ
JP2000150756A (ja) 樹脂封止型半導体装置及びリードフレーム
JP2001116713A (ja) ガスセンサ及びその製造方法
JPH04142042A (ja) 半導体装置の製造方法
KR810001418Y1 (ko) 반도체 장치
JPS568851A (en) Lead wire connecting method of semiconductor device
JP2531441B2 (ja) 半導体装置
JPH03781B2 (ko)
JPH05121495A (ja) ワイヤボンデイング方法
JPS63298145A (ja) ガスセンサ

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20071016

Year of fee payment: 7

LAPS Lapse due to unpaid annual fee