KR910017604A - 반도체장치 - Google Patents

반도체장치 Download PDF

Info

Publication number
KR910017604A
KR910017604A KR1019910004027A KR910004027A KR910017604A KR 910017604 A KR910017604 A KR 910017604A KR 1019910004027 A KR1019910004027 A KR 1019910004027A KR 910004027 A KR910004027 A KR 910004027A KR 910017604 A KR910017604 A KR 910017604A
Authority
KR
South Korea
Prior art keywords
semiconductor device
chip
note
disclosed
different materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019910004027A
Other languages
English (en)
Korean (ko)
Inventor
마사키 오타
Original Assignee
아오이 죠이치
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이치, 가부시키가이샤 도시바 filed Critical 아오이 죠이치
Publication of KR910017604A publication Critical patent/KR910017604A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W70/481—
    • H10W72/00—
    • H10W72/07533—
    • H10W72/07552—
    • H10W72/07553—
    • H10W72/07555—
    • H10W72/527—
    • H10W72/5363—
    • H10W72/537—
    • H10W72/5449—
    • H10W72/5473—
    • H10W72/5475—
    • H10W72/552—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/557—
    • H10W72/59—
    • H10W72/926—
    • H10W72/932—
    • H10W72/952—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
KR1019910004027A 1990-03-15 1991-03-14 반도체장치 Withdrawn KR910017604A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP02-062789 1990-03-15
JP2062789A JPH0760839B2 (ja) 1990-03-15 1990-03-15 半導体装置

Publications (1)

Publication Number Publication Date
KR910017604A true KR910017604A (ko) 1991-11-05

Family

ID=13210467

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1019910004027A Withdrawn KR910017604A (ko) 1990-03-15 1991-03-14 반도체장치
KR2019950021529U Expired - Lifetime KR960000464Y1 (ko) 1990-03-15 1995-08-21 반도체장치(a semiconductor device)

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR2019950021529U Expired - Lifetime KR960000464Y1 (ko) 1990-03-15 1995-08-21 반도체장치(a semiconductor device)

Country Status (5)

Country Link
US (1) US5173762A (enExample)
EP (1) EP0446937B1 (enExample)
JP (1) JPH0760839B2 (enExample)
KR (2) KR910017604A (enExample)
DE (1) DE69119946T2 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3459291B2 (ja) * 1993-09-21 2003-10-20 ローム株式会社 半導体チップを備えた電子部品
US5644281A (en) * 1992-04-07 1997-07-01 Rohm Co., Ltd. Electronic component incorporating solder fuse wire
JPH06216307A (ja) * 1993-01-13 1994-08-05 Mitsubishi Electric Corp 樹脂封止型半導体装置
JP2807396B2 (ja) * 1993-05-25 1998-10-08 ローム株式会社 半導体装置
US5530284A (en) * 1995-03-06 1996-06-25 Motorola, Inc. Semiconductor leadframe structure compatible with differing bond wire materials
WO1998021751A2 (de) * 1996-11-11 1998-05-22 Siemens Aktiengesellschaft Optimierung der leistungsverbindung zwischen chip und leiterrahmen für leistungsschalter
US6476481B2 (en) 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
DE29924183U1 (de) 1998-05-05 2002-03-28 International Rectifier Corp., El Segundo, Calif. Gehäuse und Leitungsrahmen für ein Halbleiterbauelement hoher Stromleitfähigkeit, mit großflächigen Verbindungsschlüssen und veränderter Form
CN1937223A (zh) * 2002-02-21 2007-03-28 松下电器产业株式会社 半导体装置
TW586203B (en) * 2002-11-04 2004-05-01 Siliconware Precision Industries Co Ltd Semiconductor package with lead frame as chip carrier and method for fabricating the same
JP2004281887A (ja) * 2003-03-18 2004-10-07 Himeji Toshiba Ep Corp リードフレーム及びそれを用いた電子部品
DE102005016830A1 (de) * 2004-04-14 2005-11-03 Denso Corp., Kariya Halbleitervorrichtung und Verfahren zu ihrer Herstellung
US8125060B2 (en) * 2006-12-08 2012-02-28 Infineon Technologies Ag Electronic component with layered frame
JP4830877B2 (ja) * 2007-01-31 2011-12-07 トヨタ自動車株式会社 半導体装置の製造方法
US8237268B2 (en) * 2007-03-20 2012-08-07 Infineon Technologies Ag Module comprising a semiconductor chip
JP5192163B2 (ja) * 2007-03-23 2013-05-08 住友電工デバイス・イノベーション株式会社 半導体装置
US8546904B2 (en) * 2011-07-11 2013-10-01 Transcend Information, Inc. Integrated circuit with temperature increasing element and electronic system having the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5716375Y2 (enExample) * 1975-04-02 1982-04-06
GB1478393A (en) * 1975-08-12 1977-06-29 Ferranti Ltd Methods of manufacturing semiconductor devices
JPS5821351A (ja) * 1981-07-30 1983-02-08 Toshiba Corp 半導体装置
US4845543A (en) * 1983-09-28 1989-07-04 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
JPS6396947A (ja) * 1986-10-13 1988-04-27 Mitsubishi Electric Corp 半導体装置用リ−ドフレ−ム
EP0288776A3 (en) * 1987-04-28 1989-03-22 Texas Instruments Incorporated Gold alloy wire connection to copper doped aluminum semiconductor circuit interconnection bonding pad
JPS6459947A (en) * 1987-08-31 1989-03-07 Toshiba Corp Semiconductor device
MY104152A (en) * 1988-08-12 1994-02-28 Mitsui Chemicals Inc Processes for producing semiconductor devices.
IT1233008B (it) * 1989-09-21 1992-03-14 Sgs Thomson Microelectronics Dispositivo integrato con connessioni perfezionate fra i terminali e la piastrina di materiale semiconduttore integrante componenti elettronici
JPH03157448A (ja) * 1989-11-15 1991-07-05 Mitsubishi Electric Corp 半導体封止用エポキシ樹脂組成物

Also Published As

Publication number Publication date
DE69119946T2 (de) 1996-11-28
EP0446937A2 (en) 1991-09-18
DE69119946D1 (de) 1996-07-11
US5173762A (en) 1992-12-22
JPH0760839B2 (ja) 1995-06-28
JPH03265149A (ja) 1991-11-26
KR960000464Y1 (ko) 1996-01-10
EP0446937B1 (en) 1996-06-05
EP0446937A3 (enExample) 1994-02-02

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St.27 status event code: A-0-1-A10-A12-nap-PA0109

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R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

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St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

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E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

PC1205 Withdrawal of application forming a basis of a converted application

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WICV Withdrawal of application forming a basis of a converted application
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PN2301 Change of applicant

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St.27 status event code: A-3-3-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

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