WO2001063670A3 - Integrated circuit package with device specific data storage - Google Patents
Integrated circuit package with device specific data storage Download PDFInfo
- Publication number
- WO2001063670A3 WO2001063670A3 PCT/US2001/040198 US0140198W WO0163670A3 WO 2001063670 A3 WO2001063670 A3 WO 2001063670A3 US 0140198 W US0140198 W US 0140198W WO 0163670 A3 WO0163670 A3 WO 0163670A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- integrated circuit
- data storage
- circuit package
- specific data
- device specific
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2001272081A AU2001272081A1 (en) | 2000-02-28 | 2001-02-28 | Integrated circuit package with device specific data storage |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US51444700A | 2000-02-28 | 2000-02-28 | |
US09/514,447 | 2000-02-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001063670A2 WO2001063670A2 (en) | 2001-08-30 |
WO2001063670A3 true WO2001063670A3 (en) | 2002-01-31 |
Family
ID=24047175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/040198 WO2001063670A2 (en) | 2000-02-28 | 2001-02-28 | Integrated circuit package with device specific data storage |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2001272081A1 (en) |
WO (1) | WO2001063670A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10259049A1 (en) * | 2002-12-17 | 2004-07-15 | Infineon Technologies Ag | Integrated semiconductor module |
DE10344409A1 (en) | 2003-09-25 | 2005-04-28 | Marconi Comm Gmbh | Method for manufacturing a high-frequency module |
EP4166497A1 (en) * | 2021-10-15 | 2023-04-19 | Schott Ag | Enclosure with information pattern |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59150464A (en) * | 1983-02-15 | 1984-08-28 | Toshiba Corp | Semiconductor device |
JPS61131549A (en) * | 1984-11-30 | 1986-06-19 | Sharp Corp | Semiconductor circuit package |
JPH0429358A (en) * | 1990-05-25 | 1992-01-31 | Fuji Photo Film Co Ltd | Semiconductor device |
DE4340223A1 (en) * | 1992-11-27 | 1994-06-01 | Gold Star Electronics | Semiconductor device package with chip-specific data label - enables chip to be distinguished from others of same origin by reference to metallic plate attached after encapsulation |
US5642307A (en) * | 1992-07-09 | 1997-06-24 | Advanced Micro Devices, Inc. | Die identifier and die indentification method |
JPH1126650A (en) * | 1997-06-30 | 1999-01-29 | Mitsumi Electric Co Ltd | Resin sealed package |
US5984190A (en) * | 1997-05-15 | 1999-11-16 | Micron Technology, Inc. | Method and apparatus for identifying integrated circuits |
-
2001
- 2001-02-28 WO PCT/US2001/040198 patent/WO2001063670A2/en active Application Filing
- 2001-02-28 AU AU2001272081A patent/AU2001272081A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59150464A (en) * | 1983-02-15 | 1984-08-28 | Toshiba Corp | Semiconductor device |
JPS61131549A (en) * | 1984-11-30 | 1986-06-19 | Sharp Corp | Semiconductor circuit package |
JPH0429358A (en) * | 1990-05-25 | 1992-01-31 | Fuji Photo Film Co Ltd | Semiconductor device |
US5642307A (en) * | 1992-07-09 | 1997-06-24 | Advanced Micro Devices, Inc. | Die identifier and die indentification method |
DE4340223A1 (en) * | 1992-11-27 | 1994-06-01 | Gold Star Electronics | Semiconductor device package with chip-specific data label - enables chip to be distinguished from others of same origin by reference to metallic plate attached after encapsulation |
US5984190A (en) * | 1997-05-15 | 1999-11-16 | Micron Technology, Inc. | Method and apparatus for identifying integrated circuits |
JPH1126650A (en) * | 1997-06-30 | 1999-01-29 | Mitsumi Electric Co Ltd | Resin sealed package |
Non-Patent Citations (4)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 008, no. 285 (E - 287) 26 December 1984 (1984-12-26) * |
PATENT ABSTRACTS OF JAPAN vol. 010, no. 319 (E - 450) 30 October 1986 (1986-10-30) * |
PATENT ABSTRACTS OF JAPAN vol. 016, no. 196 (E - 1200) 12 May 1992 (1992-05-12) * |
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 04 30 April 1999 (1999-04-30) * |
Also Published As
Publication number | Publication date |
---|---|
WO2001063670A2 (en) | 2001-08-30 |
AU2001272081A1 (en) | 2001-09-03 |
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