KR930020586A - 반도체장치의 배선구조 및 옴전극 그리고 이들의 형성방법 - Google Patents
반도체장치의 배선구조 및 옴전극 그리고 이들의 형성방법 Download PDFInfo
- Publication number
- KR930020586A KR930020586A KR1019930003079A KR930003079A KR930020586A KR 930020586 A KR930020586 A KR 930020586A KR 1019930003079 A KR1019930003079 A KR 1019930003079A KR 930003079 A KR930003079 A KR 930003079A KR 930020586 A KR930020586 A KR 930020586A
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- tungsten
- gold
- auge
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP92-45751 | 1992-03-03 | ||
| JP4575192A JPH05167063A (ja) | 1991-10-15 | 1992-03-03 | オーミック電極とその形成方法及び半導体装置 |
| JP5540892 | 1992-03-13 | ||
| JP6229992 | 1992-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR930020586A true KR930020586A (ko) | 1993-10-20 |
Family
ID=26396300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019930003079A Ceased KR930020586A (ko) | 1992-03-03 | 1993-03-03 | 반도체장치의 배선구조 및 옴전극 그리고 이들의 형성방법 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH05326518A (enrdf_load_stackoverflow) |
| KR (1) | KR930020586A (enrdf_load_stackoverflow) |
| TW (1) | TW225038B (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07183377A (ja) * | 1993-12-24 | 1995-07-21 | Nec Corp | 半導体装置 |
| JP5314963B2 (ja) | 2008-08-12 | 2013-10-16 | 富士フイルム株式会社 | 積層体、圧電素子、および液体吐出装置 |
| JP5371329B2 (ja) * | 2008-08-29 | 2013-12-18 | 富士フイルム株式会社 | 圧電素子、および液体吐出装置 |
-
1993
- 1993-02-02 JP JP5015480A patent/JPH05326518A/ja active Pending
- 1993-03-02 TW TW082101527A patent/TW225038B/zh active
- 1993-03-03 KR KR1019930003079A patent/KR930020586A/ko not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05326518A (ja) | 1993-12-10 |
| TW225038B (enrdf_load_stackoverflow) | 1994-06-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |