KR930001754Y1 - 반도체 패키지(package) - Google Patents

반도체 패키지(package) Download PDF

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Publication number
KR930001754Y1
KR930001754Y1 KR2019900000855U KR900000855U KR930001754Y1 KR 930001754 Y1 KR930001754 Y1 KR 930001754Y1 KR 2019900000855 U KR2019900000855 U KR 2019900000855U KR 900000855 U KR900000855 U KR 900000855U KR 930001754 Y1 KR930001754 Y1 KR 930001754Y1
Authority
KR
South Korea
Prior art keywords
lead
semiconductor package
width
power supply
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR2019900000855U
Other languages
English (en)
Korean (ko)
Other versions
KR900014991U (ko
Inventor
야끼 스미노리
Original Assignee
미쓰비시뎅끼가부시끼가이샤
시기 모리야
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰비시뎅끼가부시끼가이샤, 시기 모리야 filed Critical 미쓰비시뎅끼가부시끼가이샤
Publication of KR900014991U publication Critical patent/KR900014991U/ko
Application granted granted Critical
Publication of KR930001754Y1 publication Critical patent/KR930001754Y1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
KR2019900000855U 1989-01-26 1990-01-25 반도체 패키지(package) Expired - Lifetime KR930001754Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8059/89 1989-01-26
JP1989008059U JPH0298655U (enExample) 1989-01-26 1989-01-26

Publications (2)

Publication Number Publication Date
KR900014991U KR900014991U (ko) 1990-08-02
KR930001754Y1 true KR930001754Y1 (ko) 1993-04-12

Family

ID=11682765

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019900000855U Expired - Lifetime KR930001754Y1 (ko) 1989-01-26 1990-01-25 반도체 패키지(package)

Country Status (3)

Country Link
US (1) US4989066A (enExample)
JP (1) JPH0298655U (enExample)
KR (1) KR930001754Y1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0371546U (enExample) * 1989-11-15 1991-07-19
US5214845A (en) * 1992-05-11 1993-06-01 Micron Technology, Inc. Method for producing high speed integrated circuits
US5939781A (en) * 1996-09-26 1999-08-17 Texas Instruments Incorporated Thermally enhanced integrated circuit packaging system
US7009282B2 (en) * 2003-09-26 2006-03-07 Agere Systems Inc. Packaged integrated circuit providing trace access to high-speed leads
KR100635386B1 (ko) * 2004-11-12 2006-10-18 삼성전자주식회사 고속 신호 처리가 가능한 반도체 칩 패키지
KR100639948B1 (ko) * 2005-08-22 2006-11-01 삼성전자주식회사 이원 리드 배치 형태를 가지는 리드프레임 패키지
JPWO2007125939A1 (ja) * 2006-04-27 2009-09-10 株式会社Ｎｅｏｍａｘマテリアル 配線接続用クラッド材及びそのクラッド材から加工された配線接続部材
US10541194B2 (en) * 2017-03-23 2020-01-21 Texas Instruments Incorporated Semiconductor package with interconnected leads

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164548A (en) * 1981-04-02 1982-10-09 Nec Corp Semiconductor device
DE3680265D1 (de) * 1985-02-28 1991-08-22 Sony Corp Halbleiterschaltungsanordnung.
JPS6443246A (en) * 1987-08-12 1989-02-15 Toshiba Corp Detection system for magnetic resonance imaging apparatus

Also Published As

Publication number Publication date
KR900014991U (ko) 1990-08-02
JPH0298655U (enExample) 1990-08-06
US4989066A (en) 1991-01-29

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