AU2002239522A1 - Apparatuses and methods for resistively heating a thermal processing system - Google Patents

Apparatuses and methods for resistively heating a thermal processing system

Info

Publication number
AU2002239522A1
AU2002239522A1 AU2002239522A AU3952202A AU2002239522A1 AU 2002239522 A1 AU2002239522 A1 AU 2002239522A1 AU 2002239522 A AU2002239522 A AU 2002239522A AU 3952202 A AU3952202 A AU 3952202A AU 2002239522 A1 AU2002239522 A1 AU 2002239522A1
Authority
AU
Australia
Prior art keywords
apparatuses
methods
processing system
thermal processing
resistively heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002239522A
Inventor
Kristian E. Johnsgard
Daniel L. Messineo
David E. Sallows
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mattson Technology Inc
Original Assignee
Mattson Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mattson Technology Inc filed Critical Mattson Technology Inc
Publication of AU2002239522A1 publication Critical patent/AU2002239522A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Resistance Heating (AREA)
  • Tunnel Furnaces (AREA)
  • Furnace Details (AREA)
  • Surface Heating Bodies (AREA)
AU2002239522A 2000-11-16 2001-11-07 Apparatuses and methods for resistively heating a thermal processing system Abandoned AU2002239522A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US24970800P 2000-11-16 2000-11-16
US60/249,708 2000-11-16
PCT/US2001/046633 WO2002041370A2 (en) 2000-11-16 2001-11-07 Apparatuses and methods for resistively heating a thermal processing system

Publications (1)

Publication Number Publication Date
AU2002239522A1 true AU2002239522A1 (en) 2002-05-27

Family

ID=22944641

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002239522A Abandoned AU2002239522A1 (en) 2000-11-16 2001-11-07 Apparatuses and methods for resistively heating a thermal processing system

Country Status (8)

Country Link
US (1) US7176417B2 (en)
JP (1) JP2004514287A (en)
KR (1) KR100847367B1 (en)
CN (1) CN1299322C (en)
AU (1) AU2002239522A1 (en)
DE (1) DE10196908T1 (en)
TW (1) TW518907B (en)
WO (1) WO2002041370A2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
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DE19956767A1 (en) * 1999-11-25 2001-05-31 Nanogate Gmbh Silicon carbide ceramic heating element for igniting combustible mixture has negative temperature characteristic in circuit with segment whose resistance saturates quasi-asymptotically
JP2005348820A (en) * 2004-06-08 2005-12-22 Olympus Corp Heating element, medical treatment tool and apparatus using thereof
US7326877B2 (en) * 2004-12-01 2008-02-05 Ultratech, Inc. Laser thermal processing chuck with a thermal compensating heater module
US7378781B2 (en) * 2005-09-07 2008-05-27 Nokia Corporation Acoustic wave resonator with integrated temperature control for oscillator purposes
US20070128563A1 (en) * 2005-12-07 2007-06-07 Kanakasabapathi Subramanian Ignition device for a gas appliance and method of operation
US7785482B2 (en) * 2005-12-07 2010-08-31 General Electric Company Method of making an ignition device
US7741584B2 (en) * 2007-01-21 2010-06-22 Momentive Performance Materials Inc. Encapsulated graphite heater and process
US20110062145A1 (en) * 2007-09-10 2011-03-17 Amo Co., Ltd. Drying heater, heating unit for drying laundry using the same, drying control system and control method thereof
KR101031226B1 (en) * 2009-08-21 2011-04-29 에이피시스템 주식회사 Heater block of rapid thermal processing apparatus
US10138551B2 (en) 2010-07-29 2018-11-27 GES Associates LLC Substrate processing apparatuses and systems
CN104105229B (en) * 2013-04-07 2016-02-24 光宝科技股份有限公司 Heating unit and apply the heating system of this heating unit
EP2842738B1 (en) * 2013-08-26 2020-06-24 FCT Ingenieurkeramik GmbH Method of producing a ceramic heating element
KR101673016B1 (en) * 2013-08-27 2016-11-07 삼성디스플레이 주식회사 Thin film encapsulation manufacturing device and manufacturing method of display apparatus using the same
WO2015192105A1 (en) * 2014-06-12 2015-12-17 Crystal Solar, Inc. Cvd epitaxial reactor chamber with resistive heating, three channel substrate carrier and gas preheat structure
US10154542B2 (en) 2015-10-19 2018-12-11 Watlow Electric Manufacturing Company Composite device with cylindrical anisotropic thermal conductivity
CN106777675B (en) * 2016-12-14 2019-09-20 北京航天益森风洞工程技术有限公司 The hot relevant parameter design method of graphite resistance heater
US11665786B2 (en) * 2019-12-05 2023-05-30 Applied Materials, Inc. Solid state heater and method of manufacture
CN116963326A (en) * 2023-08-02 2023-10-27 南通通杰照明有限公司 Ceramic heater and glow plug

