KR930001365A - 복합 플립 칩 반도체 소자와 그 제조 및 번-인(burning-in) 방법 - Google Patents
복합 플립 칩 반도체 소자와 그 제조 및 번-인(burning-in) 방법 Download PDFInfo
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- KR930001365A KR930001365A KR1019920010970A KR920010970A KR930001365A KR 930001365 A KR930001365 A KR 930001365A KR 1019920010970 A KR1019920010970 A KR 1019920010970A KR 920010970 A KR920010970 A KR 920010970A KR 930001365 A KR930001365 A KR 930001365A
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- electrically connected
- interposer
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- 239000004065 semiconductor Substances 0.000 title claims description 18
- 239000002131 composite material Substances 0.000 title claims description 6
- 238000004519 manufacturing process Methods 0.000 title claims 2
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- 239000000758 substrate Substances 0.000 claims 5
- 239000000463 material Substances 0.000 claims 3
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 230000002708 enhancing effect Effects 0.000 claims 1
- 238000003672 processing method Methods 0.000 claims 1
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Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 복합 플립 칩 반도체 소자를 형성하도록 본 발명에 따라 인터포우터(interposer)에 부착된 반도체 다이의 사시도.
제2도는 반도체 소자를 인티포우저상에 위치시킨 후의 제1도 반도체 소자의 평면도.
제3도는 제2도 반도체 소자의 저면도.
제4도는 제2도의 라인 4-4를 따라 취해진 반도체 소자의 단면도.
Claims (3)
- 복합 플립 칩 반도체 소자(10)에 있어서; 그 위에 형성된 직접 회로와 직접 회로에 전기적으로 연결된 다수의 본딩 패드(14)를 가지는 단일 반도체 다이(12)와; 제1 및 제2 표면과 제1표면에서 제2표면으로 확장하는 다수의 바이어스를 가지며, 제1표면이 상기 다수의 바이어스에 전기적으로 연결된 다수의 도전 트레이스(26)를 가지는 인터포우저; 상기 다수의 본딩 패드를 상기 다수의 도전 트레이스에 전기적으로 연결시키는 수단; 및 상기 다수의 바이어스를 기판에 전기적으로 연결시키는 수단을 구비하는 복합 플립 칩 반도체 소자.
- 복합 플립 칩 반도체 소자(10)를 제조하는 방법에 있어서; 제1 및 제2 상반된 표면과 그 위에 형성된 집적회로를 가지며, 제1표면이 직접 회로에 전기적으로 연결된 다수의 본딩 패드(14)를 가지는 반도체 다이(12)를 제공하며; 제1 및 제2상반된 표면과 제1표면에서 제2표면으로 확장하는 다수의 전기적 바이어스(24)를 가지며, 제1표면이 상기 다수의 바이어스에 전기적으로 연결된 다수의 전기적 트레이스(26)를 가지는 인터포우저(22)를 제공하고; 반도체 다이의 제1표면이 인터포우저의 제1표면을 상반되게 하고, 상기 다수의 본딩 패드가 상기 다수의 바이어스에 전기적으로 연결되도록 반도체 다이를 인터포우저에 부착시키며; 상기 다수의 바이어스를 기판에 전기적으로 연결하는 수단을 제공하는 단계를 구비하는 복합 플립 칩 반도체 소자를 제조하는 방법.
- 복합 플립 칩 반도체 소자의 번-인을 강화시키는 처리 방법에 있어서, 다수의 다이를 받아들이는 영역(22)과 제1 및 제2표면을 가지며, 제1표면이 제1표면으로부터 제2표면으로 확장하는 다수의 전기적 바이어스(24)에 전기적으로 연결된 다수의 도전 트레이스(26)를 가지는 인터포우저 기판 재료(60)를 제공하며; 반도체 다이가 상기 다수의 바이어스에 전기적으로 연결되도록 반도체 다이(12)를 다이를 받아들이는 영역 각각에 위치시키고; 인터포우저 기판 재료가 소정의 응력을 받게 함으로써, 반도체 다이 각각을 번-인하며; 다이를 받아들이는 영역들을 분리하여, 다수의 복합 플립 칩 반도체 소자(10)를 형성하도록 인터포우저 기판 재료를 개별화하는 단계를 구비하는 복합 플립 칩 반도체 소자의 번-인을 강화시키는 처리 방법.※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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US722,429 | 1991-03-27 | ||
US72244991A | 1991-06-27 | 1991-06-27 | |
US72242991A | 1991-06-27 | 1991-06-27 | |
US722,449 | 1991-06-27 |
Publications (1)
Publication Number | Publication Date |
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KR930001365A true KR930001365A (ko) | 1993-01-16 |
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Application Number | Title | Priority Date | Filing Date |
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KR1019920010970A KR930001365A (ko) | 1991-03-27 | 1992-06-24 | 복합 플립 칩 반도체 소자와 그 제조 및 번-인(burning-in) 방법 |
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Country | Link |
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EP (1) | EP0520841A1 (ko) |
JP (1) | JPH05211202A (ko) |
KR (1) | KR930001365A (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20240092936A (ko) | 2022-12-15 | 2024-06-24 | 주식회사 웰릭스 | 온습도 환경에 대한 보정 알고리즘을 적용한 실시간 식품 부패 모니터링 시스템 |
KR20240099684A (ko) | 2022-12-22 | 2024-07-01 | 주식회사 웰릭스 | 식품 부패 모니터링을 위한 가스센서모듈 특성 분석 시스템 |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3007497B2 (ja) * | 1992-11-11 | 2000-02-07 | 三菱電機株式会社 | 半導体集積回路装置、その製造方法、及びその実装方法 |
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EP0351581A1 (de) * | 1988-07-22 | 1990-01-24 | Oerlikon-Contraves AG | Hochintegrierte Schaltung sowie Verfahren zu deren Herstellung |
-
1992
- 1992-06-24 KR KR1019920010970A patent/KR930001365A/ko not_active Application Discontinuation
- 1992-06-24 JP JP4188990A patent/JPH05211202A/ja active Pending
- 1992-06-29 EP EP92305999A patent/EP0520841A1/en not_active Withdrawn
Cited By (2)
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KR20240092936A (ko) | 2022-12-15 | 2024-06-24 | 주식회사 웰릭스 | 온습도 환경에 대한 보정 알고리즘을 적용한 실시간 식품 부패 모니터링 시스템 |
KR20240099684A (ko) | 2022-12-22 | 2024-07-01 | 주식회사 웰릭스 | 식품 부패 모니터링을 위한 가스센서모듈 특성 분석 시스템 |
Also Published As
Publication number | Publication date |
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EP0520841A1 (en) | 1992-12-30 |
JPH05211202A (ja) | 1993-08-20 |
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