KR940012593A - 공정 데이타 확인/분석이 용이한 반도체 패키지 - Google Patents

공정 데이타 확인/분석이 용이한 반도체 패키지 Download PDF

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KR940012593A
KR940012593A KR1019920022593A KR920022593A KR940012593A KR 940012593 A KR940012593 A KR 940012593A KR 1019920022593 A KR1019920022593 A KR 1019920022593A KR 920022593 A KR920022593 A KR 920022593A KR 940012593 A KR940012593 A KR 940012593A
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process data
semiconductor package
package
data
wafer
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KR1019920022593A
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KR950010865B1 (ko
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김대성
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문정환
금성일렉트론주식회사
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Priority to KR1019920022593A priority Critical patent/KR950010865B1/ko
Priority to DE19934340223 priority patent/DE4340223A1/de
Priority to JP29656793A priority patent/JPH06216265A/ja
Publication of KR940012593A publication Critical patent/KR940012593A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/19041—Component type being a capacitor

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

본 발명은 공정 데이터 확인/분석이 용이한 반도체 패키지에 관한 것으로, 제품출하후 필드에서의 에러 발생 원인을 쉽게 찾아 명확하게 분석/조치할 수 있도록 하기 위하여 소자(11)가 내장된 패키지몸체(12)의 양외측으로 상기 소자와 전기적으로 연결된 다수개의 리드(13)가 외향돌출형성된 반도체 패키지에 있어서, 상기 패키지몸체(12)의 하면 일측에 내부 소자의 런넘버(Run #), 웨이퍼 넘버(Wafer #), 웨이퍼 내에서의 소자위치좌표(X, Y) 및 전기적 특성 검사에 대한 데이터등과 같은 소자정보가 바코드 형태로 표기된 공정 데이터 확인/분석용 금속판(20)을 부착하여, 제품출하후 필드에서의 에러 발생시 상기의 정보를 판독하여 생산시에서의 데이터(FAB, EDS, F/T공정에서의 특성치 기준값)가 어떠하였는지를 쉽게 찾아 분석/조치 가능하게 한 것이다.

Description

공정 데이터 확인/분석이 용이한 반도체 패키지
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도 및 제4도는 본 발명 공정 데이터 확인/분석이 용이한 반도체 패키지의 구조를 보인 도면으로서,
제3도는 본 발명 반도체 패키지의 저면 사시도이고,
제4도는 제3도의 A-A′선 단면도이다.
제5도는 본 발명 반도체 패키지의 공정 데이터 확인/분석 설명도.

Claims (1)

  1. 소자(11)가 내장된 패키지몸체(12)의 양외측으로 상기 소자와 전기적으로 연결된 다수개의 리드(13)가 외향돌출형성된 반도체 패키지에 있어서, 상기 패키지몸체(12)의 하면 일측에 내부 소자의 런넘버(Run #), 웨이퍼넘버(Wafer #), 웨이퍼 내에서의 소자위치좌표(X, Y) 및 전기적 특성 검사에 대한 데이터등과 같은 소자정보가 바코드 형태로 표기된 공정 데이터 확인/분석용 금속판(20)을 부착하여, 출하후 필드에서의 에러 발생 원인을 쉽게 찾아 명확하게 분석/조치할 수 있도록 한 공정 데이터 확인/분석이 용이한 반도체 패키지.
    *참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920022593A 1992-11-27 1992-11-27 공정 데이타 확인/분석이 용이한 반도체 패키지 KR950010865B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019920022593A KR950010865B1 (ko) 1992-11-27 1992-11-27 공정 데이타 확인/분석이 용이한 반도체 패키지
DE19934340223 DE4340223A1 (de) 1992-11-27 1993-11-25 Halbleitergehäuse mit für den Halbleiterchip eigentümlichen Daten
JP29656793A JPH06216265A (ja) 1992-11-27 1993-11-26 チップ固有の判別データを有した半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920022593A KR950010865B1 (ko) 1992-11-27 1992-11-27 공정 데이타 확인/분석이 용이한 반도체 패키지

Publications (2)

Publication Number Publication Date
KR940012593A true KR940012593A (ko) 1994-06-23
KR950010865B1 KR950010865B1 (ko) 1995-09-25

Family

ID=19344103

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Application Number Title Priority Date Filing Date
KR1019920022593A KR950010865B1 (ko) 1992-11-27 1992-11-27 공정 데이타 확인/분석이 용이한 반도체 패키지

Country Status (3)

Country Link
JP (1) JPH06216265A (ko)
KR (1) KR950010865B1 (ko)
DE (1) DE4340223A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917239A (en) * 1995-11-30 1999-06-29 Intel Corporation Recessed or raised characters on a ceramic lid
US6143584A (en) * 1997-07-25 2000-11-07 Denso Corporation Method for fabrication of a semiconductor sensor
WO2001063670A2 (en) * 2000-02-28 2001-08-30 Ericsson Inc. Integrated circuit package with device specific data storage
DE10259049A1 (de) * 2002-12-17 2004-07-15 Infineon Technologies Ag Integriertes Halbleitermodul
JP2006337189A (ja) * 2005-06-02 2006-12-14 Fujifilm Holdings Corp 半導体装置の製造方法
KR101575831B1 (ko) 2010-10-04 2015-12-08 샌디스크 세미컨덕터 (상하이) 컴퍼니, 리미티드 개별 소자의 역방향 트레이서빌리티 및 반도체 디바이스의 순방향 트레이서빌리티
KR102473662B1 (ko) 2017-10-18 2022-12-02 삼성전자주식회사 반도체 소자의 제조 방법

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Publication number Publication date
KR950010865B1 (ko) 1995-09-25
DE4340223A1 (de) 1994-06-01
JPH06216265A (ja) 1994-08-05

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