KR940000910B1 - 반도체 칩의 얼라인먼트 방법 및 레이저 리페이어용 타겟이 형성된 반도체 칩 - Google Patents

반도체 칩의 얼라인먼트 방법 및 레이저 리페이어용 타겟이 형성된 반도체 칩 Download PDF

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Publication number
KR940000910B1
KR940000910B1 KR1019910005891A KR910005891A KR940000910B1 KR 940000910 B1 KR940000910 B1 KR 940000910B1 KR 1019910005891 A KR1019910005891 A KR 1019910005891A KR 910005891 A KR910005891 A KR 910005891A KR 940000910 B1 KR940000910 B1 KR 940000910B1
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KR
South Korea
Prior art keywords
alignment
target
semiconductor chip
scan
basic
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Expired - Fee Related
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KR1019910005891A
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English (en)
Korean (ko)
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KR920020700A (ko
Inventor
한병율
Original Assignee
금성일렉트론 주식회사
문정환
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Filing date
Publication date
Application filed by 금성일렉트론 주식회사, 문정환 filed Critical 금성일렉트론 주식회사
Priority to KR1019910005891A priority Critical patent/KR940000910B1/ko
Priority to US07/858,723 priority patent/US5414519A/en
Priority to DE4210774A priority patent/DE4210774B4/de
Priority to TW081102553A priority patent/TW232744B/zh
Priority to JP8879292A priority patent/JP2802561B2/ja
Publication of KR920020700A publication Critical patent/KR920020700A/ko
Application granted granted Critical
Publication of KR940000910B1 publication Critical patent/KR940000910B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Lasers (AREA)
  • Lasers (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Laser Beam Processing (AREA)
KR1019910005891A 1991-04-12 1991-04-12 반도체 칩의 얼라인먼트 방법 및 레이저 리페이어용 타겟이 형성된 반도체 칩 Expired - Fee Related KR940000910B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1019910005891A KR940000910B1 (ko) 1991-04-12 1991-04-12 반도체 칩의 얼라인먼트 방법 및 레이저 리페이어용 타겟이 형성된 반도체 칩
US07/858,723 US5414519A (en) 1991-04-12 1992-03-27 Method for aligning a semiconductor chip to be repaired with a repair system and a laser repair target used therefor
DE4210774A DE4210774B4 (de) 1991-04-12 1992-04-01 Verfahren zum Ausrichten eines Halbleiterchips, der mit Hilfe eines Reparatursystems repariert werden soll, sowie Laser-Reparaturtarget zur Verwendung für dieses Verfahren
TW081102553A TW232744B (enExample) 1991-04-12 1992-04-02
JP8879292A JP2802561B2 (ja) 1991-04-12 1992-04-09 半導体チップのアライメント方法およびレーザ修理用ターゲット

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910005891A KR940000910B1 (ko) 1991-04-12 1991-04-12 반도체 칩의 얼라인먼트 방법 및 레이저 리페이어용 타겟이 형성된 반도체 칩

Publications (2)

Publication Number Publication Date
KR920020700A KR920020700A (ko) 1992-11-21
KR940000910B1 true KR940000910B1 (ko) 1994-02-04

Family

ID=19313205

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910005891A Expired - Fee Related KR940000910B1 (ko) 1991-04-12 1991-04-12 반도체 칩의 얼라인먼트 방법 및 레이저 리페이어용 타겟이 형성된 반도체 칩

Country Status (5)

Country Link
US (1) US5414519A (enExample)
JP (1) JP2802561B2 (enExample)
KR (1) KR940000910B1 (enExample)
DE (1) DE4210774B4 (enExample)
TW (1) TW232744B (enExample)

