KR950008844B1 - 반도체 처리시스템에 있어서 반도체 기판을 반송하는 방법 및 장치 - Google Patents

반도체 처리시스템에 있어서 반도체 기판을 반송하는 방법 및 장치 Download PDF

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Publication number
KR950008844B1
KR950008844B1 KR1019910015384A KR910015384A KR950008844B1 KR 950008844 B1 KR950008844 B1 KR 950008844B1 KR 1019910015384 A KR1019910015384 A KR 1019910015384A KR 910015384 A KR910015384 A KR 910015384A KR 950008844 B1 KR950008844 B1 KR 950008844B1
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KR
South Korea
Prior art keywords
time
processing
semiconductor substrate
conveying
condition
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Expired - Fee Related
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KR1019910015384A
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English (en)
Korean (ko)
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KR920007081A (ko
Inventor
마사미 니시다
마사히로 히모토
테츠야 하마다
노리아키 요코노
다케오 오카모토
Original Assignee
다이닛뽕스크린 세이조오 가부시키가이샤
이시다 아키라
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Publication of KR920007081A publication Critical patent/KR920007081A/ko
Application granted granted Critical
Publication of KR950008844B1 publication Critical patent/KR950008844B1/ko
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1019910015384A 1990-09-03 1991-09-03 반도체 처리시스템에 있어서 반도체 기판을 반송하는 방법 및 장치 Expired - Fee Related KR950008844B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2-234095 1990-09-03
JP2234095A JP2638668B2 (ja) 1990-09-03 1990-09-03 基板搬送方法および基板搬送装置

Publications (2)

Publication Number Publication Date
KR920007081A KR920007081A (ko) 1992-04-28
KR950008844B1 true KR950008844B1 (ko) 1995-08-08

Family

ID=16965545

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910015384A Expired - Fee Related KR950008844B1 (ko) 1990-09-03 1991-09-03 반도체 처리시스템에 있어서 반도체 기판을 반송하는 방법 및 장치

Country Status (4)

Country Link
EP (1) EP0474180B1 (enExample)
JP (1) JP2638668B2 (enExample)
KR (1) KR950008844B1 (enExample)
DE (1) DE69128822T2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6969915B2 (en) 2001-01-15 2005-11-29 Nec Corporation Semiconductor device, manufacturing method and apparatus for the same

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW276353B (enExample) * 1993-07-15 1996-05-21 Hitachi Seisakusyo Kk
US5687085A (en) * 1994-04-08 1997-11-11 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and method
JP2994553B2 (ja) * 1994-04-08 1999-12-27 大日本スクリーン製造株式会社 基板処理装置
US5505132A (en) * 1995-04-03 1996-04-09 Warren; David K. Apparatus for field postage stamp cancellation
US6672819B1 (en) 1995-07-19 2004-01-06 Hitachi, Ltd. Vacuum processing apparatus and semiconductor manufacturing line using the same
JPH10112489A (ja) * 1996-10-07 1998-04-28 Dainippon Screen Mfg Co Ltd 基板搬送装置および基板処理装置
US6275744B1 (en) 1997-08-01 2001-08-14 Kokusai Electric Co., Ltd. Substrate feed control
US6466895B1 (en) * 1999-07-16 2002-10-15 Applied Materials, Inc. Defect reference system automatic pattern classification
JP4093462B2 (ja) 2002-10-09 2008-06-04 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP4279102B2 (ja) 2003-09-22 2009-06-17 大日本スクリーン製造株式会社 基板処理装置及び基板処理方法
JP4568231B2 (ja) * 2003-12-01 2010-10-27 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
JP4353903B2 (ja) 2005-01-07 2009-10-28 東京エレクトロン株式会社 クラスタツールの処理システム
JP4937559B2 (ja) * 2005-09-14 2012-05-23 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP7324811B2 (ja) * 2021-09-22 2023-08-10 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、及びプログラム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4507078A (en) * 1983-03-28 1985-03-26 Silicon Valley Group, Inc. Wafer handling apparatus and method
GB2194500B (en) * 1986-07-04 1991-01-23 Canon Kk A wafer handling apparatus
JP2704309B2 (ja) * 1990-06-12 1998-01-26 大日本スクリーン製造株式会社 基板処理装置及び基板の熱処理方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6969915B2 (en) 2001-01-15 2005-11-29 Nec Corporation Semiconductor device, manufacturing method and apparatus for the same
US7282432B2 (en) 2001-01-15 2007-10-16 Nec Corporation Semiconductor device, manufacturing method and apparatus for the same
US7611041B2 (en) 2001-01-15 2009-11-03 Nec Corporation Semiconductor device, manufacturing method and apparatus for the same
US7793818B2 (en) 2001-01-15 2010-09-14 Nec Corporation Semiconductor device, manufacturing method and apparatus for the same

Also Published As

Publication number Publication date
JP2638668B2 (ja) 1997-08-06
DE69128822D1 (de) 1998-03-05
EP0474180A2 (en) 1992-03-11
JPH04113612A (ja) 1992-04-15
DE69128822T2 (de) 1998-09-24
KR920007081A (ko) 1992-04-28
EP0474180A3 (enExample) 1995-02-15
EP0474180B1 (en) 1998-01-28

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