KR950002911A - Co_2레이저가공장치 - Google Patents

Co_2레이저가공장치 Download PDF

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Publication number
KR950002911A
KR950002911A KR1019940017208A KR19940017208A KR950002911A KR 950002911 A KR950002911 A KR 950002911A KR 1019940017208 A KR1019940017208 A KR 1019940017208A KR 19940017208 A KR19940017208 A KR 19940017208A KR 950002911 A KR950002911 A KR 950002911A
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KR
South Korea
Prior art keywords
laser
processing
laser processing
processing apparatus
pair
Prior art date
Application number
KR1019940017208A
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English (en)
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KR0141060B1 (ko
Inventor
토시루 오카다
이즈루 나카이
유우지 우에스기
쇼로 모치다
Original Assignee
모리시타 요이찌
마쯔시다덴기산교 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 모리시타 요이찌, 마쯔시다덴기산교 가부시기가이샤 filed Critical 모리시타 요이찌
Publication of KR950002911A publication Critical patent/KR950002911A/ko
Application granted granted Critical
Publication of KR0141060B1 publication Critical patent/KR0141060B1/ko

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

본 발명은, 전자부품, 전자기기 등의 정밀가공에 사용되는 CO₂레이저가공장치에 관한 것으로서, 고속이고 또한 고정밀의 가공을 가공하게 하는 CO₂레이저가공장치를 제공하는 것을 목적으로 한 것이며, 그 구성에 있어서, CO₂레이저발진기(1)와, 회전동작하는 미러(3),(4)와, 미러(3),(4)에 의해 반사·주사되는 레이저광선을 소정의 평면상에 접속시키는 광학부품(7)을 가지고, 임의의 구멍가공에 있어서, 매초 100구멍이상의 가공속도를 실현하는 것을 특징으로 한 것이다.

Description

CO₂레이저가공장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예에 있어서의 CO₂레이저가공장치의 구성을 표시한 도면, 제2도는 동 fe렌즈의 구성을 표시한 도면, 제3도는 본 발명의 제2실시예에 있어서의 CO₂레이저가공장치의 구성을 표시한 도면.

Claims (4)

  1. CO₂레이저발진기와 상기 CO₂레이저발진기로부터 출사한 레이저광선을 반사하고, 주사시키기 위한 1쌍의 회전동작하는 미러와, 상기 1쌍의 회전동작하는 미러에 의해 반사된 레이저광선을 소정의 평면상에 집속시키는 광학부품을 구비한 것을 특징으로 하는 CO₂레이저가공장치.
  2. 제1항에 있어서, 1축이상의 가동위치결정스테이지를 구비한 것을 특징으로 하는 CO₂레이저가공장치.
  3. 1대의 CO₂레이저발진기로부터 출사한 레이저광선을 복수로 분기하고, 각 분기마다 레이저광선을 반사하고, 주사시키기 위한 1쌍의 회전동작하는 미러와, 상기 1쌍의 회전동작하는 미러에 의해 반사, 주사되는 레이저광선을 소정의 평면상에 집속시키는 광학부품을 구비한 것을 특징으로 하는 CO₂레이저가공장치.
  4. 제3항에 있어서, 1대의 CO₂레이저발진기로부터 출사한 레이저광선을 복수로 분기하고, 각 분기마다 1축이상의 가동위치 결정 스테이지를 구비한 것을 특징으로 하는 CO₂레이저가공장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940017208A 1993-07-16 1994-07-16 Co2레이저가공장치 KR0141060B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP17645593A JP3257157B2 (ja) 1993-07-16 1993-07-16 Co2レーザ穴加工装置及び方法
JP93-176455 1993-07-16

Publications (2)

Publication Number Publication Date
KR950002911A true KR950002911A (ko) 1995-02-16
KR0141060B1 KR0141060B1 (ko) 1998-07-15

Family

ID=16014007

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940017208A KR0141060B1 (ko) 1993-07-16 1994-07-16 Co2레이저가공장치

Country Status (3)

Country Link
JP (1) JP3257157B2 (ko)
KR (1) KR0141060B1 (ko)
CN (1) CN1056108C (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7462801B1 (en) * 1996-11-20 2008-12-09 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
US7732732B2 (en) 1996-11-20 2010-06-08 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
JP3213882B2 (ja) * 1997-03-21 2001-10-02 住友重機械工業株式会社 レーザ加工装置及び加工方法
JP3341114B2 (ja) 1997-03-21 2002-11-05 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
JP3511359B2 (ja) * 1998-02-27 2004-03-29 三菱電機株式会社 レーザ加工装置
US6037564A (en) * 1998-03-31 2000-03-14 Matsushita Electric Industrial Co., Ltd. Method for scanning a beam and an apparatus therefor
JP2001105164A (ja) * 1999-10-07 2001-04-17 Sumitomo Heavy Ind Ltd レーザ穴あけ加工方法及び加工装置
KR100488165B1 (ko) * 2002-01-29 2005-05-06 (주)삼성종합호스 분수 호스 천공 장치
KR100692137B1 (ko) * 2005-06-30 2007-03-12 현대자동차주식회사 레이저 용접 장치 및 시스템
US7538296B2 (en) * 2005-09-06 2009-05-26 Pratt & Whitney Canada Corp. High speed laser drilling machine and method
JP4687657B2 (ja) * 2007-01-26 2011-05-25 パナソニック株式会社 レーザ加工装置
US8362392B2 (en) 2008-02-05 2013-01-29 Pratt & Whitney Canada Corp. Method for drilling holes according to an optimized sequence
CH700111B1 (fr) * 2009-09-25 2010-06-30 Agie Sa Machine d'usinage par laser.
JP5271394B2 (ja) * 2011-07-20 2013-08-21 三星ダイヤモンド工業株式会社 レーザスクライブ装置
WO2013121818A1 (ja) * 2012-02-14 2013-08-22 村田機械株式会社 レーザ加工機

Also Published As

Publication number Publication date
CN1102796A (zh) 1995-05-24
KR0141060B1 (ko) 1998-07-15
JPH0732183A (ja) 1995-02-03
JP3257157B2 (ja) 2002-02-18
CN1056108C (zh) 2000-09-06

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