KR950021343A - 정전척크 부착 세라믹 히터 - Google Patents

정전척크 부착 세라믹 히터 Download PDF

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Publication number
KR950021343A
KR950021343A KR1019940037555A KR19940037555A KR950021343A KR 950021343 A KR950021343 A KR 950021343A KR 1019940037555 A KR1019940037555 A KR 1019940037555A KR 19940037555 A KR19940037555 A KR 19940037555A KR 950021343 A KR950021343 A KR 950021343A
Authority
KR
South Korea
Prior art keywords
electrostatic chuck
ceramic
ceramic heater
electrode
heat generating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1019940037555A
Other languages
English (en)
Korean (ko)
Inventor
노부오 가와다
쇼지 가노
고지 하기와라
노부오 아라이
주니찌 아라미
겐지 이시까와
Original Assignee
가나까와 지히로
신에쓰가가꾸고오교 가부시끼가이샤
이노우에 아끼라
도오꾜엘렉트론 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가나까와 지히로, 신에쓰가가꾸고오교 가부시끼가이샤, 이노우에 아끼라, 도오꾜엘렉트론 가부시끼가이샤 filed Critical 가나까와 지히로
Publication of KR950021343A publication Critical patent/KR950021343A/ko
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)
  • Jigs For Machine Tools (AREA)
  • Ceramic Products (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1019940037555A 1993-12-27 1994-12-27 정전척크 부착 세라믹 히터 Abandoned KR950021343A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP93-330764 1993-12-27
JP33076493 1993-12-27
JP31637494A JPH07307377A (ja) 1993-12-27 1994-12-20 静電チャック付セラミックスヒーター
JP94-316374 1994-12-20

Publications (1)

Publication Number Publication Date
KR950021343A true KR950021343A (ko) 1995-07-26

Family

ID=26568634

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940037555A Abandoned KR950021343A (ko) 1993-12-27 1994-12-27 정전척크 부착 세라믹 히터

Country Status (4)

Country Link
US (1) US5665260A (enExample)
JP (1) JPH07307377A (enExample)
KR (1) KR950021343A (enExample)
TW (1) TW287294B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113396535A (zh) * 2019-02-21 2021-09-14 京瓷株式会社 试样保持工具

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JP3208029B2 (ja) * 1994-11-22 2001-09-10 株式会社巴川製紙所 静電チャック装置およびその作製方法
JPH09213781A (ja) * 1996-02-01 1997-08-15 Tokyo Electron Ltd 載置台構造及びそれを用いた処理装置
EP0803900A3 (en) * 1996-04-26 1999-12-29 Applied Materials, Inc. Surface preparation to enhance the adhesion of a dielectric layer
US6037572A (en) * 1997-02-26 2000-03-14 White Consolidated Industries, Inc. Thin film heating assemblies
JPH11157953A (ja) 1997-12-02 1999-06-15 Nhk Spring Co Ltd セラミックスと金属との構造体及びそれを用いた静電チャック装置
US5901030A (en) * 1997-12-02 1999-05-04 Dorsey Gage, Inc. Electrostatic chuck employing thermoelectric cooling
JPH11260534A (ja) * 1998-01-09 1999-09-24 Ngk Insulators Ltd 加熱装置およびその製造方法
US5886866A (en) * 1998-07-06 1999-03-23 Applied Materials, Inc. Electrostatic chuck having a combination electrode structure for substrate chucking, heating and biasing
EP1193751B1 (en) * 1999-04-06 2006-05-17 Tokyo Electron Limited Electrode and method of manufacturing an electrode
US6490146B2 (en) 1999-05-07 2002-12-03 Applied Materials Inc. Electrostatic chuck bonded to base with a bond layer and method
US6462928B1 (en) 1999-05-07 2002-10-08 Applied Materials, Inc. Electrostatic chuck having improved electrical connector and method
US6310755B1 (en) * 1999-05-07 2001-10-30 Applied Materials, Inc. Electrostatic chuck having gas cavity and method
JP2001077182A (ja) * 1999-06-09 2001-03-23 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板
WO2001011921A1 (en) * 1999-08-09 2001-02-15 Ibiden Co., Ltd. Ceramic heater
JP2001118664A (ja) 1999-08-09 2001-04-27 Ibiden Co Ltd セラミックヒータ
US6835916B2 (en) 1999-08-09 2004-12-28 Ibiden, Co., Ltd Ceramic heater
EP1133214B1 (en) * 1999-09-07 2005-08-10 Ibiden Co., Ltd. Ceramic heater
ATE301916T1 (de) * 1999-11-19 2005-08-15 Ibiden Co Ltd Keramisches heizgerät
US6410172B1 (en) 1999-11-23 2002-06-25 Advanced Ceramics Corporation Articles coated with aluminum nitride by chemical vapor deposition
JP2001297857A (ja) * 1999-11-24 2001-10-26 Ibiden Co Ltd 半導体製造・検査装置用セラミックヒータ
EP1137321A1 (en) * 1999-11-30 2001-09-26 Ibiden Co., Ltd. Ceramic heater
JP4209057B2 (ja) * 1999-12-01 2009-01-14 東京エレクトロン株式会社 セラミックスヒーターならびにそれを用いた基板処理装置および基板処理方法
WO2002091457A1 (en) * 1999-12-09 2002-11-14 Ibiden Co., Ltd. Ceramic plate for semiconductor producing/inspecting apparatus
US6494955B1 (en) 2000-02-15 2002-12-17 Applied Materials, Inc. Ceramic substrate support
JP2001253777A (ja) * 2000-03-13 2001-09-18 Ibiden Co Ltd セラミック基板
US6693789B2 (en) * 2000-04-05 2004-02-17 Sumitomo Osaka Cement Co., Ltd. Susceptor and manufacturing method thereof
WO2001080601A1 (fr) * 2000-04-14 2001-10-25 Ibiden Co., Ltd. Dispositif de chauffage en ceramique
JP2002141257A (ja) * 2000-05-24 2002-05-17 Ibiden Co Ltd 半導体製造・検査装置用セラミックヒータ
JP3516392B2 (ja) * 2000-06-16 2004-04-05 イビデン株式会社 半導体製造・検査装置用ホットプレート
WO2002003435A1 (en) * 2000-07-04 2002-01-10 Ibiden Co., Ltd. Hot plate for semiconductor manufacture and testing
EP1304729A1 (en) * 2000-07-19 2003-04-23 Ibiden Co., Ltd. Semiconductor manufacturing/testing ceramic heater, production method for the ceramic heater and production system for the ceramic heater
WO2002007196A1 (fr) * 2000-07-19 2002-01-24 Ibiden Co., Ltd. Dispositif chauffant ceramique pour la fabrication/verification de semi-conducteurs
US20040035846A1 (en) * 2000-09-13 2004-02-26 Yasuji Hiramatsu Ceramic heater for semiconductor manufacturing and inspecting equipment
AU2002239522A1 (en) 2000-11-16 2002-05-27 Mattson Technology, Inc. Apparatuses and methods for resistively heating a thermal processing system
WO2002043441A1 (en) * 2000-11-24 2002-05-30 Ibiden Co., Ltd. Ceramic heater, and production method for ceramic heater
JP2002170651A (ja) * 2000-11-29 2002-06-14 Ibiden Co Ltd セラミックヒータ
US6623563B2 (en) * 2001-01-02 2003-09-23 Applied Materials, Inc. Susceptor with bi-metal effect
US6554907B2 (en) 2001-01-02 2003-04-29 Applied Materials, Inc. Susceptor with internal support
US6538872B1 (en) 2001-11-05 2003-03-25 Applied Materials, Inc. Electrostatic chuck having heater and method
US6730175B2 (en) 2002-01-22 2004-05-04 Applied Materials, Inc. Ceramic substrate support
AU2003235268A1 (en) * 2002-05-16 2003-12-02 Nippon Electric Glass Co., Ltd. Cooking top plate
JP3963788B2 (ja) * 2002-06-20 2007-08-22 信越化学工業株式会社 静電吸着機能を有する加熱装置
JP2004146567A (ja) * 2002-10-24 2004-05-20 Sumitomo Electric Ind Ltd 半導体製造装置用セラミックスヒーター
JP4302428B2 (ja) * 2003-05-09 2009-07-29 信越化学工業株式会社 静電吸着機能を有するウエーハ加熱装置
JP4077430B2 (ja) * 2003-07-31 2008-04-16 佳知 高石 骨密度評価装置および骨密度評価方法
JP4309714B2 (ja) * 2003-08-27 2009-08-05 信越化学工業株式会社 静電吸着機能を有する加熱装置
JP4278046B2 (ja) * 2003-11-10 2009-06-10 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 ヒータ機構付き静電チャック
US7697260B2 (en) * 2004-03-31 2010-04-13 Applied Materials, Inc. Detachable electrostatic chuck
US20060088692A1 (en) * 2004-10-22 2006-04-27 Ibiden Co., Ltd. Ceramic plate for a semiconductor producing/examining device
US8226769B2 (en) 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
KR100794960B1 (ko) * 2006-06-07 2008-01-16 (주)나노테크 하이브리드형 히터 제조방법
US9275887B2 (en) * 2006-07-20 2016-03-01 Applied Materials, Inc. Substrate processing with rapid temperature gradient control
US7589950B2 (en) * 2006-10-13 2009-09-15 Applied Materials, Inc. Detachable electrostatic chuck having sealing assembly
CN102308380B (zh) * 2009-02-04 2014-06-04 马特森技术有限公司 用于径向调整衬底的表面上的温度轮廓的静电夹具系统及方法
JP5543123B2 (ja) * 2009-03-30 2014-07-09 大日本スクリーン製造株式会社 熱処理用サセプタおよび熱処理装置
US9161392B2 (en) * 2009-04-07 2015-10-13 Yoshinobu ANBE Heating apparatus for X-ray inspection
JP6017781B2 (ja) * 2011-12-07 2016-11-02 新光電気工業株式会社 基板温調固定装置及びその製造方法
CN103428909A (zh) * 2013-07-12 2013-12-04 罗日良 一种发热管成型工艺
CN103369750A (zh) * 2013-08-08 2013-10-23 罗日良 一种发热管成型工艺
JP6708518B2 (ja) * 2016-08-09 2020-06-10 新光電気工業株式会社 基板固定装置及びその製造方法
JP6587223B1 (ja) * 2018-07-30 2019-10-09 Toto株式会社 静電チャック

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EP0504424B1 (en) * 1990-10-05 1999-12-15 Sumitomo Electric Industries, Ltd. Hard material clad with diamond, throwaway chip, and method of making said material and chip
JPH0750736B2 (ja) * 1990-12-25 1995-05-31 日本碍子株式会社 ウエハー加熱装置及びその製造方法
US5166856A (en) * 1991-01-31 1992-11-24 International Business Machines Corporation Electrostatic chuck with diamond coating
US5155652A (en) * 1991-05-02 1992-10-13 International Business Machines Corporation Temperature cycling ceramic electrostatic chuck
JPH04345019A (ja) * 1991-05-22 1992-12-01 Toshiba Ceramics Co Ltd 半導体用処理部材
JP3081279B2 (ja) * 1991-06-03 2000-08-28 電気化学工業株式会社 ホットプレート
JPH0513555A (ja) * 1991-07-01 1993-01-22 Toto Ltd 静電チヤツク及び静電チヤツクに対する電圧印加方法
US5343022A (en) * 1992-09-29 1994-08-30 Advanced Ceramics Corporation Pyrolytic boron nitride heating unit
US5384682A (en) * 1993-03-22 1995-01-24 Toto Ltd. Electrostatic chuck

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113396535A (zh) * 2019-02-21 2021-09-14 京瓷株式会社 试样保持工具
CN113396535B (zh) * 2019-02-21 2024-01-19 京瓷株式会社 试样保持工具

Also Published As

Publication number Publication date
TW287294B (enExample) 1996-10-01
JPH07307377A (ja) 1995-11-21
US5665260A (en) 1997-09-09

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