KR950021540A - 적어도 하나의 시모스-낸드 게이트를 가진 집적회로 및 제조방법 - Google Patents

적어도 하나의 시모스-낸드 게이트를 가진 집적회로 및 제조방법 Download PDF

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Publication number
KR950021540A
KR950021540A KR1019940033064A KR19940033064A KR950021540A KR 950021540 A KR950021540 A KR 950021540A KR 1019940033064 A KR1019940033064 A KR 1019940033064A KR 19940033064 A KR19940033064 A KR 19940033064A KR 950021540 A KR950021540 A KR 950021540A
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KR
South Korea
Prior art keywords
layer
opening
conductor structure
doped
conductivity type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019940033064A
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English (en)
Korean (ko)
Inventor
로타르 리쉬
토마스 포겔장
프란쯔 호프만
카를 호프만
Original Assignee
발도르프 옴케
지멘스 악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 발도르프 옴케, 지멘스 악티엔게젤샤프트 filed Critical 발도르프 옴케
Publication of KR950021540A publication Critical patent/KR950021540A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85—Complementary IGFETs, e.g. CMOS
    • H10D84/856—Complementary IGFETs, e.g. CMOS the complementary IGFETs having different architectures than each other, e.g. high-voltage and low-voltage CMOS
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
    • H03K19/08—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices
    • H03K19/094—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors
    • H03K19/0944—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors using MOSFET or insulated gate field-effect transistors, i.e. IGFET
    • H03K19/0948—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors using MOSFET or insulated gate field-effect transistors, i.e. IGFET using CMOS or complementary insulated gate field-effect transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
    • H10W10/018—Manufacture or treatment of isolation regions comprising dielectric materials using selective deposition of crystalline silicon, e.g. using epitaxial growth of silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
KR1019940033064A 1993-12-07 1994-12-07 적어도 하나의 시모스-낸드 게이트를 가진 집적회로 및 제조방법 Withdrawn KR950021540A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4341667.5 1993-12-07
DE4341667A DE4341667C1 (de) 1993-12-07 1993-12-07 Integrierte Schaltungsanordnung mit mindestens einem CMOS-NAND-Gatter und Verfahren zu deren Herstellung

Publications (1)

Publication Number Publication Date
KR950021540A true KR950021540A (ko) 1995-07-26

Family

ID=6504379

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940033064A Withdrawn KR950021540A (ko) 1993-12-07 1994-12-07 적어도 하나의 시모스-낸드 게이트를 가진 집적회로 및 제조방법

Country Status (6)

Country Link
US (1) US5559353A (enExample)
EP (1) EP0657930A3 (enExample)
JP (1) JPH07235605A (enExample)
KR (1) KR950021540A (enExample)
DE (1) DE4341667C1 (enExample)
TW (1) TW304286B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19611045C1 (de) * 1996-03-20 1997-05-22 Siemens Ag Durch Feldeffekt steuerbares Halbleiterbauelement
US5795807A (en) * 1996-12-20 1998-08-18 Advanced Micro Devices Semiconductor device having a group of high performance transistors and method of manufacture thereof
TW423116B (en) * 1997-08-22 2001-02-21 Siemens Ag Circuit-arrangement with at least four transistors and its production method
DE19801095B4 (de) * 1998-01-14 2007-12-13 Infineon Technologies Ag Leistungs-MOSFET
DE19840032C1 (de) * 1998-09-02 1999-11-18 Siemens Ag Halbleiterbauelement und Herstellungsverfahren dazu
CN1152425C (zh) * 1998-09-25 2004-06-02 印芬龙科技股份有限公司 制作具有垂直的mos晶体管的集成电路的方法
KR100419538B1 (ko) 1998-09-30 2004-02-21 인피니언 테크놀로지스 아게 집적 회로 장치용 홈을 가진 기판 및 그 제조 방법
FR2789227B1 (fr) * 1999-02-03 2003-08-15 France Telecom DISPOSITIF SEMI-CONDUCTEUR DE PORTES LOGIQUES NON-ET OU NON-OU A n ENTREES, ET PROCEDE DE FABRICATION CORRESPONDANT
JP2001111538A (ja) * 1999-10-05 2001-04-20 Dainippon Printing Co Ltd 通信システムとその方法、通信装置およびｉｃカード
US6828609B2 (en) * 2001-11-09 2004-12-07 Infineon Technologies Ag High-voltage semiconductor component
US6819089B2 (en) 2001-11-09 2004-11-16 Infineon Technologies Ag Power factor correction circuit with high-voltage semiconductor component

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4554570A (en) * 1982-06-24 1985-11-19 Rca Corporation Vertically integrated IGFET device
US4810906A (en) * 1985-09-25 1989-03-07 Texas Instruments Inc. Vertical inverter circuit
US4788158A (en) * 1985-09-25 1988-11-29 Texas Instruments Incorporated Method of making vertical inverter
US4951102A (en) * 1988-08-24 1990-08-21 Harris Corporation Trench gate VCMOS
JPH0828120B2 (ja) * 1990-05-23 1996-03-21 株式会社東芝 アドレスデコード回路
MY107475A (en) * 1990-05-31 1995-12-30 Canon Kk Semiconductor device and method for producing the same.
JP2991489B2 (ja) * 1990-11-30 1999-12-20 株式会社東芝 半導体装置

Also Published As

Publication number Publication date
US5559353A (en) 1996-09-24
TW304286B (enExample) 1997-05-01
DE4341667C1 (de) 1994-12-01
EP0657930A2 (de) 1995-06-14
EP0657930A3 (de) 1998-01-07
JPH07235605A (ja) 1995-09-05

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