KR940002030A - 성형방법 - Google Patents
성형방법 Download PDFInfo
- Publication number
- KR940002030A KR940002030A KR1019930012900A KR930012900A KR940002030A KR 940002030 A KR940002030 A KR 940002030A KR 1019930012900 A KR1019930012900 A KR 1019930012900A KR 930012900 A KR930012900 A KR 930012900A KR 940002030 A KR940002030 A KR 940002030A
- Authority
- KR
- South Korea
- Prior art keywords
- gasket
- cavity
- mold
- flame
- filled
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
- B29C45/14418—Sealing means between mould and article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2608—Mould seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
- B29C2045/14991—Submerged burrs, e.g. using protruding mould parts forming a cavity in which the burr on the insert is formed for preventing surface defects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S264/00—Plastic and nonmetallic article shaping or treating: processes
- Y10S264/50—Use of fluid pressure in molding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
- Y10S425/019—Flexible fluid pressure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
- Y10S425/047—Seal ring
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
- Y10S425/228—Injection plunger or ram: transfer molding type
Abstract
버어가 발생하는 것을 완전히 방지한다.
플레임(16)을 금형으로 장전한 후 이 플레임(16)에 있어서 캐버티(14)의 개구 가장자리 근처의 부위에 가스켓(20)을 가압액(25)에 의해 압접시키고 이 가스켓(20)을 가압되므로서 용이하게 소성 변형이 가능한 금속에 의해 형성하며 그후 캐버티(14)에 성형재를 충전하고 플레임(16)과 아래틀(11) 사이에 생기는 틈 사이에 가스켓(20)이 소성 변형하여 끼워지고, 이 틈사이가 가스켓(20)에 의해 채워지며 가스켓(20)이 실질적으로 캐버티(14)의 측벽의 일부를 구성하고 버어가 생기지 않게된다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따르는 성형 방법을 실시하는 때에 사용하는 몰드 금형의 단면도,
제2도는 가스켓을 상하로부터 피성형물에 밀어 붙이는 다른 실시예를 도시하는 금형의 단면도,
제3도는 가로형의 사출 성형기에 본 발명을 적용한 다른 실시예를 도시하는 금형의 단면도,
제4도는 종래의 성형방법에 사용하는 금형의 단면도.
Claims (2)
- 피성형물을 1쌍의 금형 본체에 의해 끼워지고 금형으로 장전하며 이어서 이 피성형물에 있어서 캐버티의 개구 가장자리 근처의 부위에 금형의 미리 장전되고 또한 가압 되므로서 용이하게 소성 변형이 가능한 금속에 의해 형성된 가스켓을 액압에 의해 압접시켜, 그후, 캐버티에 성형재를 충전 하는 것을 특징으로 하는 성형방법.
- 제1항에 있어서, 가스켓을 가압하는 액체에 열가소성 수지의 분말을 혼합시키는 것을 특징으로 하는 성형방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP93-033308 | 1993-02-23 | ||
JP3330893 | 1993-02-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940002030A true KR940002030A (ko) | 1994-02-16 |
KR970002295B1 KR970002295B1 (ko) | 1997-02-27 |
Family
ID=12382934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930012900A KR970002295B1 (ko) | 1993-02-23 | 1993-07-09 | 성형방법 |
Country Status (4)
Country | Link |
---|---|
US (2) | US5395226A (ko) |
KR (1) | KR970002295B1 (ko) |
CH (1) | CH687685A5 (ko) |
DE (1) | DE4406478C2 (ko) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5942178A (en) * | 1996-12-17 | 1999-08-24 | Texas Instruments Incorporated | Integrated circuit chip mold seal |
KR970002295B1 (ko) * | 1993-02-23 | 1997-02-27 | 미쯔비시 덴끼 가부시끼가이샤 | 성형방법 |
JP3442877B2 (ja) * | 1994-02-21 | 2003-09-02 | 富士通株式会社 | 樹脂成形品及びその製造方法 |
