KR920019018A - 무도선 ic 패키지용 커넥터 - Google Patents
무도선 ic 패키지용 커넥터 Download PDFInfo
- Publication number
- KR920019018A KR920019018A KR1019920003718A KR920003718A KR920019018A KR 920019018 A KR920019018 A KR 920019018A KR 1019920003718 A KR1019920003718 A KR 1019920003718A KR 920003718 A KR920003718 A KR 920003718A KR 920019018 A KR920019018 A KR 920019018A
- Authority
- KR
- South Korea
- Prior art keywords
- contact
- spring portion
- hole
- braking
- spring
- Prior art date
Links
- 238000005452 bending Methods 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000011084 recovery Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connecting Device With Holders (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예에 따른 무도선 IC패키지용 커넥터의 요부를 도시한 확대 단면도,
제2도는 또한 스프링 부분이 고정상태인 커넥터의 요부를 도시한 확대 단면도,
제3도는 또한 무도선 IC가 무도선 IC 패키지용 커넥터에 장착되었을 때 스프링 부분 및 구동부위의 일련의 동작을 도시한 커넥터 요부의 확대 단면도.
Claims (4)
- 접촉부 각각이 스프링부로 형성되고; 상기 커넥터는 상기 스프링부가 끼워진 접촉유지부위를 포함하고; 접촉 제동부위는 상기 접촉유지 부위에 배치되고; 및 접촉 구동부위는 상기 접촉 제동부위 및 상기 접촉 유지부위간에 측방향으로 움직일 수 있도록 배치되고; 상기 스프링부는 상기 구동부위에 형성된 접촉 구동 관통홀을 관통하도록 허용된 상기 유지 부위에 끼워지고; 상기 스프링부의 말단은 상기 제동부위에 형성된 접촉 제동 관통홀에 받아들여지고; 상기 스프링부는, 상기 스프링부가 구부러지고 변위되도록, 상기 구동부위가 한 방향으로 움직일 때 상기 접촉구동 관통홀의 내벽에 의해 측방향으로 압착되고; 상기 스프링부는 상기 구동부위가 다른 방향에서 측방향으로 움직일 때 그의 원상태로 복구되고; 상기 스프링부의 상기 말단부위는 상기 접촉 제동 관통홀 내부로 확장 및 수축되는 반면에 상기 말단 부위는 상기 구부리는 변위 및 복구에 의해 상기 접촉 제동 관통홀의 내벽에 의해 제동되며; 상기 스프링부의 상기 말단부위는, 상기 스프링부가 확장될 때 상기 접촉 제동관통홀에 대응하는 상기 IC의 저면상에 정열된 전도성 패드에 압접되는 접촉부를 장착한 무도선 IC 패키지용 커넥터.
- 제1항에 있어서, 상기 스프링부의 상기 말단 부위 전단면이 상기 전도성 패드에 압접되는 것을 특징으로 하는 무도선 IC 패키지용 커넥터.
- 제1항에 있어서, 상기 스프링부가 구부러진 부위를 갖지 않는 직선부로 구성되는 것을 특징으로 하는 무도선 IC 패키지용 커넥터.
- 제1항에 있어서, 상기 스프링부가 상기 접촉 구동 관통홀로 관통하는 그의 부분에 구부러진 부위를 갖고, 상기구부러진 부위가 상기 축방향 압력을 수신하는 측 쪽으로 돌출하는 것을 특징으로 하는 무도선 IC 패키지용 커넥터.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3075864A JPH0675415B2 (ja) | 1991-03-15 | 1991-03-15 | リードレス形icパッケージ用接続器 |
JP91-75864 | 1991-03-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR920019018A true KR920019018A (ko) | 1992-10-22 |
Family
ID=13588547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920003718A KR920019018A (ko) | 1991-03-15 | 1992-03-06 | 무도선 ic 패키지용 커넥터 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5320559A (ko) |
EP (1) | EP0503810B1 (ko) |
JP (1) | JPH0675415B2 (ko) |
KR (1) | KR920019018A (ko) |
CA (1) | CA2062199A1 (ko) |
DE (1) | DE69212189D1 (ko) |
MY (1) | MY108489A (ko) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2576309Y2 (ja) * | 1992-07-31 | 1998-07-09 | 日本航空電子工業株式会社 | 電子部品パッケージ用コネクタ |
US5399101A (en) * | 1993-12-16 | 1995-03-21 | International Business Machines Corporation | Electrical connector with preloaded contact |
US5632631A (en) | 1994-06-07 | 1997-05-27 | Tessera, Inc. | Microelectronic contacts with asperities and methods of making same |
GB2290176B (en) * | 1994-06-10 | 1997-07-02 | Wayne Kay Pfaff | Mounting apparatus for ball grid array device |
JPH08285890A (ja) * | 1995-04-10 | 1996-11-01 | Tokyo Electron Ltd | プローブカード |
DE19829934C2 (de) * | 1997-11-05 | 2002-02-14 | Feinmetall Gmbh | Prüfkopf für Mikrostrukturen mit Schnittstelle |
US6196866B1 (en) * | 1999-04-30 | 2001-03-06 | International Business Machines Corporation | Vertical probe housing |
JP4414017B2 (ja) | 1999-05-25 | 2010-02-10 | モレックス インコーポレイテド | Icソケット |
IT1317517B1 (it) * | 2000-05-11 | 2003-07-09 | Technoprobe S R L | Testa di misura per microstrutture |
DE10053745B4 (de) * | 2000-10-30 | 2004-07-15 | Heigl, Helmuth, Dr.-Ing. | Vorrichtung und Verfahren zur Kontaktierung eines oder mehrerer Anschlüsse an einem elektronischen Bauteil |
ITMI20010567A1 (it) * | 2001-03-19 | 2002-09-19 | Technoprobe S R L | Testa di misura a sonde verticali per dispositivi elettronici integrati su semiconduttore |
TW516723U (en) | 2001-12-28 | 2003-01-01 | Guang-Jr Lai | Ball grid array or square grid array Integrated circuit socket |
US20030215533A1 (en) * | 2002-04-11 | 2003-11-20 | Saeed Rezakhany | Method of preventing respiratory infections |
US7059046B2 (en) * | 2002-06-24 | 2006-06-13 | Delaware Capital Formation, Inc. | Method for producing a captive wired test fixture and fixture therefor |
TW562261U (en) | 2002-11-08 | 2003-11-11 | Hon Hai Prec Ind Co Ltd | Electrical connector assembly |
TW551635U (en) * | 2002-12-13 | 2003-09-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
TW566706U (en) * | 2002-12-25 | 2003-12-11 | Hon Hai Prec Ind Co Ltd | LGA electrical connector with reinforce members |
US6758691B1 (en) | 2003-04-10 | 2004-07-06 | Hon Hai Precision Ind. Co., Ltd | Land grid array connector assembly with sliding lever |
KR100675343B1 (ko) * | 2004-12-20 | 2007-01-29 | 황동원 | 반도체용 테스트 및 번인 소켓 |
DE102006005522A1 (de) * | 2006-02-07 | 2007-08-16 | Feinmetall Gmbh | Elektrische Kontaktiervorrichtung sowie elektrisches Kontaktierverfahren |
US20080238452A1 (en) * | 2007-03-30 | 2008-10-02 | Dsl Labs, Incorporated | Vertical micro probes |
US8264248B2 (en) * | 2007-03-30 | 2012-09-11 | Dsl Labs, Inc. | Micro probe assembly |
JP2012089286A (ja) * | 2010-10-18 | 2012-05-10 | Hioki Ee Corp | プラグ型コネクタおよびコネクタ |
JP6872960B2 (ja) * | 2017-04-21 | 2021-05-19 | 株式会社日本マイクロニクス | 電気的接続装置 |
CN109616799B (zh) * | 2017-09-30 | 2021-01-29 | 中航光电科技股份有限公司 | 带有容差模块的连接器 |
US20220326280A1 (en) * | 2021-04-12 | 2022-10-13 | Kes Systems & Service (1993) Pte Ltd. | Probe assembly for test and burn-in having a compliant contact element |
KR102450658B1 (ko) * | 2022-09-01 | 2022-10-06 | 윌테크놀러지(주) | 니들유닛의 팁 길이조절이 용이한 니들블럭 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4423376A (en) * | 1981-03-20 | 1983-12-27 | International Business Machines Corporation | Contact probe assembly having rotatable contacting probe elements |
DE3123627A1 (de) * | 1981-06-15 | 1982-12-30 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum gleichzeitigen kontaktieren mehrerer eng beisammenliegender pruefpunkte, insbesondere von rasterfeldern |
US4505532A (en) * | 1982-07-23 | 1985-03-19 | Raychem Corporation | Array package connector |
US4622514A (en) * | 1984-06-15 | 1986-11-11 | Ibm | Multiple mode buckling beam probe assembly |
JPS6325467A (ja) * | 1986-07-17 | 1988-02-02 | 松下精工株式会社 | 冷媒用アキユムレ−タ |
US4963822A (en) * | 1988-06-01 | 1990-10-16 | Manfred Prokopp | Method of testing circuit boards and the like |
DE8807493U1 (de) * | 1988-06-09 | 1988-07-21 | Dürkoppwerke GmbH, 4800 Bielefeld | Nähmaschine mit einer druckmittelbetätigbaren Vorrichtung zum Erzeugen einer veränderbaren, auf einen Stoffdrücker einwirkenden Andrückkraft |
-
1991
- 1991-03-15 JP JP3075864A patent/JPH0675415B2/ja not_active Expired - Fee Related
-
1992
- 1992-03-02 EP EP92301753A patent/EP0503810B1/en not_active Expired - Lifetime
- 1992-03-02 DE DE69212189T patent/DE69212189D1/de not_active Expired - Lifetime
- 1992-03-03 CA CA002062199A patent/CA2062199A1/en not_active Abandoned
- 1992-03-06 KR KR1019920003718A patent/KR920019018A/ko not_active Application Discontinuation
- 1992-03-09 MY MYPI92000375A patent/MY108489A/en unknown
-
1993
- 1993-07-13 US US08/090,644 patent/US5320559A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0503810B1 (en) | 1996-07-17 |
MY108489A (en) | 1996-09-30 |
EP0503810A3 (en) | 1993-12-08 |
JPH05242935A (ja) | 1993-09-21 |
JPH0675415B2 (ja) | 1994-09-21 |
CA2062199A1 (en) | 1992-09-16 |
DE69212189D1 (de) | 1996-08-22 |
EP0503810A2 (en) | 1992-09-16 |
US5320559A (en) | 1994-06-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |