KR910014207A - 박리 강도가 높은 구리 피복된 폴리에테르이미드 라미네이트 - Google Patents

박리 강도가 높은 구리 피복된 폴리에테르이미드 라미네이트 Download PDF

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Publication number
KR910014207A
KR910014207A KR1019910000589A KR910000589A KR910014207A KR 910014207 A KR910014207 A KR 910014207A KR 1019910000589 A KR1019910000589 A KR 1019910000589A KR 910000589 A KR910000589 A KR 910000589A KR 910014207 A KR910014207 A KR 910014207A
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South Korea
Prior art keywords
polyetherimide
range
resol
adhesive
formaldehyde
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KR1019910000589A
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English (en)
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에스텔 트레이시 제임스
토마스 바톨로뮤 존
Original Assignee
아더 엠. 킹
제너럴 일렉트릭 캄파니
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Publication of KR910014207A publication Critical patent/KR910014207A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
    • C08J5/125—Adhesives in organic diluents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31688—Next to aldehyde or ketone condensation product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

내용 없음

Description

박리 강도가 높은 구리 피복된 폴리에테르이미드 라미네이트
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (14)

  1. 금속 호일 표면을, 폴리비닐, 부티랄, 레졸 수지 및 유기 용매를 포함하는 접착제 조성물로 피복시키고, 접착제에 의해 피복된 호일 표면을 폴리에테르이미드시트 표면과 접촉시키고, 접착제에 의해 결합된 두 표면에 약 450℉ 내지 550℉ 범위의 열 및 약 100 내지 700psi 범위의 압력을 가함을 특징으로하여, 폴리에테르이미드시트에 금속 호일 표면을 라미네이팅(laminating)시키는 방법.
  2. 제1항에 있어서, 라미네이트 금속 호일 박리 강도가 6ℓb/in폭 이상인 방법.
  3. 제1항에 있어서, 접착제 조성물이 레졸 수지의 혼합물을 포함하는 방법.
  4. 제1항에 있어서, 레졸 수지가 바륨 촉매를 사용하여 페놀과 포름알데하이드로부터 제형화되는 방법.
  5. 제1항에 있어서, 레졸 수지가 수산화 암모늄 촉매를 사용하여 페놀, 크레실산 및 포름알데하디드로부터 제형화되는 방법.
  6. 제3항에 있어서, 레졸 수지가 바륨 촉매를 사용하여 페놀과 포름알데하이드로부터 제조된 레졸 및 수산화 암모늄 촉매를 사용하여 페놀, 크레실산과 포름알데하디드로부터 제조된 레졸을 포함하는 방법.
  7. 제6항에 있어서, 접착제의 비휘발성 고체 성분이 약 15 내지 17중량%인 방법.
  8. 제1항에 있어서, 사용되는 열의 온도가 약 480℉ 내지 530℉ 범위이고, 사용되는 압력이 약 200 내지 400psi 범위인 방법.
  9. 제1항에 있어서, 접착제 피복된 호일이 폴리에테르이미드 시트의 양쪽면에 피복되는 방법.
  10. 제9항에 있어서, 더블 호일 라미네이트화 폴리에테르이미드 시트의 두께가 약 0.063 내지 0.073in범위인 방법.
  11. 제1항에 있어서, 폴리비닐 부티랄 수지의 중량 평균 분자량이 약 180,000 내지 20,000 범위인 방법.
  12. 제1항에 있어서, 접착제 조성물의 고체 함량이 49 내지 51중량%가 되도록 용매의 비율을 조정하는 방법.
  13. 제1항의 방법에 따라 제조된 호일 라미네이트화 폴리에테르이미드.
  14. 제10항의 방법에 따라 제조된 호일 라미네이트화 폴리에테르이미드.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910000589A 1990-01-16 1991-01-16 박리 강도가 높은 구리 피복된 폴리에테르이미드 라미네이트 KR910014207A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US464,819 1990-01-16
US07/464,819 US5364703A (en) 1990-01-16 1990-01-16 Copper-clad polyetherimide laminates with high peel strength

Publications (1)

Publication Number Publication Date
KR910014207A true KR910014207A (ko) 1991-08-31

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ID=23845360

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910000589A KR910014207A (ko) 1990-01-16 1991-01-16 박리 강도가 높은 구리 피복된 폴리에테르이미드 라미네이트

Country Status (4)

Country Link
US (1) US5364703A (ko)
EP (1) EP0439828A3 (ko)
JP (1) JPH04211941A (ko)
KR (1) KR910014207A (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2720683B1 (fr) * 1994-06-02 1996-07-05 Saint Gobain Vitrage Film intercalaire résistant au feu et son utilisation dans un verre feuilleté.
US6150036A (en) * 1996-07-08 2000-11-21 Azon Corporation Universal ink jet drafting film
EP0989172A1 (en) * 1998-09-24 2000-03-29 Hitachi Chemical Co., Ltd. Adhesive composition for metal foil, adhesive-coated metal foil, metal clad laminate and related materials using the same
EP1627901B1 (en) 2003-05-21 2020-02-19 Hitachi Chemical Co., Ltd. Primer, conductor foil with resin, laminate and process for producing the laminate
TWI243751B (en) * 2003-10-21 2005-11-21 Park Electrochemical Corp Laminates having a low dielectric, low dissipation factor bond core and method of making same
US20070190882A1 (en) * 2006-02-13 2007-08-16 General Electric Laminate and method
US20080118730A1 (en) * 2006-11-22 2008-05-22 Ta-Hua Yu Biaxially oriented film, laminates made therefrom, and method
WO2016055926A1 (en) * 2014-10-10 2016-04-14 Sabic Global Technologies B.V. Polyetherimide varnish compositions, methods of manufacture, and articles prepared therefrom
US20220348803A1 (en) * 2019-11-01 2022-11-03 Sumitomo Bakelite Co., Ltd. Adhesive agent composition for wet-type friction member

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3450595A (en) * 1964-09-08 1969-06-17 Formica Int Metal-clad laminates
JPS59218789A (ja) * 1983-05-06 1984-12-10 信越化学工業株式会社 フレキシブルプリント配線基板およびその製造方法
US4626474A (en) * 1985-06-21 1986-12-02 Stauffer Chemical Company Polyimide film/metal foil lamination
JPS62127239A (ja) * 1985-11-27 1987-06-09 東洋アルミニウム株式会社 フレキシブルプリント回路用基板
JP2527166B2 (ja) * 1986-09-27 1996-08-21 住友ベークライト株式会社 接着剤層を有するポリエ−テルイミドフイルム
US4927742A (en) * 1987-01-14 1990-05-22 Kollmorgen Corporation Multilayer printed wiring boards
JPH01108799A (ja) * 1987-10-22 1989-04-26 Nitto Boseki Co Ltd 熱可塑性樹脂成形体及びその製造方法

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EP0439828A2 (en) 1991-08-07
EP0439828A3 (en) 1992-01-08
JPH04211941A (ja) 1992-08-03
US5364703A (en) 1994-11-15

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