KR910016813A - 4,4'-비스(p-아미노페녹시)비페닐 및 실옥산 디아민 잔기를 함유하는 폴리이미드 공중합체 - Google Patents

4,4'-비스(p-아미노페녹시)비페닐 및 실옥산 디아민 잔기를 함유하는 폴리이미드 공중합체 Download PDF

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KR910016813A
KR910016813A KR1019910003641A KR910003641A KR910016813A KR 910016813 A KR910016813 A KR 910016813A KR 1019910003641 A KR1019910003641 A KR 1019910003641A KR 910003641 A KR910003641 A KR 910003641A KR 910016813 A KR910016813 A KR 910016813A
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bis
polyimide
dianhydride
composition
polyamic acid
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KR1019910003641A
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KR100217451B1 (ko
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제이 버저스 마빈
알렌 바르고브스키 데이비드
마리 팔카 아그네스
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랄프 찰스 메드허스트
아모코 코포레이션
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Silicon Polymers (AREA)
  • Formation Of Insulating Films (AREA)
  • Laminated Bodies (AREA)

Abstract

내용 없음

Description

4,4'-비스(p-아미노페녹시)비페닐 및 실옥산 디아민 잔기를 함유하는 폴리이미드 공중합체
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (14)

  1. 하기의 반복 단위(Ⅰ)를 함유하는 폴리이미드 조성물.
    상기식에서, Ar은 적어도 하나의 4가 방향족 핵이고, R은 2가 탄화수소 라디칼이며, R1은 1가 탄화수소 라디칼이고, m 및 n은 각각 1이상이며, X는 1내지 약 50이다.
  2. 제1항에 있어서, Ar이 하기의 그룹으로부터 선택되는 적어도 하나의 방향족 핵 또는 이의 배합물인 폴리이미드 조성물.
    및
  3. 제1항에 있어서, Ar이 하기 그룹인 폴리이미드 조성물.
  4. 제1항에 있어서, Ar이 하기 그룹인 폴리이미드 조성물.
  5. 제1항에 있어서, Ar이 하기 그룹인 폴리이미드 조성물.
  6. 제1항의 폴리이미드 조성물층 하나 이상의 피복된 기질구조물.
  7. 제1항의 중합체를 함유하는 폴리이미드용액.
  8. 하기의 반복단위(Ⅱ)를 함유하는 폴리암 산 조성물.
    상기식에서, Ar은 적어도 하나의 4가 방향족 핵이고, R은 2가 탄화수소 라디칼이며, R1은 1가 탄화수소 라디칼이고, r 및 s는 1이상이며, y는 1내지 약 50이고, R2및 R3는 독립적으로 할로겐, -OH, 및 -OR4로부터 선택되며, R4는 탄소수 1내지 4의 알킬그룹이다.
  9. 제8항의 폴리암산 조성물을 함유하는 폴리암산 용액.
  10. 제8항의 폴리암산 조성물중 하나 이상으로 피복된 기질.
  11. 4,4'-비스(p-아미노페녹시)비페닐 잔기, 실옥산 디아민 잔기, 및 적어도 하나의 이무수물 잔기를 반응시켜 제조한 폴리이미드 조성물.
  12. 제11항에 있어서, 이무수물 잔기가 비스(3,4-카복시페닐)설폰 이무수물(SPAN), 2,2-비스(3,4-디카복시페닐)프로판이무수물(IPAN), 및 비스-(3,4-디카복실페닐)에테르이무수물(OPAN)로 이루어진 그룹으로부터 선택된 폴리이미드.
  13. 제1항의 폴리이미드 조성물층 하나 이상으로 피복시킨 기질을 하나이상 함유하는 다중층 구조물.
  14. 제8항의 폴리암산 조성물층 하나 이상으로 피복시킨 기질을 하나이상 함유하는 다중층 구조물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910003641A 1990-03-09 1991-03-07 4,4'-비스(p-아미노페녹시)비페닐 잔기와 실록산 디아민 잔기를 함유하는 폴리이미드 공중합체 KR100217451B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US491,436 1990-03-09
US07/491,436 US4960846A (en) 1990-03-09 1990-03-09 Polyimide copolymers containing 4,4'-bis(p-aminophenoxy)biphenyl and siloxane diamine moieties

Publications (2)

Publication Number Publication Date
KR910016813A true KR910016813A (ko) 1991-11-05
KR100217451B1 KR100217451B1 (ko) 1999-09-01

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Country Status (8)

Country Link
US (1) US4960846A (ko)
EP (1) EP0448252B1 (ko)
JP (1) JP3079113B2 (ko)
KR (1) KR100217451B1 (ko)
CA (1) CA2037103C (ko)
DE (1) DE69105319T2 (ko)
MX (1) MX172257B (ko)
MY (1) MY107188A (ko)

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US5209981A (en) * 1991-06-13 1993-05-11 Occidental Chemical Corporation Polyimidesiloxane extended block copolymers
US5300627A (en) * 1991-10-17 1994-04-05 Chisso Corporation Adhesive polyimide film
US5922167A (en) * 1997-01-16 1999-07-13 Occidential Chemical Corporation Bending integrated circuit chips
US6159666A (en) * 1998-01-14 2000-12-12 Fijitsu Limited Environmentally friendly removal of photoresists used in wet etchable polyimide processes
US6156820A (en) * 1998-12-28 2000-12-05 Occidental Chemical Corporation Polyamideimidesiloxane hot melt adhesive
DE10008121B4 (de) * 2000-02-22 2006-03-09 Saehan Micronics Inc. Verfahren zur Herstellung von Polyamidsäure und Polyimid und Haft- oder Klebemittel, das aus der oder dem so hergestellten Polyamidsäure oder Polyimid besteht
KR100417083B1 (ko) * 2001-02-12 2004-02-05 주식회사 엘지화학 폴리이미드계 공중합체
JP5245474B2 (ja) * 2008-03-14 2013-07-24 信越化学工業株式会社 スクリーン印刷用樹脂組成物
JP5891693B2 (ja) * 2011-10-05 2016-03-23 Jsr株式会社 基板の製造方法および基板
JP5846136B2 (ja) * 2013-01-31 2016-01-20 富士ゼロックス株式会社 ポリイミド前駆体組成物、及びポリイミド前駆体組成物の製造方法
EP2997595B1 (en) * 2013-05-16 2020-11-18 National Institute Of Aerospace Associates Method of forming a radiation hardened microelectronic chip package
WO2015023312A2 (en) * 2013-05-16 2015-02-19 National Institute Of Aerospace Associates Radiation hardened microelectronic chip packaging technology
JP6413434B2 (ja) 2014-07-25 2018-10-31 富士ゼロックス株式会社 ポリイミド前駆体組成物、ポリイミド前駆体の製造方法、ポリイミド成形体、及びポリイミド成形体の製造方法

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JPH0768347B2 (ja) * 1985-09-25 1995-07-26 株式会社日立製作所 有機ケイ素末端ポリイミド前駆体とポリイミドの製造方法
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JP3079113B2 (ja) 2000-08-21
DE69105319T2 (de) 1995-04-06
EP0448252A1 (en) 1991-09-25
DE69105319D1 (de) 1995-01-12
KR100217451B1 (ko) 1999-09-01
MY107188A (en) 1995-09-30
CA2037103C (en) 1995-09-12
US4960846A (en) 1990-10-02
MX172257B (es) 1993-12-09
EP0448252B1 (en) 1994-11-30
CA2037103A1 (en) 1991-09-10
JPH04220430A (ja) 1992-08-11

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