KR950002911A - Co_2레이저가공장치 - Google Patents
Co_2레이저가공장치 Download PDFInfo
- Publication number
- KR950002911A KR950002911A KR1019940017208A KR19940017208A KR950002911A KR 950002911 A KR950002911 A KR 950002911A KR 1019940017208 A KR1019940017208 A KR 1019940017208A KR 19940017208 A KR19940017208 A KR 19940017208A KR 950002911 A KR950002911 A KR 950002911A
- Authority
- KR
- South Korea
- Prior art keywords
- laser
- processing
- laser processing
- processing apparatus
- pair
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
본 발명은, 전자부품, 전자기기 등의 정밀가공에 사용되는 CO₂레이저가공장치에 관한 것으로서, 고속이고 또한 고정밀의 가공을 가공하게 하는 CO₂레이저가공장치를 제공하는 것을 목적으로 한 것이며, 그 구성에 있어서, CO₂레이저발진기(1)와, 회전동작하는 미러(3),(4)와, 미러(3),(4)에 의해 반사·주사되는 레이저광선을 소정의 평면상에 접속시키는 광학부품(7)을 가지고, 임의의 구멍가공에 있어서, 매초 100구멍이상의 가공속도를 실현하는 것을 특징으로 한 것이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예에 있어서의 CO₂레이저가공장치의 구성을 표시한 도면, 제2도는 동 fe렌즈의 구성을 표시한 도면, 제3도는 본 발명의 제2실시예에 있어서의 CO₂레이저가공장치의 구성을 표시한 도면.
Claims (4)
- CO₂레이저발진기와 상기 CO₂레이저발진기로부터 출사한 레이저광선을 반사하고, 주사시키기 위한 1쌍의 회전동작하는 미러와, 상기 1쌍의 회전동작하는 미러에 의해 반사된 레이저광선을 소정의 평면상에 집속시키는 광학부품을 구비한 것을 특징으로 하는 CO₂레이저가공장치.
- 제1항에 있어서, 1축이상의 가동위치결정스테이지를 구비한 것을 특징으로 하는 CO₂레이저가공장치.
- 1대의 CO₂레이저발진기로부터 출사한 레이저광선을 복수로 분기하고, 각 분기마다 레이저광선을 반사하고, 주사시키기 위한 1쌍의 회전동작하는 미러와, 상기 1쌍의 회전동작하는 미러에 의해 반사, 주사되는 레이저광선을 소정의 평면상에 집속시키는 광학부품을 구비한 것을 특징으로 하는 CO₂레이저가공장치.
- 제3항에 있어서, 1대의 CO₂레이저발진기로부터 출사한 레이저광선을 복수로 분기하고, 각 분기마다 1축이상의 가동위치 결정 스테이지를 구비한 것을 특징으로 하는 CO₂레이저가공장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17645593A JP3257157B2 (ja) | 1993-07-16 | 1993-07-16 | Co2レーザ穴加工装置及び方法 |
JP93-176455 | 1993-07-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950002911A true KR950002911A (ko) | 1995-02-16 |
KR0141060B1 KR0141060B1 (ko) | 1998-07-15 |
Family
ID=16014007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940017208A KR0141060B1 (ko) | 1993-07-16 | 1994-07-16 | Co2레이저가공장치 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3257157B2 (ko) |
KR (1) | KR0141060B1 (ko) |
CN (1) | CN1056108C (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7462801B1 (en) * | 1996-11-20 | 2008-12-09 | Ibiden Co., Ltd. | Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
US7732732B2 (en) | 1996-11-20 | 2010-06-08 | Ibiden Co., Ltd. | Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
JP3213882B2 (ja) * | 1997-03-21 | 2001-10-02 | 住友重機械工業株式会社 | レーザ加工装置及び加工方法 |
JP3341114B2 (ja) † | 1997-03-21 | 2002-11-05 | 住友重機械工業株式会社 | レーザ加工装置及びレーザ加工方法 |
JP3511359B2 (ja) * | 1998-02-27 | 2004-03-29 | 三菱電機株式会社 | レーザ加工装置 |
US6037564A (en) * | 1998-03-31 | 2000-03-14 | Matsushita Electric Industrial Co., Ltd. | Method for scanning a beam and an apparatus therefor |
JP2001105164A (ja) * | 1999-10-07 | 2001-04-17 | Sumitomo Heavy Ind Ltd | レーザ穴あけ加工方法及び加工装置 |
KR100488165B1 (ko) * | 2002-01-29 | 2005-05-06 | (주)삼성종합호스 | 분수 호스 천공 장치 |
KR100692137B1 (ko) * | 2005-06-30 | 2007-03-12 | 현대자동차주식회사 | 레이저 용접 장치 및 시스템 |
US7538296B2 (en) * | 2005-09-06 | 2009-05-26 | Pratt & Whitney Canada Corp. | High speed laser drilling machine and method |
JP4687657B2 (ja) * | 2007-01-26 | 2011-05-25 | パナソニック株式会社 | レーザ加工装置 |
US8362392B2 (en) | 2008-02-05 | 2013-01-29 | Pratt & Whitney Canada Corp. | Method for drilling holes according to an optimized sequence |
CH700111B1 (fr) * | 2009-09-25 | 2010-06-30 | Agie Sa | Machine d'usinage par laser. |
JP5271394B2 (ja) * | 2011-07-20 | 2013-08-21 | 三星ダイヤモンド工業株式会社 | レーザスクライブ装置 |
WO2013121818A1 (ja) * | 2012-02-14 | 2013-08-22 | 村田機械株式会社 | レーザ加工機 |
-
1993
- 1993-07-16 JP JP17645593A patent/JP3257157B2/ja not_active Expired - Lifetime
-
1994
- 1994-07-16 CN CN94108466A patent/CN1056108C/zh not_active Expired - Lifetime
- 1994-07-16 KR KR1019940017208A patent/KR0141060B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1102796A (zh) | 1995-05-24 |
KR0141060B1 (ko) | 1998-07-15 |
JPH0732183A (ja) | 1995-02-03 |
JP3257157B2 (ja) | 2002-02-18 |
CN1056108C (zh) | 2000-09-06 |
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