KR950032452A - 에폭시 수지 조성물 - Google Patents

에폭시 수지 조성물 Download PDF

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Publication number
KR950032452A
KR950032452A KR1019950007612A KR19950007612A KR950032452A KR 950032452 A KR950032452 A KR 950032452A KR 1019950007612 A KR1019950007612 A KR 1019950007612A KR 19950007612 A KR19950007612 A KR 19950007612A KR 950032452 A KR950032452 A KR 950032452A
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KR
South Korea
Prior art keywords
epoxy resin
resin composition
group
hardener
component
Prior art date
Application number
KR1019950007612A
Other languages
English (en)
Inventor
마사오 구보
리헤이 나가세
Original Assignee
요꼬떼 겐쇼오
소마루가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 요꼬떼 겐쇼오, 소마루가부시끼가이샤 filed Critical 요꼬떼 겐쇼오
Publication of KR950032452A publication Critical patent/KR950032452A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4253—Rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4207—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L47/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Abstract

가요성이 양호하고 게다가 내습성, 내균열성이 극히 뛰어난 경화물을 부여하는 에폭시 수지 조성물을 제공한다.
(A)액상 에폭시 수지, (B)경화제, (C)말단에 수산기 또는 카르복실기를 갖는 폴리부타디엔계 중합체, 및 (D)무기 충전체를 필수성분으로 하고, 상기 (B)경화제가 (a)트리알킬테트라히드로 무수 프탈산 (알킬기의 일부는 아케닐기어도 좋다)으로 이루어지는 에폭시 수지 조성물.

Description

에폭시 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (5)

  1. (A)액상 에폭시 수지, (B)경화제, (C)말단에 수산기 또는 카르복실기를 갖는 폴리부타디엔계 중합체, 및 (D)무기 충전체를 필수 성분으로 하고, 상기 (B)경화제가 (a)트리알킬테트라히드로 무수 프탈산 (알킬기의 일부는 아케닐기여도 좋다)으로 이루어지는 것을 특징으로 하는 에폭시 수지 조성물.
  2. (A)액상 에폭시 수지, (B)경화제, (C)말단에 수산기 또는 카르복실기를 갖는 폴리부타디엔계 중합체, 및 (D)무기 충전체를 필수성분으로 하고, 상기 (B)경화제가 (a)트리알킬테트라히드로 무수 프탈산 (알킬기의 일부는 알케닐기어도 좋다)와 (b)알케닐기 함유 무수 숙신산으로 이루어지는 것을 특징으로 하는 에폭시 수지 조성물.
  3. 제1항 또는 2항에 있어서, 상기 (A)액상 에폭시 수지가, (a)액상 비스페놀계 에폭시 수지와, (b)가요성 부여성 에폭시 화합물로 이루어지는 혼합물인 것을 특징으로 하는 에폭시 수지 조성물.
  4. 제3항에 있어서, 상기 (A)액상 에폭시 수지의 (b)성분이 비스페놀 A의 알킬렌옥시드 부가물의 디글리시딜에테르, 중합 지방산의 폴리글리디실에테르, 폴리알킬렌글리콜글리시딜에테르로 부터 선택되는 적어도 1종인 것을 특징으로 하는 에폭시 수지 조성물.
  5. 제2항에 있어서, 상기 (B)경화제가 상기 (a)성분 100∼40중량부와 상기 (b)성분 0∼60중량부의 혼합물인 것을 특징으로 하는 에폭시 수지 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950007612A 1994-03-31 1995-03-31 에폭시 수지 조성물 KR950032452A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6083720A JPH07268079A (ja) 1994-03-31 1994-03-31 エポキシ樹脂組成物
JP94-83720 1994-03-31

Publications (1)

Publication Number Publication Date
KR950032452A true KR950032452A (ko) 1995-12-20

Family

ID=13810357

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950007612A KR950032452A (ko) 1994-03-31 1995-03-31 에폭시 수지 조성물

Country Status (4)

Country Link
JP (1) JPH07268079A (ko)
KR (1) KR950032452A (ko)
CN (1) CN1111660A (ko)
MY (1) MY130159A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000045210A (ko) * 1998-12-30 2000-07-15 유현식 반도체 소자 봉지용 에폭시 수지 조성물

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3446730B2 (ja) * 2000-09-26 2003-09-16 松下電工株式会社 エポキシ樹脂組成物及び半導体装置
JP3446731B2 (ja) * 2000-09-26 2003-09-16 松下電工株式会社 エポキシ樹脂組成物及び半導体装置
US20080199713A1 (en) * 2004-07-14 2008-08-21 David Murray James Powder Coating Composition
JP5487540B2 (ja) * 2005-03-16 2014-05-07 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP2009149731A (ja) * 2007-12-19 2009-07-09 Denki Kagaku Kogyo Kk 導電性保護シート
CN102789882A (zh) * 2012-08-20 2012-11-21 深圳顺络电子股份有限公司 一种开磁路绕线电感
JP6437723B2 (ja) * 2014-01-14 2018-12-12 ソマール株式会社 樹脂組成物、ケースモールド型コンデンサ、およびケースモールド型コンデンサの製造方法
JP6539017B2 (ja) * 2014-01-14 2019-07-03 ソマール株式会社 ２液型エポキシ樹脂組成物およびケースモールド型コンデンサの製造方法
CN106750341B (zh) * 2016-11-11 2020-05-01 株洲时代新材料科技股份有限公司 一种增韧改性环氧酸酐浸渍树脂及其制备方法和应用
CN110189883A (zh) * 2019-06-05 2019-08-30 珠海天基探测技术有限公司 一种电流互感器柔性软磁铁芯
WO2022050175A1 (ja) * 2020-09-01 2022-03-10 株式会社ブリヂストン 樹脂組成物及び成形体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000045210A (ko) * 1998-12-30 2000-07-15 유현식 반도체 소자 봉지용 에폭시 수지 조성물

Also Published As

Publication number Publication date
MY130159A (en) 2007-06-29
CN1111660A (zh) 1995-11-15
JPH07268079A (ja) 1995-10-17

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