JPH0298655U - - Google Patents
Info
- Publication number
- JPH0298655U JPH0298655U JP1989008059U JP805989U JPH0298655U JP H0298655 U JPH0298655 U JP H0298655U JP 1989008059 U JP1989008059 U JP 1989008059U JP 805989 U JP805989 U JP 805989U JP H0298655 U JPH0298655 U JP H0298655U
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- semiconductor package
- supply lead
- semiconductor
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989008059U JPH0298655U (enExample) | 1989-01-26 | 1989-01-26 | |
| US07/468,612 US4989066A (en) | 1989-01-26 | 1990-01-23 | Semiconductor package |
| KR2019900000855U KR930001754Y1 (ko) | 1989-01-26 | 1990-01-25 | 반도체 패키지(package) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989008059U JPH0298655U (enExample) | 1989-01-26 | 1989-01-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0298655U true JPH0298655U (enExample) | 1990-08-06 |
Family
ID=11682765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989008059U Pending JPH0298655U (enExample) | 1989-01-26 | 1989-01-26 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4989066A (enExample) |
| JP (1) | JPH0298655U (enExample) |
| KR (1) | KR930001754Y1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0371546U (enExample) * | 1989-11-15 | 1991-07-19 | ||
| US5214845A (en) * | 1992-05-11 | 1993-06-01 | Micron Technology, Inc. | Method for producing high speed integrated circuits |
| US5939781A (en) * | 1996-09-26 | 1999-08-17 | Texas Instruments Incorporated | Thermally enhanced integrated circuit packaging system |
| US7009282B2 (en) * | 2003-09-26 | 2006-03-07 | Agere Systems Inc. | Packaged integrated circuit providing trace access to high-speed leads |
| KR100635386B1 (ko) * | 2004-11-12 | 2006-10-18 | 삼성전자주식회사 | 고속 신호 처리가 가능한 반도체 칩 패키지 |
| KR100639948B1 (ko) * | 2005-08-22 | 2006-11-01 | 삼성전자주식회사 | 이원 리드 배치 형태를 가지는 리드프레임 패키지 |
| JPWO2007125939A1 (ja) * | 2006-04-27 | 2009-09-10 | 株式会社Ｎｅｏｍａｘマテリアル | 配線接続用クラッド材及びそのクラッド材から加工された配線接続部材 |
| US10541194B2 (en) * | 2017-03-23 | 2020-01-21 | Texas Instruments Incorporated | Semiconductor package with interconnected leads |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57164548A (en) * | 1981-04-02 | 1982-10-09 | Nec Corp | Semiconductor device |
| DE3680265D1 (de) * | 1985-02-28 | 1991-08-22 | Sony Corp | Halbleiterschaltungsanordnung. |
| JPS6443246A (en) * | 1987-08-12 | 1989-02-15 | Toshiba Corp | Detection system for magnetic resonance imaging apparatus |
-
1989
- 1989-01-26 JP JP1989008059U patent/JPH0298655U/ja active Pending
-
1990
- 1990-01-23 US US07/468,612 patent/US4989066A/en not_active Expired - Lifetime
- 1990-01-25 KR KR2019900000855U patent/KR930001754Y1/ko not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR900014991U (ko) | 1990-08-02 |
| KR930001754Y1 (ko) | 1993-04-12 |
| US4989066A (en) | 1991-01-29 |