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US5545593A (en) * 1993-09-30 1996-08-13 Texas Instruments Incorporated Method of aligning layers in an integrated circuit device
JP3446287B2 (ja) * 1994-03-15 2003-09-16 富士通株式会社 縮小投影露光装置と光軸ずれ補正方法
US5696587A (en) * 1994-12-14 1997-12-09 United Microelectronics Corporation Metal target for laser repair of dies
US5796414A (en) * 1996-03-25 1998-08-18 Hewlett-Packard Company Systems and method for establishing positional accuracy in two dimensions based on a sensor scan in one dimension
KR100256815B1 (ko) * 1996-06-24 2000-06-01 김영환 확대/축소 크기 측정용 마크
JP2866831B2 (ja) * 1996-08-30 1999-03-08 株式会社アドバンテスト レーザ加工装置の位置決め方法
US6938335B2 (en) 1996-12-13 2005-09-06 Matsushita Electric Industrial Co., Ltd. Electronic component mounting method
CN1138463C (zh) * 1996-12-13 2004-02-11 松下电器产业株式会社 电子部件及其安装方法和装置
US6064750A (en) * 1997-01-10 2000-05-16 Hunter Engineering Company Apparatus and method for determining vehicle wheel alignment measurements from three dimensional wheel positions and orientations
TW335527B (en) * 1997-11-08 1998-07-01 United Microelectronics Corp The rework testing method of semiconductor device
US6077756A (en) * 1998-04-24 2000-06-20 Vanguard International Semiconductor Overlay target pattern and algorithm for layer-to-layer overlay metrology for semiconductor processing
USD464354S1 (en) 2000-11-09 2002-10-15 Exabye Corporation Magazine for data cartridges
US6462900B1 (en) 2000-11-09 2002-10-08 Exabyte Corporation Cartridge picker robot with ribbon cable for cartridge library
US6466396B1 (en) 2000-11-09 2002-10-15 Exabyte Corporation Cartridge library
USD456404S1 (en) 2000-11-09 2002-04-30 Exabye Corporation Cartridge library
US6473261B1 (en) 2000-11-09 2002-10-29 Exabyte Corporation Cartridge overinsertion protection for cartridge library
US6486956B2 (en) 2001-03-23 2002-11-26 Micron Technology, Inc. Reducing asymmetrically deposited film induced registration error
US7053495B2 (en) 2001-09-17 2006-05-30 Matsushita Electric Industrial Co., Ltd. Semiconductor integrated circuit device and method for fabricating the same
US6612499B2 (en) 2002-01-24 2003-09-02 Exabyte Corporation Calibration cartridge for automated cartridge library and method of using same
JP2005109145A (ja) 2003-09-30 2005-04-21 Toshiba Corp 半導体装置
USD554084S1 (en) * 2005-10-31 2007-10-30 Kabushiki Kaisha Toshiba Portion of a semiconductor apparatus mounting-position accuracy measurement jig
US20080278847A1 (en) * 2007-05-11 2008-11-13 Barkley John A Method and apparatus for positioning drives in cartridge library
US20080282281A1 (en) * 2007-05-11 2008-11-13 White Christopher M Cartridge engagement apparatus and method for cartridge library
US7777985B2 (en) * 2007-05-11 2010-08-17 Tandberg Data Corporation Transport method and apparatus for cartridge library utilizing cam slot and follower for moving a robot carriage
US7777986B2 (en) * 2007-05-11 2010-08-17 Tandberg Data Corporation Multi-dimensional transport method and drive subsystems in a cartridge library apparatus
US20080282275A1 (en) * 2007-05-11 2008-11-13 Zaczek Thomas E Entry/exit port method and apparatus for cartridge library
US9583401B2 (en) 2014-02-12 2017-02-28 International Business Machines Corporation Nano deposition and ablation for the repair and fabrication of integrated circuits
JP6219227B2 (ja) * 2014-05-12 2017-10-25 東京エレクトロン株式会社 ヒータ給電機構及びステージの温度制御方法
JP2017053999A (ja) * 2015-09-09 2017-03-16 株式会社東芝 半導体装置および検査パターン配置方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3660157A (en) * 1969-08-18 1972-05-02 Computervision Corp Enhanced contrast semiconductor wafer alignment target
JPS55162229A (en) * 1979-06-04 1980-12-17 Chiyou Lsi Gijutsu Kenkyu Kumiai Detection of electron beam exposure position
US4385838A (en) * 1980-01-19 1983-05-31 Nippon Kogaku K. K. Alignment device
JPS57192028A (en) * 1981-05-20 1982-11-26 Matsushita Electric Ind Co Ltd Mask set and positioning method for mask
JPS58108745A (ja) * 1981-12-23 1983-06-28 Canon Inc 転写装置
JPS58116541A (ja) * 1981-12-29 1983-07-11 Canon Inc 整合方法
JPS59200905A (ja) * 1983-04-28 1984-11-14 Mitsubishi Electric Corp 位置検出装置
JPS61258420A (ja) * 1985-05-13 1986-11-15 Canon Inc 位置検出装置
JPS62193124A (ja) * 1986-02-19 1987-08-25 Sanyo Electric Co Ltd パタ−ン位置合わせ方法
DE3770316D1 (de) * 1986-04-18 1991-07-04 Heidelberger Druckmasch Ag Bestimmung des registerfehlers beim mehrfarbendruck.
JPS63204722A (ja) * 1987-02-20 1988-08-24 Nec Corp 半導体集積回路の製造方法
JP2629709B2 (ja) * 1987-05-28 1997-07-16 株式会社ニコン 位置合わせ方法及び装置
JPH01301030A (ja) * 1988-05-26 1989-12-05 Toshiba Corp Ｘｙ方向送り装置
FR2676129A1 (fr) * 1991-04-30 1992-11-06 Cer Ets Procede destine a positionner un objet par rapport a un element a emplacement determine ou vice et versa et machine pour sa mise en óoeuvre.

Also Published As

Publication number Publication date
DE4210774A1 (de) 1992-10-15
JPH05109873A (ja) 1993-04-30
DE4210774B4 (de) 2007-06-28
TW232744B (enExample) 1994-10-21
US5414519A (en) 1995-05-09
KR920020700A (ko) 1992-11-21
JP2802561B2 (ja) 1998-09-24

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