KR930001907B1 - 전기 및 열전도성 접착 전이테이프 - Google Patents

전기 및 열전도성 접착 전이테이프 Download PDF

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Publication number
KR930001907B1
KR930001907B1 KR1019840003306A KR840003306A KR930001907B1 KR 930001907 B1 KR930001907 B1 KR 930001907B1 KR 1019840003306 A KR1019840003306 A KR 1019840003306A KR 840003306 A KR840003306 A KR 840003306A KR 930001907 B1 KR930001907 B1 KR 930001907B1
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KR
South Korea
Prior art keywords
adhesive
layer
particles
tape
transfer tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019840003306A
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English (en)
Korean (ko)
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KR850000812A (ko
Inventor
스티븐 레이테크 로버트
차알스 톰프슨 케니스
Original Assignee
미네소타 마이닝 앤드 매뉴팩츄어링 컴패니
도날드 밀러 셀
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Publication of KR850000812A publication Critical patent/KR850000812A/ko
Application granted granted Critical
Publication of KR930001907B1 publication Critical patent/KR930001907B1/ko
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0435—Metal coated solder, e.g. for passivation of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01304—Manufacture or treatment of die-attach connectors using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
KR1019840003306A 1983-06-13 1984-06-13 전기 및 열전도성 접착 전이테이프 Expired - Fee Related KR930001907B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US50357883A 1983-06-13 1983-06-13
US503578 1983-06-13
US503,578 1983-06-13

Publications (2)

Publication Number Publication Date
KR850000812A KR850000812A (ko) 1985-03-09
KR930001907B1 true KR930001907B1 (ko) 1993-03-19

Family

ID=24002656

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840003306A Expired - Fee Related KR930001907B1 (ko) 1983-06-13 1984-06-13 전기 및 열전도성 접착 전이테이프

Country Status (11)

Country Link
EP (1) EP0134623B1 (https=)
JP (1) JPS6011574A (https=)
KR (1) KR930001907B1 (https=)
AT (1) ATE36429T1 (https=)
AU (1) AU565919B2 (https=)
CA (1) CA1247943A (https=)
DE (1) DE3473382D1 (https=)
HK (1) HK24989A (https=)
IE (1) IE55524B1 (https=)
MX (1) MX158056A (https=)
SG (1) SG90788G (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IE55238B1 (en) * 1983-08-03 1990-07-04 Nat Starch Chem Corp Carrier film with conductive adhesive for dicing of semiconductor wafers
US4687693A (en) * 1985-06-13 1987-08-18 Stauffer Chemical Company Adhesively mountable die attach film
AU588925B2 (en) * 1985-11-06 1989-09-28 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
AU608745B2 (en) * 1986-02-07 1991-04-18 Minnesota Mining And Manufacturing Company Connector with fine-pitched conductive passages
EP0275433B1 (de) * 1986-12-22 1992-04-01 Siemens Aktiengesellschaft Verfahren zur Befestigung von elektronischen Bauelementen auf einem Substrat, Folie zur Durchführung des Verfahrens und Verfahren zur Herstellung der Folie
US4839227A (en) * 1987-03-12 1989-06-13 Minnesota Mining And Manufacturing Company Resilient electrically and thermally conductive flexible composite
DE3908097A1 (de) * 1989-03-13 1990-09-20 Irion & Vosseler Praegefolie zum aufbringen von leiterbahnen auf feste oder plastische unterlagen
DE69017553T2 (de) * 1989-08-15 1995-12-14 Casio Computer Co Ltd Leitfähige Verbindungsstruktur.
WO1993012190A1 (en) * 1991-12-19 1993-06-24 Cookson Group Plc Conductive adhesive compositions based on thermally depolymerisable polymers
JPH08236554A (ja) * 1995-02-28 1996-09-13 Mitsubishi Electric Corp 半導体装置，及び半導体装置の製造方法，並びに半導体装置のダイボンディング方法
JP2793559B2 (ja) * 1996-05-30 1998-09-03 日東電工株式会社 耐熱性および熱伝導性にすぐれた感圧性接着剤とその接着シ―ト類およびこれらを用いた電子部品と放熱部材との固定方法
KR100218335B1 (ko) * 1996-11-20 1999-09-01 구본준 칩 사이즈 패키지
WO2000001782A1 (de) * 1998-07-04 2000-01-13 Beiersdorf Ag Elektrisch leitfähige, thermoplastische und hitzeaktivierbare klebstofffolie
DE19853805B4 (de) * 1998-11-21 2005-05-12 Tesa Ag Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstofffolie und deren Verwendung
US9061478B2 (en) 2011-05-18 2015-06-23 3M Innovative Properties Company Conductive nonwoven pressure sensitive adhesive tapes and articles therefrom
CN104085215B (zh) * 2014-06-27 2016-08-17 苏州达方电子有限公司 热转印膜及其制造方法与硬质表面结构及其形成方法
JP6718761B2 (ja) * 2015-07-21 2020-07-08 積水化学工業株式会社 接着シート

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3896544A (en) * 1973-01-15 1975-07-29 Essex International Inc Method of making resilient electrical contact assembly for semiconductor devices
JPS51101040A (https=) * 1975-03-04 1976-09-07 Suwa Seikosha Kk
US4285433A (en) * 1979-12-19 1981-08-25 Western Electric Co., Inc. Method and apparatus for removing dice from a severed wafer
JPS58160383A (ja) * 1982-03-18 1983-09-22 Nitto Electric Ind Co Ltd 導電性接着テ−プの貼り付け方法
ES276990Y (es) * 1983-01-24 1985-01-16 Minnesota Mining And Manufacturing Company Articulo laminar para efectuar conexiones electricas de union a un sustrato
JPS59153339A (ja) * 1983-02-21 1984-09-01 Nippon Telegr & Teleph Corp <Ntt> 誘導雑音区間識別方式
JPS59195837A (ja) * 1983-04-21 1984-11-07 Sharp Corp Ｌｓｉチツプボンデイング方法

Also Published As

Publication number Publication date
HK24989A (en) 1989-03-31
JPS6011574A (ja) 1985-01-21
EP0134623A2 (en) 1985-03-20
AU2783184A (en) 1984-12-20
JPH0352510B2 (https=) 1991-08-12
KR850000812A (ko) 1985-03-09
DE3473382D1 (en) 1988-09-15
CA1247943A (en) 1989-01-03
IE55524B1 (en) 1990-10-10
AU565919B2 (en) 1987-10-01
EP0134623B1 (en) 1988-08-10
EP0134623A3 (en) 1985-10-30
SG90788G (en) 1991-04-05
IE841147L (en) 1984-12-13
MX158056A (es) 1988-12-29
ATE36429T1 (de) 1988-08-15

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