KR940703070A - 전압 가변 커패시터 - Google Patents

전압 가변 커패시터

Info

Publication number
KR940703070A
KR940703070A KR1019940701230A KR19940701230A KR940703070A KR 940703070 A KR940703070 A KR 940703070A KR 1019940701230 A KR1019940701230 A KR 1019940701230A KR 19940701230 A KR19940701230 A KR 19940701230A KR 940703070 A KR940703070 A KR 940703070A
Authority
KR
South Korea
Prior art keywords
layer
insulating layer
semiconductor
high resistivity
variable capacitor
Prior art date
Application number
KR1019940701230A
Other languages
English (en)
Inventor
디 코넷 케네스.
에스. 라마크리스난 이.
에이취. 샤피로 게리.
엠. 칼드웰 레이몬드
홍웨이연
Original Assignee
다니엘 케이. 니콜스
모토로라 인코포레이티드(Motorola, Inc.)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다니엘 케이. 니콜스, 모토로라 인코포레이티드(Motorola, Inc.) filed Critical 다니엘 케이. 니콜스
Publication of KR940703070A publication Critical patent/KR940703070A/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G7/00Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66083Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
    • H01L29/66181Conductor-insulator-semiconductor capacitors, e.g. trench capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/92Capacitors having potential barriers
    • H01L29/94Metal-insulator-semiconductors, e.g. MOS

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

전압 가변 커패시터(10)는 기판의 상부에 저항률이 높은 반도체 재료의 층을 갖는 베이스 기판인 실리콘 웨이퍼를 갖는다. 지르코늄 티탄산염과 같은 반도체(12)의 유전 상수보다 큰 유전상수를 갖는 금속 산화물의 절연층(16)은 저항률이 높은 층의 상부에 형성되며, 금속 전극(18)은 절연층(16)상에 형성된다. 전극이 작동될때, 소모층(20)은 저항률이 높은 층에 형성된다. 전극에 가해진 전압을 변화시키므로써, 장치의 정전용량이 변화된다.

Description

전압 가변 커패시터
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 전압가변 커패시터의 단면도,
제2a도 및 제2b도는 본 발명에 따른 장치를 위한 1MHz(제2b도)와 20KHz(제2a도)에서의 용량 대 전압의 그래프,
제3도는 본 발명에 따른 집적 회로에서 전압 가변 커패시터의 사시도.

Claims (16)

  1. 전압 가변 커패시터에 있어서, 반도체보다 저항률이 높은 반도체 재료의 층을 갖는 반도체와, 저항률이 높은 층에 형성된 소모층과, 저항률이 높은 층에 형성되고, 반도체의 유전상수보다 큰 유전상수를 갖는 금속산화물인 절연층과, 유전층상에 형성된 도전성 전극을 포함하는 것을 특징으로 하는 전압가변 커패시터.
  2. 전압 가변 커패시터에 있어서, 반도체보다 저항률이 높은 반도체 재료의 층을 갖는 반도체와, 저항률이 높은 층에 형성된 소모층과, 저항률이 높은 층에 형성된 절연층과, 절연층상에 형성된 도전성 전극을 포함하며, 상기 절연층은 금속 산화 화합물이며, 상기 금속은 바륨, 납, 리튬, 몰리브덴, 네오디뮴, 니오븀, 스트론튬, 탄탈, 티타늄, 텅스텐, 바나듐, 및 지르코늄으로 구성된 집단에서 선택된 적어도 제1 및 제2성분을 포함하며, 상기 절연층은 반도체의 유전상수보다 큰 유전상수를 갖는 것을 특징으로 하는 전압가변 커패시터.
  3. 전압 가변 커패시터에 있어서, 반도체보다 저항률이 높은 반도체 재료의 층을 갖는 반도체와, 저항률이 높은 층에 형성된 소모층과, 저항률이 높은 층에 형성된 절연층과, 절연층상에 형성된 도전성 전극을 포함하며, 상기 절연층은 바륨, 납, 리튬, 몰리브덴, 네오디뮴, 니오븀, 스트론튬, 탄탈, 티타늄, 텅스텐, 바나듐, 및 지르코늄 등의 산화물로 구성된 집단에서 선택된 산화물이며, 상기 절연층은 반도체의 유전상수보다 큰 유전상수를 갖는 것을 특징으로 하는 전압가변 커패시터.
  4. 제1항에 있어서, 절연층은 지르코늄 티탄산염을 포함하는 것을 특징으로 하는 전압가변 커패시터.
  5. 제1항에 있어서, 절연층은 16 보다 큰 유전 상수를 갖는 것을 특징으로 하는 전압가변 커패시터.
  6. 제1항에 있어서, 절연층은 저손실의 비강유전성 절연체를 포함하는 것을 특징으로 하는 전압가변 커패시터.
  7. 제1항에 있어서, 절연층은 유전상수는 저항률이 높은 반도체 재료의 유전상수보다 큰 것을 특징으로 하는 전압가변 커패시터.
  8. 전압 가변 커패시터에 있어서, 반도체보다 저항률이 높은 반도체 재료의 층을 갖는 반도체와, 저항률이 높은 층에 형성된 소모층과, 저항률이 높은 층에 형성되고, 반도체의 유전상수보다 큰 유전상수를 갖는 금속산화물인 절연층과, 절연층상에 형성된 도전성 전극을 포함하는 것을 특징으로 하는 전압가변 커패시터.
  9. 전압가변 박막 커패시터에 있어서, 저항률이 높은 반도체 재료층을 갖는 반도체와, 저항률이 높은 층에 형성되고, 지르코늄 티탄산염의 박막과 지르코늄 티탄산염상에 형성된 금속전극을 포함하는 절연층과, 커패시터의 전기적 작동에 따라 저항률이 높은 층에 형성된 소모층을 포함하는 것을 특징으로 하는 전압 가변 박막 커패시터.
  10. 유전 상수가 40이거나 40보다 큰 저손실의 비강유전성 재료를 포함하는 것을 특징으로 하는 전압 가변 커패시터용 절연층.
  11. 전압 가변 커패시터용의 절연층에 있어서, 유전 상수가 40이거나 40보다 큰 저손실의 비강유전성 재료를 포함하며, 상기 절연층은 금속 산화물이며, 상기 금속은 바륨, 납, 리튬, 몰리브덴, 네오디뮴, 니오븀, 스트론튬, 탄탈, 티타늄, 텅스텐, 바나듐, 및 지르코늄으로 구성된 집단에서 선택된 적어도 제1 및 제2성분을 포함하는 것을 특징으로 하는 전압 가변 커패시터용 절연층.
  12. 전압 가변 커패시터용의 절연층에 있어서, 유전상수가 40이거나 40보다 큰 저손실의 비강유전성 재료를 포함하며, 상기 절연층은 바륨, 납, 리튬, 몰리브덴, 네오디뮴, 니오븀, 스트론튬, 탄탈, 티타늄, 텅스텐, 바나듐, 및 지르코늄 등의 산화물로 구성된 집단에서 선택된 산화물인 것을 특징으로 하는 전압 가변 커패시터용의 절연층.
  13. 제10항에 있어서, 상기 재료는 지르코늄 티탄산염을 포함하는 것을 특징으로 하는 전압가변 커패시터용 절연층.
  14. 전압 가변 커패시터의 제조 방법에 있어서, 저항률이 높은 반도체 재료층을 동일한 도전형태를 갖는 반도체상에 침착하는 단계와, 반도체의 유전상수보다 큰 유전상수를 갖는 금속 산화물과 금속 티탄산염 또는 금속 니오브산염의 층을 저항률이 높은 층의 표면에 침착하는 단계와, 절연재료상에 전극을 형성하는 단계와, 저항률이 높은 층에 소모층을 형성하기 위하여 전극에 전압을 가하는 단계를 포함하는 것을 특징으로 하는 전압가변 커패시터의 제조 방법.
  15. 제14항에 있어서, 스퍼터링, 증발, 화학증착, 이온 비임, 플라즈마, 졸-겔, 또는 용액 화학처리에 의해 코팅을 실시하는 코팅단계를 포함하는 것을 특징으로 하는 전압 가변 커패시터의 제조 방법.
  16. 적어도 하나의 전압가변 커패시터를 구비한 공진기를 갖는 라디오에 있어서, 상기 전압가변 커패시터는, 저항률이 높은 반도체성 재료의 층을 갖는 반도체 기판과, 저항률이 높은 층에 형성된 소모층과, 저항률이 높은 층에 형성되고, 지르코늄 티탄산염 박막을 포함하는 절연층과, 소모층의 바로 위의 지역에서 지르코늄 티탄산염상에 형성된 전극을 포함하는 것을 특징으로 하는 공진기를 갖는 라디오.
    ※참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940701230A 1991-10-15 1992-10-15 전압 가변 커패시터 KR940703070A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US776,111 1991-10-15
US07/776,111 US5173835A (en) 1991-10-15 1991-10-15 Voltage variable capacitor
PCT/US1992/008781 WO1993008578A1 (en) 1991-10-15 1992-10-15 Voltage variable capacitor

Publications (1)

Publication Number Publication Date
KR940703070A true KR940703070A (ko) 1994-09-17

Family

ID=25106486

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1019940701230A KR0134980B1 (ko) 1991-10-15 1992-10-15 전압가변 커패시터(Voltage varible capacitor)
KR1019940701230A KR940703070A (ko) 1991-10-15 1992-10-15 전압 가변 커패시터

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1019940701230A KR0134980B1 (ko) 1991-10-15 1992-10-15 전압가변 커패시터(Voltage varible capacitor)

Country Status (7)

Country Link
US (1) US5173835A (ko)
EP (1) EP0608376B1 (ko)
JP (1) JP2853332B2 (ko)
KR (2) KR0134980B1 (ko)
DE (1) DE69232740T2 (ko)
ES (1) ES2181679T3 (ko)
WO (1) WO1993008578A1 (ko)

Families Citing this family (110)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0568064B1 (en) * 1992-05-01 1999-07-14 Texas Instruments Incorporated Pb/Bi-containing high-dielectric constant oxides using a non-Pb/Bi-containing perovskite as a buffer layer
JPH0677402A (ja) * 1992-07-02 1994-03-18 Natl Semiconductor Corp <Ns> 半導体デバイス用誘電体構造及びその製造方法
US5587870A (en) * 1992-09-17 1996-12-24 Research Foundation Of State University Of New York Nanocrystalline layer thin film capacitors
US5390072A (en) * 1992-09-17 1995-02-14 Research Foundation Of State University Of New York Thin film capacitors
US5379008A (en) * 1993-03-03 1995-01-03 Motorola, Inc. Variable impedance circuit providing reduced distortion
US5933316A (en) * 1993-08-02 1999-08-03 Motorola Inc. Method for forming a titanate thin film on silicon, and device formed thereby
US5405790A (en) * 1993-11-23 1995-04-11 Motorola, Inc. Method of forming a semiconductor structure having MOS, bipolar, and varactor devices
US5495208A (en) * 1994-04-04 1996-02-27 Motorola, Inc. Wide band tunable and modulatable reference oscillator
US5615096A (en) * 1994-06-06 1997-03-25 Motorola, Inc. Direct current power supply conditioning circuit
US5600187A (en) * 1994-06-27 1997-02-04 General Electric Company Electronically controllable capacitors using power MOSFET's
US5493715A (en) * 1994-08-01 1996-02-20 Motorola, Inc. Multi-range voltage controlled resonant circuit
US5602052A (en) * 1995-04-24 1997-02-11 Harris Corporation Method of forming dummy island capacitor
US5673001A (en) * 1995-06-07 1997-09-30 Motorola, Inc. Method and apparatus for amplifying a signal
US5888585A (en) * 1996-02-08 1999-03-30 Symetrix Corporation Process for making an integrated circuit with high dielectric constant barium-strontium-niobium oxide
JP3161333B2 (ja) * 1996-07-22 2001-04-25 日本電気株式会社 半導体装置およびその製造方法
EP1002340A4 (en) * 1996-10-25 2000-05-24 Superconducting Core Technolog TUNABLE DIELECTRIC FLIP CHIP VARACTORS
US5744385A (en) * 1997-03-21 1998-04-28 Plato Labs, Inc. Compensation technique for parasitic capacitance
US6841439B1 (en) * 1997-07-24 2005-01-11 Texas Instruments Incorporated High permittivity silicate gate dielectric
US6020243A (en) 1997-07-24 2000-02-01 Texas Instruments Incorporated Zirconium and/or hafnium silicon-oxynitride gate dielectric
US7115461B2 (en) * 1997-07-24 2006-10-03 Texas Instruments Incorporated High permittivity silicate gate dielectric
US5959515A (en) * 1997-08-11 1999-09-28 Motorola, Inc. High Q integrated resonator structure
US5965912A (en) * 1997-09-03 1999-10-12 Motorola, Inc. Variable capacitor and method for fabricating the same
SE515783C2 (sv) * 1997-09-11 2001-10-08 Ericsson Telefon Ab L M Elektriska anordningar jämte förfarande för deras tillverkning
WO1999023705A1 (de) * 1997-10-30 1999-05-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Passives hf-element und verfahren zum betreiben, zum herstellen und zum bestimmen von charakteristischen eigenschaften desselben
US6268779B1 (en) * 1999-03-19 2001-07-31 Telefonaktiebolaget Lm Ericsson (Publ) Integrated oscillators and tuning circuits
US6057203A (en) * 1998-06-19 2000-05-02 Programmable Silicon Solutions Integrated circuit capacitor
US6727535B1 (en) * 1998-11-09 2004-04-27 Paratek Microwave, Inc. Ferroelectric varactor with built-in DC blocks
US6507476B1 (en) 1999-11-01 2003-01-14 International Business Machines Corporation Tuneable ferroelectric decoupling capacitor
US20030058022A1 (en) * 1999-12-14 2003-03-27 Rajendran Nair Device and method for controlling voltage variation
US6828638B2 (en) 1999-12-22 2004-12-07 Intel Corporation Decoupling capacitors for thin gate oxides
US6278158B1 (en) * 1999-12-29 2001-08-21 Motorola, Inc. Voltage variable capacitor with improved C-V linearity
US6693033B2 (en) 2000-02-10 2004-02-17 Motorola, Inc. Method of removing an amorphous oxide from a monocrystalline surface
SE516361C2 (en) * 2000-05-16 2002-01-08 Ericsson Telefon Ab L M LC tank formed on a low resistivity substrate for use in resonators used in microwave filters, oscillators etc., has adjacent strips leading current in opposite directions and arranged so that substrate currents balance out
US6504443B1 (en) 2000-05-17 2003-01-07 Nec America, Inc., Common anode varactor tuned LC circuit
EP1309994A2 (de) * 2000-08-18 2003-05-14 Siemens Aktiengesellschaft Verkapseltes organisch-elektronisches bauteil, verfahren zu seiner herstellung und seine verwendung
JP2004507096A (ja) * 2000-08-18 2004-03-04 シーメンス アクチエンゲゼルシヤフト 有機電界効果トランジスタ(ofet),該有機電界効果トランジスタの製造方法、前記有機電界効果トランジスタから形成される集積回路、及び該集積回路の使用
DE10044842A1 (de) * 2000-09-11 2002-04-04 Siemens Ag Organischer Gleichrichter, Schaltung, RFID-Tag und Verwendung eines organischen Gleichrichters
WO2002025750A1 (de) * 2000-09-22 2002-03-28 Siemens Aktiengesellschaft Elektrode und/oder leiterbahn für organische bauelemente und herstellungsverfahren dazu
US6521939B1 (en) 2000-09-29 2003-02-18 Chartered Semiconductor Manufacturing Ltd. High performance integrated varactor on silicon
US6638838B1 (en) 2000-10-02 2003-10-28 Motorola, Inc. Semiconductor structure including a partially annealed layer and method of forming the same
DE10061286C1 (de) * 2000-12-08 2002-04-04 Hollingsworth Gmbh Vorrichtung zum Aufziehen einer Kardiergarnitur
DE10061297C2 (de) 2000-12-08 2003-05-28 Siemens Ag Verfahren zur Sturkturierung eines OFETs
DE10061299A1 (de) * 2000-12-08 2002-06-27 Siemens Ag Vorrichtung zur Feststellung und/oder Weiterleitung zumindest eines Umwelteinflusses, Herstellungsverfahren und Verwendung dazu
US6686817B2 (en) * 2000-12-12 2004-02-03 Paratek Microwave, Inc. Electronic tunable filters with dielectric varactors
DE10195711T1 (de) * 2000-12-21 2003-12-04 Valeriy Moiseevich Ioffe Halbleitergerät
DE10105914C1 (de) * 2001-02-09 2002-10-10 Siemens Ag Organischer Feldeffekt-Transistor mit fotostrukturiertem Gate-Dielektrikum und ein Verfahren zu dessen Erzeugung
US6673646B2 (en) 2001-02-28 2004-01-06 Motorola, Inc. Growth of compound semiconductor structures on patterned oxide films and process for fabricating same
WO2002078052A2 (de) * 2001-03-26 2002-10-03 Siemens Aktiengesellschaft Gerät mit zumindest zwei organischen elektronischen bauteilen und verfahren zur herstellung dazu
DE10126859A1 (de) * 2001-06-01 2002-12-12 Siemens Ag Verfahren zur Erzeugung von leitfähigen Strukturen mittels Drucktechnik sowie daraus hergestellte aktive Bauelemente für integrierte Schaltungen
DE10126860C2 (de) * 2001-06-01 2003-05-28 Siemens Ag Organischer Feldeffekt-Transistor, Verfahren zu seiner Herstellung und Verwendung zum Aufbau integrierter Schaltungen
US6709989B2 (en) 2001-06-21 2004-03-23 Motorola, Inc. Method for fabricating a semiconductor structure including a metal oxide interface with silicon
US6646293B2 (en) 2001-07-18 2003-11-11 Motorola, Inc. Structure for fabricating high electron mobility transistors utilizing the formation of complaint substrates
US6693298B2 (en) 2001-07-20 2004-02-17 Motorola, Inc. Structure and method for fabricating epitaxial semiconductor on insulator (SOI) structures and devices utilizing the formation of a compliant substrate for materials used to form same
US6667196B2 (en) 2001-07-25 2003-12-23 Motorola, Inc. Method for real-time monitoring and controlling perovskite oxide film growth and semiconductor structure formed using the method
US6639249B2 (en) 2001-08-06 2003-10-28 Motorola, Inc. Structure and method for fabrication for a solid-state lighting device
US6673667B2 (en) 2001-08-15 2004-01-06 Motorola, Inc. Method for manufacturing a substantially integral monolithic apparatus including a plurality of semiconductor materials
DE10151036A1 (de) 2001-10-16 2003-05-08 Siemens Ag Isolator für ein organisches Elektronikbauteil
US20030071327A1 (en) * 2001-10-17 2003-04-17 Motorola, Inc. Method and apparatus utilizing monocrystalline insulator
DE10151440C1 (de) * 2001-10-18 2003-02-06 Siemens Ag Organisches Elektronikbauteil, Verfahren zu seiner Herstellung und seine Verwendung
US6541814B1 (en) 2001-11-06 2003-04-01 Pericom Semiconductor Corp. MOS variable capacitor with controlled dC/dV and voltage drop across W of gate
US6667539B2 (en) 2001-11-08 2003-12-23 International Business Machines Corporation Method to increase the tuning voltage range of MOS varactors
JP3978019B2 (ja) * 2001-11-19 2007-09-19 矢崎化工株式会社 樹脂被覆鋼管における鋼管と被覆樹脂の分離回収方法、及び分離回収設備
DE10160732A1 (de) * 2001-12-11 2003-06-26 Siemens Ag Organischer Feld-Effekt-Transistor mit verschobener Schwellwertspannung und Verwendung dazu
US20050113138A1 (en) * 2002-03-18 2005-05-26 Greg Mendolia RF ID tag reader utlizing a scanning antenna system and method
DE10212639A1 (de) * 2002-03-21 2003-10-16 Siemens Ag Vorrichtung und Verfahren zur Laserstrukturierung von Funktionspolymeren und Verwendungen
DE10212640B4 (de) * 2002-03-21 2004-02-05 Siemens Ag Logische Bauteile aus organischen Feldeffekttransistoren
DE10226370B4 (de) * 2002-06-13 2008-12-11 Polyic Gmbh & Co. Kg Substrat für ein elektronisches Bauteil, Verwendung des Substrates, Verfahren zur Erhöhung der Ladungsträgermobilität und Organischer Feld-Effekt Transistor (OFET)
EP1525630A2 (de) * 2002-07-29 2005-04-27 Siemens Aktiengesellschaft Elektronisches bauteil mit vorwiegend organischen funktionsmaterialien und herstellungsverfahren dazu
ATE395955T1 (de) * 2002-08-08 2008-06-15 Polyic Gmbh & Co Kg Elektronisches gerät
ATE355566T1 (de) 2002-08-23 2006-03-15 Polyic Gmbh & Co Kg Organisches bauelement zum überspannungsschutz und dazugehörige schaltung
WO2004042837A2 (de) * 2002-11-05 2004-05-21 Siemens Aktiengesellschaft Organisches elektronisches bauteil mit hochaufgelöster strukturierung und herstellungsverfahren dazu
DE10253154A1 (de) * 2002-11-14 2004-05-27 Siemens Ag Messgerät zur Bestimmung eines Analyten in einer Flüssigkeitsprobe
ATE354182T1 (de) * 2002-11-19 2007-03-15 Polyic Gmbh & Co Kg Organische elektronische schaltung mit stukturierter halbleitender funktionsschicht und herstellungsverfahren dazu
ATE540436T1 (de) * 2002-11-19 2012-01-15 Polyic Gmbh & Co Kg Organisches elektronisches bauelement mit gleichem organischem material für zumindest zwei funktionsschichten
DE10300521A1 (de) * 2003-01-09 2004-07-22 Siemens Ag Organoresistiver Speicher
DE10302149A1 (de) * 2003-01-21 2005-08-25 Siemens Ag Verwendung leitfähiger Carbon-black/Graphit-Mischungen für die Herstellung von low-cost Elektronik
EP1586127B1 (de) * 2003-01-21 2007-05-02 PolyIC GmbH & Co. KG Organisches elektronikbauteil und verfahren zur herstellung organischer elektronik