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH597681A5 (en) * 1975-09-05 1978-04-14 Sulzer Ag
US4328529A (en) * 1977-09-12 1982-05-04 Emerson Electric Co. Silicon carbide igniters
US4433233A (en) * 1979-09-27 1984-02-21 Emerson Electric Co. Silicon carbide heating elements
US4862029A (en) * 1987-02-11 1989-08-29 Tosoh Corporation Actuator
EP0447155B1 (en) * 1990-03-12 1995-07-26 Ngk Insulators, Ltd. Wafer heaters for use in semi-conductor-producing apparatus, heating units using such wafer heaters, and production of heaters
JP2585123B2 (en) * 1990-04-13 1997-02-26 東芝セラミックス株式会社 Method for producing silicon single crystal
JPH07307377A (en) * 1993-12-27 1995-11-21 Shin Etsu Chem Co Ltd Ceramic heater with electrostatic chuck
CN1076863C (en) * 1994-06-10 2001-12-26 松下电器产业株式会社 Apparatus and method of manufacturing semiconductor element
US5502345A (en) * 1994-08-29 1996-03-26 The United States Of America As Represented By The Secretary Of The Navy Unitary transducer with variable resistivity
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
US5748434A (en) * 1996-06-14 1998-05-05 Applied Materials, Inc. Shield for an electrostatic chuck
US5994662A (en) * 1997-05-29 1999-11-30 Applied Materials, Inc. Unique baffle to deflect remote plasma clean gases
US5909355A (en) * 1997-12-02 1999-06-01 Applied Materials, Inc. Ceramic electrostatic chuck and method of fabricating same
DE19836989A1 (en) * 1998-08-14 2000-02-24 Bosch Gmbh Robert Production of ceramic powder used for finishing planar ceramic sensor elements comprises adding additive to prevent gas inclusions in powder product during thermal treatment
US6329741B1 (en) * 1999-04-30 2001-12-11 The Trustees Of Princeton University Multilayer ceramic piezoelectric laminates with zinc oxide conductors
US6423949B1 (en) * 1999-05-19 2002-07-23 Applied Materials, Inc. Multi-zone resistive heater
JP4028149B2 (en) * 2000-02-03 2007-12-26 日本碍子株式会社 Heating device
JP4605729B2 (en) * 2001-01-19 2011-01-05 信越石英株式会社 Translucent ceramic body and method for producing the same

Also Published As

Publication number Publication date
US20020100753A1 (en) 2002-08-01
CN1475026A (en) 2004-02-11
JP2004514287A (en) 2004-05-13
DE10196908T1 (en) 2003-10-09
KR100847367B1 (en) 2008-07-21
KR20030074620A (en) 2003-09-19
CN1299322C (en) 2007-02-07
WO2002041370A2 (en) 2002-05-23
US7176417B2 (en) 2007-02-13
WO2002041370A3 (en) 2003-02-20
TW518907B (en) 2003-01-21

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