US5597523A (en) * | 1994-02-22 | 1997-01-28 | Mitsubishi Denki Kabushiki Kaisha | Molding apparatus and method in which a mold cavity gasket is deformed by separately applied pressure |
US5945130A (en) | 1994-11-15 | 1999-08-31 | Vlt Corporation | Apparatus for circuit encapsulation |
US5728600A (en) * | 1994-11-15 | 1998-03-17 | Vlt Corporation | Circuit encapsulation process |
US5609889A (en) * | 1995-05-26 | 1997-03-11 | Hestia Technologies, Inc. | Apparatus for encapsulating electronic packages |
DE19710604A1 (de) * | 1997-03-14 | 1998-09-17 | Itt Mfg Enterprises Inc | Vorrichtung sowie Verfahren zur Herstellung eines Gußwerkstückes mit eingegossenem Einlegeteil |
US5881945A (en) * | 1997-04-30 | 1999-03-16 | International Business Machines Corporation | Multi-layer solder seal band for semiconductor substrates and process |
US5881944A (en) * | 1997-04-30 | 1999-03-16 | International Business Machines Corporation | Multi-layer solder seal band for semiconductor substrates |
US5982038A (en) * | 1997-05-01 | 1999-11-09 | International Business Machines Corporation | Cast metal seal for semiconductor substrates |
US5821161A (en) * | 1997-05-01 | 1998-10-13 | International Business Machines Corporation | Cast metal seal for semiconductor substrates and process thereof |
DE19824463A1 (de) * | 1998-05-30 | 1999-12-02 | Stefan Pfaff Werkzeug Und Form | Spritzgußwerkzeug |
US6306331B1 (en) * | 1999-03-24 | 2001-10-23 | International Business Machines Corporation | Ultra mold for encapsulating very thin packages |
DE19929028A1 (de) * | 1999-06-25 | 2000-12-28 | Bosch Gmbh Robert | Verfahren zur Herstellung eines Drucksensors |
DE10010461A1 (de) * | 2000-03-03 | 2001-09-13 | Infineon Technologies Ag | Vorrichtung zum Verpacken elektronischer Bauteile mittels Spritzgußtechnik |
FI20000501A0 (fi) * | 2000-03-03 | 2000-03-03 | Valmet Corp | Menetelmä ja sovitelma tampuurirullien käsittelemiseksi |
KR100415281B1 (ko) * | 2001-06-29 | 2004-01-16 | 삼성전자주식회사 | 양면 실장형 회로 기판 및 이를 포함하는 멀티 칩 패키지 |
US20030176022A1 (en) * | 2002-03-13 | 2003-09-18 | Kurt Waldner | Tool and method for welding to IC frames |
US6817854B2 (en) * | 2002-05-20 | 2004-11-16 | Stmicroelectronics, Inc. | Mold with compensating base |
US6824373B2 (en) * | 2002-11-08 | 2004-11-30 | Tachi-S Co., Ltd. | Foaming die for forming an armrest |
JP4094515B2 (ja) * | 2003-09-26 | 2008-06-04 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
JP4855026B2 (ja) * | 2005-09-27 | 2012-01-18 | Towa株式会社 | 電子部品の樹脂封止成形方法及び装置 |
JP4084844B2 (ja) * | 2005-09-27 | 2008-04-30 | Towa株式会社 | 電子部品の樹脂封止成形方法及び装置 |
JP2007095804A (ja) * | 2005-09-27 | 2007-04-12 | Towa Corp | 電子部品の樹脂封止成形方法及び装置 |
JP4961972B2 (ja) * | 2006-03-09 | 2012-06-27 | Jnc株式会社 | 絶縁層形成用組成物および絶縁膜 |
US7927086B2 (en) * | 2007-03-19 | 2011-04-19 | Nissan Motor Co., Ltd. | Manufacturing apparatus for use with a membrane electrode assembly and method for manufacturing same |
BR112012029356B1 (pt) * | 2010-05-25 | 2020-11-10 | Saint-Gobain Performance Plastics Corporation | molde para moldagem por injeção; método de sobremoldagem de um componente |