KR100528464B1 (ko) * 2003-02-06 2005-11-15 삼성전자주식회사 스마트카드의 보안장치
CN1774806B (zh) 2003-02-14 2010-06-16 日本电气株式会社 线路元件和使用线路元件的半导体电路
JP5121114B2 (ja) * 2003-05-29 2013-01-16 三洋電機株式会社 画素回路および表示装置
DE10330062A1 (de) * 2003-07-03 2005-01-27 Siemens Ag Verfahren und Vorrichtung zur Strukturierung von organischen Schichten
DE10330064B3 (de) * 2003-07-03 2004-12-09 Siemens Ag Logikgatter mit potentialfreier Gate-Elektrode für organische integrierte Schaltungen
DE10338277A1 (de) * 2003-08-20 2005-03-17 Siemens Ag Organischer Kondensator mit spannungsgesteuerter Kapazität
DE10339036A1 (de) 2003-08-25 2005-03-31 Siemens Ag Organisches elektronisches Bauteil mit hochaufgelöster Strukturierung und Herstellungsverfahren dazu
DE10340643B4 (de) * 2003-09-03 2009-04-16 Polyic Gmbh & Co. Kg Druckverfahren zur Herstellung einer Doppelschicht für Polymerelektronik-Schaltungen, sowie dadurch hergestelltes elektronisches Bauelement mit Doppelschicht
DE10340644B4 (de) * 2003-09-03 2010-10-07 Polyic Gmbh & Co. Kg Mechanische Steuerelemente für organische Polymerelektronik
DE102004002024A1 (de) * 2004-01-14 2005-08-11 Siemens Ag Organischer Transistor mit selbstjustierender Gate-Elektrode und Verfahren zu dessen Herstellung
DE102004040831A1 (de) 2004-08-23 2006-03-09 Polyic Gmbh & Co. Kg Funketikettfähige Umverpackung
DE102004059464A1 (de) 2004-12-10 2006-06-29 Polyic Gmbh & Co. Kg Elektronikbauteil mit Modulator
DE102004059465A1 (de) 2004-12-10 2006-06-14 Polyic Gmbh & Co. Kg Erkennungssystem
DE102004063435A1 (de) 2004-12-23 2006-07-27 Polyic Gmbh & Co. Kg Organischer Gleichrichter
DE102005009819A1 (de) 2005-03-01 2006-09-07 Polyic Gmbh & Co. Kg Elektronikbaugruppe
DE102005009820A1 (de) 2005-03-01 2006-09-07 Polyic Gmbh & Co. Kg Elektronikbaugruppe mit organischen Logik-Schaltelementen
DE102005017655B4 (de) 2005-04-15 2008-12-11 Polyic Gmbh & Co. Kg Mehrschichtiger Verbundkörper mit elektronischer Funktion
US7936344B2 (en) * 2005-05-03 2011-05-03 Hannstar Display Corporation Pixel structure with improved viewing angle
CN101228630B (zh) 2005-05-30 2011-10-05 株式会社半导体能源研究所 半导体器件
DE102005031448A1 (de) 2005-07-04 2007-01-11 Polyic Gmbh & Co. Kg Aktivierbare optische Schicht
US7276910B2 (en) * 2005-07-19 2007-10-02 Seektech, Inc. Compact self-tuned electrical resonator for buried object locator applications
DE102005035589A1 (de) 2005-07-29 2007-02-01 Polyic Gmbh & Co. Kg Verfahren zur Herstellung eines elektronischen Bauelements
DE102005044306A1 (de) 2005-09-16 2007-03-22 Polyic Gmbh & Co. Kg Elektronische Schaltung und Verfahren zur Herstellung einer solchen
EP1909384A3 (en) * 2006-10-06 2015-11-25 Semiconductor Energy Laboratory Co., Ltd. Rectifier circuit with variable capacitor, semiconductor device using the circuit, and driving method therefor
JP5325415B2 (ja) * 2006-12-18 2013-10-23 株式会社半導体エネルギー研究所 半導体装置
TW200849759A (en) * 2007-06-08 2008-12-16 Univ Chang Gung Cascade EMP protection circuit
US20090088105A1 (en) * 2007-09-28 2009-04-02 Ahmadreza Rofougaran Method and system for utilizing a programmable coplanar waveguide or microstrip bandpass filter for undersampling in a receiver
TWI363914B (en) 2007-11-21 2012-05-11 Hannstar Display Corp Liquid crystal display
TWI445241B (zh) * 2008-03-21 2014-07-11 Univ Chang Gung Electromagnetic pulse protection circuit with filtering function
JP5185845B2 (ja) * 2009-01-27 2013-04-17 株式会社神戸製鋼所 可変容量素子
KR101067496B1 (ko) * 2009-04-08 2011-09-27 주식회사 에스세라 전압 가변부 및 이를 구비하는 표면 실장 소자
US9923101B2 (en) * 2012-09-13 2018-03-20 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor structure
US10319426B2 (en) * 2017-05-09 2019-06-11 Micron Technology, Inc. Semiconductor structures, memory cells and devices comprising ferroelectric materials, systems including same, and related methods

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3202891A (en) * 1960-11-30 1965-08-24 Gen Telephone & Elect Voltage variable capacitor with strontium titanate dielectric
US3512052A (en) * 1968-01-11 1970-05-12 Gen Motors Corp Metal-insulator-semiconductor voltage variable capacitor with controlled resistivity dielectric
US3648340A (en) * 1969-08-11 1972-03-14 Gen Motors Corp Hybrid solid-state voltage-variable tuning capacitor
US3634738A (en) * 1970-10-06 1972-01-11 Kev Electronics Corp Diode having a voltage variable capacitance characteristic and method of making same
US3809971A (en) * 1972-03-17 1974-05-07 Norton Co Microfarad range varactor
US3890635A (en) * 1973-12-26 1975-06-17 Gen Electric Variable capacitance semiconductor devices
US4005466A (en) * 1975-05-07 1977-01-25 Rca Corporation Planar voltage variable tuning capacitors
JPS5745968A (en) * 1980-08-29 1982-03-16 Ibm Capacitor with double dielectric unit
JPS5873146A (ja) * 1981-10-28 1983-05-02 Hitachi Ltd 混成集積回路とその製造方法
US4782350A (en) * 1987-10-28 1988-11-01 Xerox Corporation Amorphous silicon varactors as rf amplitude modulators and their application to acoustic ink printers
US5192871A (en) * 1991-10-15 1993-03-09 Motorola, Inc. Voltage variable capacitor having amorphous dielectric film

Also Published As

Publication number Publication date
JP2853332B2 (ja) 1999-02-03
EP0608376A1 (en) 1994-08-03
WO1993008578A1 (en) 1993-04-29
DE69232740T2 (de) 2002-12-05
EP0608376B1 (en) 2002-08-21
JPH07500457A (ja) 1995-01-12
KR0134980B1 (ko) 1998-05-15
ES2181679T3 (es) 2003-03-01
EP0608376A4 (en) 1994-12-07
DE69232740D1 (de) 2002-09-26
US5173835A (en) 1992-12-22

Similar Documents

Publication Publication Date Title
KR940703070A (ko) 전압 가변 커패시터
US3512052A (en) Metal-insulator-semiconductor voltage variable capacitor with controlled resistivity dielectric
US5811868A (en) Integrated high-performance decoupling capacitor
KR100935263B1 (ko) 베이스 금속 전극 위의 금속 산화 세라믹 박막 장치 및 그 장치를 포함하는 커패시터의 형성 방법
KR100268643B1 (ko) 용량소자 및 이것의 제조방법
KR930702788A (ko) 비결정질 유전체막을 갖는 전압 가변 캐패시터
KR100480603B1 (ko) 일정한 커패시턴스를 갖는 금속-절연체-금속 커패시터를 포함하는 반도체 소자
US6461929B1 (en) Method for the fine tuning of a passive electronic component
US10141115B2 (en) Thin film capacitor including alternatively disposed dielectric layers having different thicknesses
US3320484A (en) Dielectric devices
TWI579875B (zh) 一種可變功率電容器及其控制方法及應用
KR100753777B1 (ko) Zr-Ge-Ti-O 또는 Hf-Ge-Ti-O의 유전체 물질을 포함하는 물품 및 그 제조 방법
US3624895A (en) Metal-insulator-semiconductor voltage variable capacitor with controlled resistivity dielectric
JP2004031408A (ja) 薄膜積層デバイス、回路および薄膜積層デバイスの製造方法
KR100751744B1 (ko) 메모리 셀 커패시터 구조에서 메모리 셀 커패시터 판을형성하는 방법
EP0232117B1 (en) Semiconductor variable capacitance element
JP3131498B2 (ja) 薄膜コンデンサ
KR100781964B1 (ko) 내장형 커패시터 및 그 제조 방법
Jackson Dielectric materials in thin film capacitors
JP2776115B2 (ja) 薄膜コンデンサ及びその製造方法
KR100211728B1 (ko) 캐패시터용 콤포지트 파우더
JPH06325969A (ja) 薄膜コンデンサおよびその製造方法
JP2003045745A (ja) 薄膜コンデンサ
KR19990030185A (ko) 전자 구성 요소
Kim et al. Microstructure and Electrical Properties of Amorphous $\hbox {Bi} _ {5}\hbox {Nb} _ {3}\hbox {O} _ {15} $ Films Grown on Cu/Ti/$\hbox {SiO} _ {2} $/Si Substrates Using RF Magnetron Sputtering

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20021230

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee