KR940016879A - Method for forming self-aligned contact of semiconductor device - Google Patents
Method for forming self-aligned contact of semiconductor device Download PDFInfo
- Publication number
- KR940016879A KR940016879A KR1019920026717A KR920026717A KR940016879A KR 940016879 A KR940016879 A KR 940016879A KR 1019920026717 A KR1019920026717 A KR 1019920026717A KR 920026717 A KR920026717 A KR 920026717A KR 940016879 A KR940016879 A KR 940016879A
- Authority
- KR
- South Korea
- Prior art keywords
- forming
- etching
- wet etching
- semiconductor device
- film
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 9
- 239000004065 semiconductor Substances 0.000 title claims abstract 4
- 150000004767 nitrides Chemical class 0.000 claims abstract 9
- 238000001039 wet etching Methods 0.000 claims abstract 7
- 238000001312 dry etching Methods 0.000 claims abstract 4
- 238000005530 etching Methods 0.000 claims abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 2
- 229920005591 polysilicon Polymers 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
본 발명은 반도체 소자의 자기정렬콘택 형성방법에 관한 것으로 습식식각과 건식식각으로 콘택홀을 형성할 경우 습식식각의 언더컷으로 인하여 발생하는 누설전류를 방지하기 위하여 식각해야 하는 산화막을 2회에 나누어서 건식식각과 습식식각방법을 적용하여 먼저 건식식각후에 건식식각으로 형성된 측벽에 질화막을 구성하여 후속산화막 습식식각시 언더컷을 방지하여 소자의 신뢰성을 증가시키는 반도체 소자의 자기정렬콘택 형성방법이다.The present invention relates to a method of forming a self-aligned contact of a semiconductor device, when forming a contact hole by wet etching and dry etching, dry the oxide film to be etched in two times to prevent leakage current caused by undercut of wet etching. It is a method of forming a self-aligned contact of a semiconductor device to increase the reliability of the device by preventing the undercut during the subsequent oxide wet etching by forming a nitride film on the sidewall formed by dry etching after the dry etching by applying the etching and wet etching method.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제2A도 내지 제2F도는 본 발명에 의한 자기정렬콘택 형성방법을 나타낸 단면도.2A to 2F are cross-sectional views showing a method for forming a self-aligned contact according to the present invention.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR92026717A KR960004086B1 (en) | 1992-12-30 | 1992-12-30 | Forming method of self aligned contact for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR92026717A KR960004086B1 (en) | 1992-12-30 | 1992-12-30 | Forming method of self aligned contact for semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940016879A true KR940016879A (en) | 1994-07-25 |
KR960004086B1 KR960004086B1 (en) | 1996-03-26 |
Family
ID=19347852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR92026717A KR960004086B1 (en) | 1992-12-30 | 1992-12-30 | Forming method of self aligned contact for semiconductor device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR960004086B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100400298B1 (en) * | 1999-06-11 | 2003-10-04 | 주식회사 하이닉스반도체 | A method of manufacturing self align contact of semiconductor device |
US7199433B2 (en) | 1995-07-18 | 2007-04-03 | Renesas Technology Corp. | Method of manufacturing semiconductor integrated circuit device having capacitor element |
-
1992
- 1992-12-30 KR KR92026717A patent/KR960004086B1/en not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7199433B2 (en) | 1995-07-18 | 2007-04-03 | Renesas Technology Corp. | Method of manufacturing semiconductor integrated circuit device having capacitor element |
US7323735B2 (en) | 1995-07-18 | 2008-01-29 | Renesas Technology Corp. | Method of manufacturing semiconductor integrated circuit device having capacitor element |
US7598558B2 (en) | 1995-07-18 | 2009-10-06 | Renesas Technology Corp. | Method of manufacturing semiconductor integrated circuit device having capacitor element |
KR100400298B1 (en) * | 1999-06-11 | 2003-10-04 | 주식회사 하이닉스반도체 | A method of manufacturing self align contact of semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
KR960004086B1 (en) | 1996-03-26 |
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