KR930017971A - 열 경화성 수지 조성물 - Google Patents

열 경화성 수지 조성물 Download PDF

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Publication number
KR930017971A
KR930017971A KR1019930001932A KR930001932A KR930017971A KR 930017971 A KR930017971 A KR 930017971A KR 1019930001932 A KR1019930001932 A KR 1019930001932A KR 930001932 A KR930001932 A KR 930001932A KR 930017971 A KR930017971 A KR 930017971A
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South Korea
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group
molecule
general formula
following general
represented
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KR1019930001932A
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KR100241844B1 (ko
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도시오 시오바라
히사시 시미즈
미노루 다께이
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카나가와 치히로
신에쓰 가가꾸 고교 가부시끼가이샤
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Publication of KR930017971A publication Critical patent/KR930017971A/ko
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Publication of KR100241844B1 publication Critical patent/KR100241844B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

본 발명은 가공성이 좋고, 높은 접착성을 가질 뿐만 아니라, 고온에서의 기계적 강도 및 내열수성이 양호하고, 저팽창성 및 저흡수성이 우수한 경화물을 제공하는 열 경화성 수시 조성물에 관한 것이다.
상기 조성물은 (A)하기 일반식[I]로 나타낸 알릴기가 함유되지 않은 말레이미드기를 갖는 이미드 화합물 및 하기 일반식[I′]로 나타낸 알릴기를 갖는 이미드화합물, (B)1분자 중에 최소한 2개 이상의 에폭시기를 갖는 수지 및 (C)1분자중에 페놀성 수산기를 갖는 수지를 함유하고, 또한 (B) 및 (C)성분이 최소한 한쪽에서 방향족기에 공액하는 이중 결합이 있는 나프탈렌 고리를 갖는 화합물을 함유한다.
또한, 상기 조성물에서는 방향족 중합체와 하기 조성식[Ⅱ]로 나타낸 수소 원자, 아미노기, 에폭시기, 히드록시기, 카르복시기를 함유하는 유기기를 갖는 오르가노폴리실록산을 반응시킴으로써 얻어지는 공중합체를 첨가한다.

Description

열 경화성 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 접착성 시험에 사용하는 성형품의 개략도, 제2도는 접착성 시험에 있어서의 인장 방향을 도시하는 개략도.

Claims (2)

  1. (A)하기 일반식[I]로 나타낸 알릴기가 함유되지 않은 말레이미드기를 갖는 이미드 화합물 및 하기 일반식[I′]로 나타낸 알릴기를 갖는 이미드 화합물, (B)1분자 중에 2개 이상의 에폭시기를 갖는 수지 및 (C)1분자 중에 페놀성 수산기를 갖는 수지를 함유하고, 또한 상기 (B) 및 (C)성분의 최소한 한쪽에 방향족 기에 공액하는 이중결합이 있는 나프탈렌 고리를 갖는 화합물을 함유하여 이루어지는 것을 특징으로 하는 열 경화성 수지 조성물.
  2. 제1항에 있어서, 방향족 중합체가 하기 조성식[Ⅱ]로 나타낸 오르가노 폴리실록산을 반응시킴으로써 얻어지는 공중합체를 첨가한 것을 특징으로 하는 열경화성 수지 조성물.
    식중, R1은 수소원자, 아미노기, 에폭시기, 카르복실기를 함유하는 유기기 또는 알콕시기를 나타내고, R2는 치환 또는 비치환된 1가 탄화 수소기, 수신기, 알콕시기 또는 알케닐옥시기를 나타내며, a,b는 0.001≤b ≤3.1≤a+b ≤4를 만족시키는 양수이고, 1분자 중의 규소 원자 수는 1~1000의 정수이고, 1분자 중의 규소 원자에 직접 결합된 관능기 (R1)의 수는 1이상의 정수이다.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930001932A 1992-02-13 1993-02-12 열 경화성 수지 조성물 KR100241844B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP92-059309 1992-02-13
JP4059309A JP2669247B2 (ja) 1992-02-13 1992-02-13 熱硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
KR930017971A true KR930017971A (ko) 1993-09-21
KR100241844B1 KR100241844B1 (ko) 2000-03-02

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KR1019930001932A KR100241844B1 (ko) 1992-02-13 1993-02-12 열 경화성 수지 조성물

Country Status (5)

Country Link
US (1) US5340851A (ko)
EP (1) EP0559338B1 (ko)
JP (1) JP2669247B2 (ko)
KR (1) KR100241844B1 (ko)
DE (1) DE69318329T2 (ko)

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JP3288185B2 (ja) * 1994-10-07 2002-06-04 日立化成工業株式会社 電子部品封止用エポキシ樹脂成形材料及びそれを用いた半導体装置
EP0780435A1 (en) * 1995-12-21 1997-06-25 National Starch and Chemical Investment Holding Corporation Flexible epoxy adhesives with low bleeding tendency
TW340967B (en) * 1996-02-19 1998-09-21 Toray Industries An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device
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CN102112568A (zh) * 2008-08-04 2011-06-29 日立化成工业株式会社 胶粘剂组合物、膜状胶粘剂、胶粘片和半导体装置
KR101670087B1 (ko) 2010-03-24 2016-10-28 삼성전기주식회사 열경화성 수지, 이를 포함한 수지 조성물, 및 이를 이용하여 제조된 인쇄회로기판
CN107735417B (zh) * 2015-07-06 2020-06-26 三菱瓦斯化学株式会社 树脂组合物、使用该树脂组合物的预浸料或树脂片以及使用它们的层叠板和印刷电路板
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KR102572390B1 (ko) * 2015-07-06 2023-08-29 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 레진 시트, 금속박 피복 적층판 및 프린트 배선판
JP6611861B2 (ja) * 2018-05-30 2019-11-27 京セラ株式会社 封止用エポキシ樹脂成形材料及び電子部品
CN112920378B (zh) * 2021-01-28 2023-06-13 深圳市宝安区新材料研究院 一种羟基树脂及其制备方法和应用
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Also Published As

Publication number Publication date
EP0559338A1 (en) 1993-09-08
KR100241844B1 (ko) 2000-03-02
DE69318329D1 (de) 1998-06-10
JPH05222164A (ja) 1993-08-31
JP2669247B2 (ja) 1997-10-27
US5340851A (en) 1994-08-23
DE69318329T2 (de) 1998-09-24
EP0559338B1 (en) 1998-05-06

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