WO2001063670A2 - Integrated circuit package with device specific data storage - Google Patents

Integrated circuit package with device specific data storage Download PDF

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Publication number
WO2001063670A2
WO2001063670A2 PCT/US2001/040198 US0140198W WO0163670A2 WO 2001063670 A2 WO2001063670 A2 WO 2001063670A2 US 0140198 W US0140198 W US 0140198W WO 0163670 A2 WO0163670 A2 WO 0163670A2
Authority
WO
WIPO (PCT)
Prior art keywords
data
integrated circuit
data storage
memory element
storage system
Prior art date
Application number
PCT/US2001/040198
Other languages
French (fr)
Other versions
WO2001063670A3 (en
Inventor
Henrik Hoyer
Larry Leighton
Thomas Moller
Gary Lopes
Original Assignee
Ericsson Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Inc. filed Critical Ericsson Inc.
Priority to AU2001272081A priority Critical patent/AU2001272081A1/en
Publication of WO2001063670A2 publication Critical patent/WO2001063670A2/en
Publication of WO2001063670A3 publication Critical patent/WO2001063670A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Definitions

  • the present invention pertains generally to the field of radio frequency (RF) power transistor devices and, more specifically, to systems and methods for storing device-specific data in an RF power transistor package and for retrieving that information.
  • RF radio frequency
  • Integrated circuits are widely used in many applications and have various characteristics depending on their intended use.
  • the electrical characteristics of IC's may also vary for the same type of device, e.g., due to manufacturing variables IC's include an arrangement of electrical components often protected by an electrically insulated lid. Typically, the lid serves this protective function while also allowing for heat dissipation from the circuit
  • the lid of an integrated circuit may have a minimum amount of device data printed on its surface
  • Examples of such information may include a manufacturer's serial number or a part number Rarely is any more information included on the surface of the integrated circuit because of their small physical size and the need for the information to be printed large enough for a human to easily read it It is thus desirable to provide an integrated circuit that has the ability to store a significant amount of device-specific data, while enabling a user to easily access and read the information
  • Examples of such device-specific data may include the manufacturing history or testing parameters of the device, quality control data, calibration information, instructions on tuning, mounting, or otherwise using the device, and other data that a manufacturer may want to provide to a user SUMMARY OF THE INVENTION
  • a data storage system for integrated circuit packages comprising an integrated circuit package, the package having a semiconductor element and a lid covering the semiconductor element, wherein the lid includes a data storage component contained on one or more exterior surfaces of the integrated circuit package
  • the data storage system may further include data retrieval means
  • the data storage component comprises a bar code In another preferred embodiment, the data storage component comprises a digitally encoded etching In still another preferred embodiment, the data storage component comprises an electronic memory element
  • a data storage system for integrated circuit packages comprising an integrated circuit package, the package having a semiconductor element and a lid covering the semiconductor element, the semiconductor element including a memory element capable of storing data specific to the integrated circuit package, circuitry for retrieving the data from the memory element, and an electrical lead for electrically connecting a measuring device to the circuitry
  • the data storage system may further comprise updating circuitry electrically coupled to the memory element, wherein the updating circuitry manipulates the data stored in the memory element based on changes made to the integrated circuit
  • a method for storing and retrieving device specific data includes writing device-specific data to a memory element coupled to an integrated circuit, providing circuitry to read the device-specific data from the memory element, and reading the data with an electrical measuring device connected to the electrical lead
  • the method also includes decoding the data and displaying the data, as well as updating the data stored in the memory element based on changes made to the integrated circuit
  • FIG 1 is a first embodiment of an integrated circuit package constructed in accordance with the present invention
  • FIG 2 is a second embodiment of an integrated circuit package constructed in accordance with the present invention.
  • FIG 3 is a third embodiment of an integrated circuit package constructed in accordance with the present invention.
  • an integrated circuit (IC) package 10 includes an integrated circuit 12 mounted on a substrate 14
  • the IC package is provided with a lid 20
  • Device-specific data is encoded in a bar code 22 on the lid 20 Since the lid 20 is usually the most accessible part of the IC, this is a preferable place to locate this information
  • the bar code may, however, be printed on any other accessible part of the IC package
  • the data can then be read by any known bar code system
  • bar code system Such systems include hand-held scanners connected to a computer for processing and displaying the data
  • Bar code technology is widely known in the field and various means of reading the bar code are contemplated by a device constructed in accordance with the present invention.
  • Fig. 2 shows a second embodiment of the invention where the device-specific data 24 is encoded in a digital format and etched onto the lid 20.
  • This data 24 is capable of being read by an optical device and decoded by a computer.
  • the technology for this is generally known in the art of CD ROM devices.
  • Fig. 3 shows a third embodiment of the invention where the IC package 10 contains a memory element 26 capable of electronically storing the device-specific data.
  • the memory element 26 is a static memory that does not require a constant power source to save the stored memory.
  • electrical leads 28 and 30 for accessing the data stored in the memory element 26.
  • the leads 28 and 30 may be incorporated into the pins of the IC that are connected to a standard circuit board, or they may have a separate port (e.g., in the lid) that may be directly accessed by an electrical measuring device.
  • Several methods of data transfer between an external device and the memory element 26 are possible, and well known in the electrical arts.
  • One embodiment of the invention uses the leads DATA IN/OUT,READY, and IN/OUT.
  • the IC contains input/output circuitry that is electrically coupled to the memory element and the leads.
  • a procedure for storing data into the memory element would involve setting the IN/OUT lead to "IN” (e.g., "on”).
  • the READY lead is set “on” and the data is then read from the DATA IN/OUT lead to the memory element by the input/output circuitry. This process is repeated to store the remaining bits of information to the memory element.
  • a procedure for retrieving data from the memory element would involve setting the IN/OUT lead to "OUT” (e.g., "off).
  • the READY lead is set “on” and the data is then read from the memory to the DATA IN/OUT lead by the input/output circuitry. This process is repeated to read the remaining contents of the memory element.
  • Another aspect of this embodiment involves updating the data in the memory element in response to certain circuit conditions or events
  • the updating circuitry is configured to measure certain electrical conditions during the operation of the IC (e g , the highest current passing through a certain pin of the IC), and, upon the occurrence of a certain event (e g , a current is measured on that pin that is higher than the value already stored in the memory element), the updating circuitry writes new data to the memory element

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

A data storage system for integrated circuit packages includes an integrated circuit package, the package having a semiconductor element and a lid covering the semiconductor element, wherein the lid includes a data storage component contained on one or more exterior surfaces of the integrated circuit package. Data retrieval means may also be provided. By way of examples, the data storage component may be a bar code, a digitally encoded etching, or an electronic memory element.

Description

I TEGRATED CIRCUIT PACKAGE WITH DEVICE SPECIFIC DATA STORAGE
BACKGROUND OF THE INVENTION
Field of the Invention
The present invention pertains generally to the field of radio frequency (RF) power transistor devices and, more specifically, to systems and methods for storing device-specific data in an RF power transistor package and for retrieving that information.
Background
Integrated circuits (IC) are widely used in many applications and have various characteristics depending on their intended use. The electrical characteristics of IC's may also vary for the same type of device, e.g., due to manufacturing variables IC's include an arrangement of electrical components often protected by an electrically insulated lid. Typically, the lid serves this protective function while also allowing for heat dissipation from the circuit
In known devices, the lid of an integrated circuit may have a minimum amount of device data printed on its surface Examples of such information may include a manufacturer's serial number or a part number Rarely is any more information included on the surface of the integrated circuit because of their small physical size and the need for the information to be printed large enough for a human to easily read it It is thus desirable to provide an integrated circuit that has the ability to store a significant amount of device-specific data, while enabling a user to easily access and read the information Examples of such device-specific data may include the manufacturing history or testing parameters of the device, quality control data, calibration information, instructions on tuning, mounting, or otherwise using the device, and other data that a manufacturer may want to provide to a user SUMMARY OF THE INVENTION
In accordance with a first aspect of the invention, a data storage system for integrated circuit packages is provided, comprising an integrated circuit package, the package having a semiconductor element and a lid covering the semiconductor element, wherein the lid includes a data storage component contained on one or more exterior surfaces of the integrated circuit package In preferred embodiments, the data storage system may further include data retrieval means
In one preferred embodiment, the data storage component comprises a bar code In another preferred embodiment, the data storage component comprises a digitally encoded etching In still another preferred embodiment, the data storage component comprises an electronic memory element
In accordance with another aspect of the invention, a data storage system for integrated circuit packages is provided, comprising an integrated circuit package, the package having a semiconductor element and a lid covering the semiconductor element, the semiconductor element including a memory element capable of storing data specific to the integrated circuit package, circuitry for retrieving the data from the memory element, and an electrical lead for electrically connecting a measuring device to the circuitry In preferred embodiments, the data storage system may further comprise updating circuitry electrically coupled to the memory element, wherein the updating circuitry manipulates the data stored in the memory element based on changes made to the integrated circuit
In accordance with still another aspect of the invention, a method for storing and retrieving device specific data is provided In a preferred implementation, the method includes writing device-specific data to a memory element coupled to an integrated circuit, providing circuitry to read the device-specific data from the memory element, and reading the data with an electrical measuring device connected to the electrical lead In further preferred implementations, the method also includes decoding the data and displaying the data, as well as updating the data stored in the memory element based on changes made to the integrated circuit
As will be apparent to those skilled in the art, other and further aspects of the present invention will appear hereinafter
BRIEF DESCRIPTION OF THE DRAWINGS
Preferred embodiments of the present invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings, in which like reference numerals refer to like components, and in which
FIG 1 is a first embodiment of an integrated circuit package constructed in accordance with the present invention
FIG 2 is a second embodiment of an integrated circuit package constructed in accordance with the present invention, and
FIG 3 is a third embodiment of an integrated circuit package constructed in accordance with the present invention
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring to FIG 1 , an integrated circuit (IC) package 10 includes an integrated circuit 12 mounted on a substrate 14 The IC package is provided with a lid 20 Device-specific data is encoded in a bar code 22 on the lid 20 Since the lid 20 is usually the most accessible part of the IC, this is a preferable place to locate this information The bar code may, however, be printed on any other accessible part of the IC package
After the bar code is printed on the lid (e g , at manufacturing time), the data can then be read by any known bar code system Such systems include hand-held scanners connected to a computer for processing and displaying the data Bar code technology is widely known in the field and various means of reading the bar code are contemplated by a device constructed in accordance with the present invention.
Fig. 2 shows a second embodiment of the invention where the device-specific data 24 is encoded in a digital format and etched onto the lid 20. This data 24 is capable of being read by an optical device and decoded by a computer. The technology for this is generally known in the art of CD ROM devices.
Fig. 3 shows a third embodiment of the invention where the IC package 10 contains a memory element 26 capable of electronically storing the device-specific data. Preferably, the memory element 26 is a static memory that does not require a constant power source to save the stored memory. Also provided are electrical leads 28 and 30 for accessing the data stored in the memory element 26. The leads 28 and 30 may be incorporated into the pins of the IC that are connected to a standard circuit board, or they may have a separate port (e.g., in the lid) that may be directly accessed by an electrical measuring device. Several methods of data transfer between an external device and the memory element 26 are possible, and well known in the electrical arts. One embodiment of the invention uses the leads DATA IN/OUT,READY, and IN/OUT. The IC contains input/output circuitry that is electrically coupled to the memory element and the leads. A procedure for storing data into the memory element would involve setting the IN/OUT lead to "IN" (e.g., "on"). The READY lead is set "on" and the data is then read from the DATA IN/OUT lead to the memory element by the input/output circuitry. This process is repeated to store the remaining bits of information to the memory element. A procedure for retrieving data from the memory element would involve setting the IN/OUT lead to "OUT" (e.g., "off). The READY lead is set "on" and the data is then read from the memory to the DATA IN/OUT lead by the input/output circuitry. This process is repeated to read the remaining contents of the memory element. An improvement of this system would involve providing several leads for data transfer (DATA IN/OUT), allowing for faster reading and writing of the memory. Another aspect of this embodiment involves updating the data in the memory element in response to certain circuit conditions or events The updating circuitry is configured to measure certain electrical conditions during the operation of the IC (e g , the highest current passing through a certain pin of the IC), and, upon the occurrence of a certain event (e g , a current is measured on that pin that is higher than the value already stored in the memory element), the updating circuitry writes new data to the memory element
Although the invention has been described and illustrated in the above description and drawings, it is understood that this description is by example only and that numerous changes and modifications can be made by those skilled in the art without departing from the true spirit and scope of the invention
The invention, therefore, is not to be restricted, except by the following claims and their equivalents

Claims

WHAT IS CLAIMED IS
1 A data storage system for integrated circuit packages, comprising an integrated circuit package, the package having a semiconductor element and a lid covering the semiconductor element, wherein the lid includes a data storage component contained on one or more exterior surfaces of the integrated circuit package
2 The data storage system of claim 1, further comprising data retrieval means
3 The data storage system of claim 1, wherein the data storage component comprises a bar code
4 The data storage system of claim 1 , wherein the data storage component comprises a digitally encoded etching
5 The data storage system of claim 1 , wherein the data storage component comprises an electronic memory element
6 A data storage system for integrated circuit packages, comprising an integrated circuit package, the package having a semiconductor element and a lid covering the semiconductor element, the semiconductor element including a memory element capable of storing data specific to the integrated circuit package, circuitry for retrieving the data from the memory element, and an electrical lead for electrically connecting a measuring device to the circuitry
7 The data storage system of claim 6, further comprising updating circuitry electrically coupled to the memory element, wherein the updating circuitry manipulates the data stored in the memory element based on changes made to the integrated circuit 8 A method for storing and retrieving device-specific data, comprising writing device-specific data to a memory element coupled to an integrated circuit, providing circuitry to read the device-specific data from the memory element, and reading the data with an electrical measuring device connected to the electrical lead
9 The method of claim 8, further comprising decoding the data and displaying the data
10 The method of claim 8, further comprising updating the data stored in the memory element based on changes made to the integrated circuit
PCT/US2001/040198 2000-02-28 2001-02-28 Integrated circuit package with device specific data storage WO2001063670A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001272081A AU2001272081A1 (en) 2000-02-28 2001-02-28 Integrated circuit package with device specific data storage

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51444700A 2000-02-28 2000-02-28
US09/514,447 2000-02-28

Publications (2)

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WO2001063670A2 true WO2001063670A2 (en) 2001-08-30
WO2001063670A3 WO2001063670A3 (en) 2002-01-31

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004055894A1 (en) * 2002-12-17 2004-07-01 Infineon Technologies Ag Integrated semiconductor module comprising an identification region
US8014890B2 (en) 2003-09-25 2011-09-06 Ericsson Ab Method for manufacturing a high-frequency assembly
EP4166497A1 (en) * 2021-10-15 2023-04-19 Schott Ag Enclosure with information pattern

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DE4340223A1 (en) * 1992-11-27 1994-06-01 Gold Star Electronics Semiconductor device package with chip-specific data label - enables chip to be distinguished from others of same origin by reference to metallic plate attached after encapsulation
US5984190A (en) * 1997-05-15 1999-11-16 Micron Technology, Inc. Method and apparatus for identifying integrated circuits

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004055894A1 (en) * 2002-12-17 2004-07-01 Infineon Technologies Ag Integrated semiconductor module comprising an identification region
US8014890B2 (en) 2003-09-25 2011-09-06 Ericsson Ab Method for manufacturing a high-frequency assembly
EP4166497A1 (en) * 2021-10-15 2023-04-19 Schott Ag Enclosure with information pattern
WO2023061706A1 (en) * 2021-10-15 2023-04-20 Schott Ag Enclosure

Also Published As

Publication number Publication date
AU2001272081A1 (en) 2001-09-03
WO2001063670A3 (en) 2002-01-31

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