EP3928962B1 (en) | 2010-08-13 | 2023-05-24 | Greene, Tweed Technologies, Inc. | Apparatus for making thermoplastic fiber composites having high volume fiber loading |
US8900933B2 (en) * | 2010-12-27 | 2014-12-02 | Nissan Motor Co., Ltd. | Semiconductor module, molding apparatus, and molding method |
CN109037169B (zh) * | 2018-07-06 | 2020-10-23 | 昆山丘钛微电子科技有限公司 | 封装模具、封装结构、封装方法和摄像头模组 |
CN111570758A (zh) * | 2020-05-22 | 2020-08-25 | 宁波博威模具技术有限公司 | 一种薄壁型屏蔽腔内板的加工工艺 |
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US4470786A (en) * | 1981-07-28 | 1984-09-11 | Omron Tateisi Electronics Co. | Molding apparatus with retractable preform support pins |
JPS6097815A (ja) * | 1983-11-02 | 1985-05-31 | Hitachi Ltd | 成形方法および成形機 |
FR2572987B1 (fr) * | 1984-09-21 | 1987-01-02 | Pont A Mousson | Procede et dispositif de surmoulage d'un entourage de dimensions precises sur le pourtour d'une piece plane ou galbee a tolerances dimensionnelles |
JPS61234536A (ja) * | 1985-04-11 | 1986-10-18 | Nec Corp | 樹脂封止金型 |
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EP0354481B1 (en) * | 1988-08-09 | 1995-11-29 | Asahi Glass Company Ltd. | Method of preparing window glass with a gasket and a shaping mold for preparing such window glass |
US5336272A (en) * | 1988-10-13 | 1994-08-09 | Mitsubishi Denki Kabushiki Kaisha | Method for molding a semiconductor package on a continuous leadframe |
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JP2895841B2 (ja) * | 1988-12-27 | 1999-05-24 | 住友化学工業株式会社 | 表皮材を有する合成樹脂積層体の製造方法及びこの方法で使用する合成樹脂成形用金型 |
JPH03234605A (ja) * | 1990-02-13 | 1991-10-18 | Toshiba Corp | レジン成形装置 |
US5268183A (en) * | 1990-05-04 | 1993-12-07 | Vidrio Plano De Mexico, S.A. | Mold apparatus having an outwardly angled seal for encapsulating a glass sheet |
EP0557353B1 (de) * | 1990-11-14 | 1994-07-27 | Friedhelm Stecher | Herstellungsverfahren für eine flachdichtung |
US5118271A (en) * | 1991-02-22 | 1992-06-02 | Motorola, Inc. | Apparatus for encapsulating a semiconductor device |
IT1258845B (it) * | 1992-01-31 | 1996-02-29 | Sviluppo Settori Impiego Srl | Attrezzatura e procedimento per lo stampaggio di materiali polimerici allo stato liquido |
KR970002295B1 (ko) * | 1993-02-23 | 1997-02-27 | 미쯔비시 덴끼 가부시끼가이샤 | 성형방법 |
-
1993
- 1993-07-09 KR KR1019930012900A patent/KR970002295B1/ko not_active IP Right Cessation
- 1993-10-01 US US08/130,444 patent/US5395226A/en not_active Expired - Lifetime
- 1993-11-15 CH CH03413/93A patent/CH687685A5/de not_active IP Right Cessation
-
1994
- 1994-02-22 DE DE4406478A patent/DE4406478C2/de not_active Expired - Fee Related
-
1996
- 1996-03-04 US US08/609,786 patent/US5798070A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CH687685A5 (de) | 1997-01-31 |
US5798070A (en) | 1998-08-25 |
DE4406478C2 (de) | 1996-07-11 |
DE4406478A1 (de) | 1994-09-22 |
KR970002295B1 (ko) | 1997-02-27 |
US5395226A (en) | 1995-03-07 |
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