KR930020586A - 반도체장치의 배선구조 및 옴전극 그리고 이들의 형성방법 - Google Patents
반도체장치의 배선구조 및 옴전극 그리고 이들의 형성방법 Download PDFInfo
- Publication number
- KR930020586A KR930020586A KR1019930003079A KR930003079A KR930020586A KR 930020586 A KR930020586 A KR 930020586A KR 1019930003079 A KR1019930003079 A KR 1019930003079A KR 930003079 A KR930003079 A KR 930003079A KR 930020586 A KR930020586 A KR 930020586A
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- tungsten
- gold
- auge
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP92-45751 | 1992-03-03 | ||
JP4575192A JPH05167063A (ja) | 1991-10-15 | 1992-03-03 | オーミック電極とその形成方法及び半導体装置 |
JP5540892 | 1992-03-13 | ||
JP6229992 | 1992-03-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR930020586A true KR930020586A (ko) | 1993-10-20 |
Family
ID=26396300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930003079A Ceased KR930020586A (ko) | 1992-03-03 | 1993-03-03 | 반도체장치의 배선구조 및 옴전극 그리고 이들의 형성방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPH05326518A (enrdf_load_stackoverflow) |
KR (1) | KR930020586A (enrdf_load_stackoverflow) |
TW (1) | TW225038B (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07183377A (ja) * | 1993-12-24 | 1995-07-21 | Nec Corp | 半導体装置 |
JP5314963B2 (ja) | 2008-08-12 | 2013-10-16 | 富士フイルム株式会社 | 積層体、圧電素子、および液体吐出装置 |
JP5371329B2 (ja) * | 2008-08-29 | 2013-12-18 | 富士フイルム株式会社 | 圧電素子、および液体吐出装置 |
-
1993
- 1993-02-02 JP JP5015480A patent/JPH05326518A/ja active Pending
- 1993-03-02 TW TW082101527A patent/TW225038B/zh active
- 1993-03-03 KR KR1019930003079A patent/KR930020586A/ko not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
JPH05326518A (ja) | 1993-12-10 |
TW225038B (enrdf_load_stackoverflow) | 1994-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2856778B2 (ja) | 半導体装置の配線構造 | |
US3290127A (en) | Barrier diode with metal contact and method of making | |
US5422307A (en) | Method of making an ohmic electrode using a TiW layer and an Au layer | |
US4914499A (en) | Semiconductor device having an ohmic electrode on a p-type III-V compound semiconductor | |
EP0305296B1 (en) | Semiconductor layer structure having an aluminum-silicon alloy layer | |
US5310695A (en) | Interconnect structure in semiconductor device and method for making the same | |
US10957591B2 (en) | Process of forming semiconductor device | |
KR930020586A (ko) | 반도체장치의 배선구조 및 옴전극 그리고 이들의 형성방법 | |
US20080230813A1 (en) | Semiconductor device and manufacturing method therefor | |
JP3067135B2 (ja) | 半導体装置の製造方法 | |
US6084258A (en) | Metal-semiconductor junction fet | |
JPS6138850B2 (enrdf_load_stackoverflow) | ||
JPS60153149A (ja) | 多層配線の形成方法 | |
JPS61187369A (ja) | 薄膜トランジスタの製造方法 | |
KR100648740B1 (ko) | 트랜지스터용 게이트 구조체 및 그 제조 방법 | |
JPH05299420A (ja) | 半導体装置 | |
JPH05167063A (ja) | オーミック電極とその形成方法及び半導体装置 | |
JP3123217B2 (ja) | オーミック電極の形成方法 | |
JP2893794B2 (ja) | 半導体装置 | |
JPH10107300A (ja) | 半導体装置 | |
JPS63207164A (ja) | 薄膜抵抗体装置 | |
JPS58134428A (ja) | 半導体装置の製造方法 | |
JP3041550B2 (ja) | 半導体装置 | |
JPH0334545A (ja) | 半導体装置の製造方法 | |
JPH0794481A (ja) | 半導体装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19930303 |
|
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19930303 Comment text: Request for Examination of Application |
|
PG1501 | Laying open of application | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 19960628 Patent event code: PE09021S01D |
|
E601 | Decision to refuse application | ||
PE0601 | Decision on rejection of patent |
Patent event date: 19960930 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 19960628 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |