KR920022045A - 화상 형성용 노광장치 - Google Patents

화상 형성용 노광장치 Download PDF

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Publication number
KR920022045A
KR920022045A KR1019920002731A KR920002731A KR920022045A KR 920022045 A KR920022045 A KR 920022045A KR 1019920002731 A KR1019920002731 A KR 1019920002731A KR 920002731 A KR920002731 A KR 920002731A KR 920022045 A KR920022045 A KR 920022045A
Authority
KR
South Korea
Prior art keywords
substrate
exposure apparatus
image forming
image
forming exposure
Prior art date
Application number
KR1019920002731A
Other languages
English (en)
Other versions
KR950000485B1 (ko
Inventor
지아끼 아베
미노루 와따누끼
Original Assignee
야자끼 요시오
주식회사 오크 제작소
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 야자끼 요시오, 주식회사 오크 제작소 filed Critical 야자끼 요시오
Publication of KR920022045A publication Critical patent/KR920022045A/ko
Application granted granted Critical
Publication of KR950000485B1 publication Critical patent/KR950000485B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/2032—Simultaneous exposure of the front side and the backside
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09581—Applying an insulating coating on the walls of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Projection-Type Copiers In General (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

내용 없음.

Description

화상 형성용 노광장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예인 노광장치를 횡방향으로 나타낸 절단측면도,
제2도는 제1도의 선 Ⅱ-Ⅱ방향으로 본 확대단면도,
제3도는 제1도의 선 Ⅲ-Ⅲ방향으로 본 확대단면도.

Claims (1)

  1. 화상형성용 필름을 통해 기판에 자외선를 조사하고, 상기 기판의 표면 및 관통공의 내벽면에 입힌 전착성 포토레지스트에 광화학반응을 일으켜 기판의 표면에 화상을 형성시키는 노광장치에 있어서, 방전등과 반사경을 가지는 자외선 조사장치를 기판의 상방 및 하방으로 상,하 대칭으로 배치하고, 상기 기판에 입사하는 자외선의 노광의 중간에 톱니형상 단면을 갖는 편평한 상,하 투광판을 기판에 대하여 상,하대칭으로 수평방향으로 이동가능하게 이격 배치한 것을 특징으로 하는 화상형성용 노광장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920002731A 1991-05-13 1992-02-22 화상형성용 노광장치 KR950000485B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-107430 1991-05-13
JP3107430A JP2769748B2 (ja) 1991-05-13 1991-05-13 画像形成用露光装置

Publications (2)

Publication Number Publication Date
KR920022045A true KR920022045A (ko) 1992-12-19
KR950000485B1 KR950000485B1 (ko) 1995-01-20

Family

ID=14458948

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920002731A KR950000485B1 (ko) 1991-05-13 1992-02-22 화상형성용 노광장치

Country Status (5)

Country Link
US (1) US5185625A (ko)
EP (1) EP0513965B1 (ko)
JP (1) JP2769748B2 (ko)
KR (1) KR950000485B1 (ko)
DE (1) DE69210085T2 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2769753B2 (ja) * 1991-08-28 1998-06-25 株式会社オーク製作所 画像形成用露光装置
EP0623440B1 (en) * 1993-03-16 1997-09-10 Koninklijke Philips Electronics N.V. Method of and device for providing a patterned relief of cured photoresist on a flat substrate surface
US5386268A (en) * 1993-07-26 1995-01-31 E. I. Du Pont De Nemours And Company Exposure unit and method for exposing photosensitive materials
IL106892A0 (en) * 1993-09-02 1993-12-28 Pierre Badehi Methods and apparatus for producing integrated circuit devices
JP2747282B2 (ja) * 1996-08-29 1998-05-06 富山日本電気株式会社 印刷配線板の製造方法
US5933216A (en) * 1997-10-16 1999-08-03 Anvik Corporation Double-sided patterning system using dual-wavelength output of an excimer laser
US6356337B1 (en) * 2000-03-08 2002-03-12 Anvik Corporation Two-sided substrate imaging using single-approach projection optics
KR20090116333A (ko) * 2008-05-07 2009-11-11 주식회사 프로텍 상하 독립구동 방식의 양면 동시 노광시스템
ITMI20120652A1 (it) * 2012-04-19 2013-10-20 Caria Riccardo De Metodo ed apparato per la fotopolimerizzazione ed il lavaggio in serie di lastre di stampa digitali per flessografia
CN106371292B (zh) * 2016-09-18 2019-01-22 中国科学院光电技术研究所 一种双面光刻工件台
US10834828B2 (en) 2018-01-26 2020-11-10 International Business Machines Corporation Creating inductors, resistors, capacitors and other structures in printed circuit board vias with light pipe technology
US10834830B2 (en) 2019-02-13 2020-11-10 International Business Machines Corporation Creating in-via routing with a light pipe

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4109158A (en) * 1976-05-27 1978-08-22 Western Electric Company, Inc. Apparatus for positioning a pair of elements into aligned intimate contact
US4389115A (en) * 1981-08-06 1983-06-21 Richter Thomas A Optical system
DE3340653A1 (de) * 1983-11-10 1985-05-23 Hans 6250 Limburg Haus Vorrichtung zum gleichzeitigen oder aufeinanderfolgenden belichten von, auf beide seiten von leiterplatten o. dgl. aufgelegten ebenen kopiervorlagen
JPS60168148A (ja) * 1984-02-13 1985-08-31 Oak Seisakusho:Kk 焼付機
JPS62212657A (ja) * 1986-03-14 1987-09-18 Oak Seisakusho:Kk 移送式の両面露光装置
JPS63182888A (ja) * 1987-01-26 1988-07-28 関西ペイント株式会社 プリント配線板の製造方法
DE3834479A1 (de) * 1988-10-11 1990-04-12 Schmid Gmbh & Co Geb Vorrichtung und verfahren zum belichten von auf traegern aufgebrachten lichtempfindlichen schichten
JPH02254456A (ja) * 1989-03-29 1990-10-15 Orc Mfg Co Ltd フォトレジスト露光方法およびその装置

Also Published As

Publication number Publication date
DE69210085T2 (de) 1996-09-19
JP2769748B2 (ja) 1998-06-25
EP0513965A1 (en) 1992-11-19
US5185625A (en) 1993-02-09
EP0513965B1 (en) 1996-04-24
JPH04335642A (ja) 1992-11-24
KR950000485B1 (ko) 1995-01-20
DE69210085D1 (de) 1996-05-30

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