KR940016739A - 반도체 집적회로 제조방법 - Google Patents

반도체 집적회로 제조방법 Download PDF

Info

Publication number
KR940016739A
KR940016739A KR1019930028975A KR930028975A KR940016739A KR 940016739 A KR940016739 A KR 940016739A KR 1019930028975 A KR1019930028975 A KR 1019930028975A KR 930028975 A KR930028975 A KR 930028975A KR 940016739 A KR940016739 A KR 940016739A
Authority
KR
South Korea
Prior art keywords
notch
integrated circuit
semiconductor integrated
wafer
circuit manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019930028975A
Other languages
English (en)
Korean (ko)
Inventor
조세 코네크 콘라드
Original Assignee
제이.티.레베르그
아메리칸 텔리폰 앤드 텔레그라프 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제이.티.레베르그, 아메리칸 텔리폰 앤드 텔레그라프 캄파니 filed Critical 제이.티.레베르그
Publication of KR940016739A publication Critical patent/KR940016739A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W46/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/003—Multipurpose machines; Equipment therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • H10W46/201—
    • H10W46/401—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
KR1019930028975A 1992-12-24 1993-12-22 반도체 집적회로 제조방법 Withdrawn KR940016739A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US99645692A 1992-12-24 1992-12-24
US92-996,456 1992-12-24

Publications (1)

Publication Number Publication Date
KR940016739A true KR940016739A (ko) 1994-07-25

Family

ID=25542949

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930028975A Withdrawn KR940016739A (ko) 1992-12-24 1993-12-22 반도체 집적회로 제조방법

Country Status (4)

Country Link
EP (1) EP0604061A1 (cg-RX-API-DMAC10.html)
JP (1) JPH06232016A (cg-RX-API-DMAC10.html)
KR (1) KR940016739A (cg-RX-API-DMAC10.html)
TW (1) TW230262B (cg-RX-API-DMAC10.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0147672B1 (ko) * 1995-11-30 1998-08-01 김광호 웨이퍼를 용이하게 구별하기 위한 라벨
JP4109371B2 (ja) * 1999-01-28 2008-07-02 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェハ
JP4197103B2 (ja) * 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
JP2008294365A (ja) * 2007-05-28 2008-12-04 Sanyo Electric Co Ltd 太陽電池の製造方法
US9640486B2 (en) 2007-06-13 2017-05-02 Conergy Ag Ingot marking for solar cell determination
US20100300259A1 (en) * 2009-05-29 2010-12-02 Applied Materials, Inc. Substrate side marking and identification
CN103489752A (zh) * 2013-09-26 2014-01-01 中国科学院半导体研究所 截面为多边形的晶棒及衬底片表面取向的标识方法
JP7096657B2 (ja) * 2017-10-02 2022-07-06 株式会社ディスコ ウェーハの加工方法
CN111497043B (zh) * 2020-03-05 2022-04-05 秦皇岛本征晶体科技有限公司 一种氟化镁波片元件的制作方法
JP7663428B2 (ja) * 2021-06-29 2025-04-16 株式会社ディスコ マーキング装置およびウエーハ生成装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4084354A (en) * 1977-06-03 1978-04-18 International Business Machines Corporation Process for slicing boules of single crystal material
JPS5572034A (en) * 1978-11-27 1980-05-30 Internatl Rectifier Corp Japan Ltd Preparing semiconductor element
JPS61196512A (ja) * 1985-02-26 1986-08-30 Nec Corp 半導体装置の製造方法
JPH0196920A (ja) * 1987-10-09 1989-04-14 Fujitsu Ltd ウエーハの識別方法
US4794238A (en) * 1987-10-09 1988-12-27 Ultracision, Inc. Method and apparatus for reading and marking a small bar code on a surface of an item
JPH02183509A (ja) * 1989-01-10 1990-07-18 Seiko Epson Corp 半導体基板の識別方法
JPH02278809A (ja) * 1989-04-20 1990-11-15 Hitachi Ltd 半導体ウェハ

Also Published As

Publication number Publication date
TW230262B (cg-RX-API-DMAC10.html) 1994-09-11
EP0604061A1 (en) 1994-06-29
JPH06232016A (ja) 1994-08-19

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Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000