KR910009991B1 - 형광표시관 및 그의 제조방법 - Google Patents

형광표시관 및 그의 제조방법 Download PDF

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Publication number
KR910009991B1
KR910009991B1 KR1019880003839A KR880003839A KR910009991B1 KR 910009991 B1 KR910009991 B1 KR 910009991B1 KR 1019880003839 A KR1019880003839 A KR 1019880003839A KR 880003839 A KR880003839 A KR 880003839A KR 910009991 B1 KR910009991 B1 KR 910009991B1
Authority
KR
South Korea
Prior art keywords
bonding pad
substrate
die
die bond
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019880003839A
Other languages
English (en)
Korean (ko)
Other versions
KR880013211A (ko
Inventor
데루오 와다나베
다쯔오 야마우라
Original Assignee
후다바덴시 고오교오 가부시끼가이샤
호소야 레이지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후다바덴시 고오교오 가부시끼가이샤, 호소야 레이지 filed Critical 후다바덴시 고오교오 가부시끼가이샤
Publication of KR880013211A publication Critical patent/KR880013211A/ko
Application granted granted Critical
Publication of KR910009991B1 publication Critical patent/KR910009991B1/ko
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J17/00—Gas-filled discharge tubes with solid cathode
    • H01J17/38—Cold-cathode tubes
    • H01J17/48—Cold-cathode tubes with more than one cathode or anode, e.g. sequence-discharge tube, counting tube, dekatron
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J31/00—Cathode ray tubes; Electron beam tubes
    • H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
    • H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
    • H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
    • H01J31/15—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen with ray or beam selectively directed to luminescent anode segments
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H10W72/387—Flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
  • Die Bonding (AREA)
KR1019880003839A 1987-04-06 1988-04-06 형광표시관 및 그의 제조방법 Expired KR910009991B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1987050987U JPH0545009Y2 (enExample) 1987-04-06 1987-04-06
JP62-50987 1987-04-06

Publications (2)

Publication Number Publication Date
KR880013211A KR880013211A (ko) 1988-11-30
KR910009991B1 true KR910009991B1 (ko) 1991-12-09

Family

ID=12874148

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880003839A Expired KR910009991B1 (ko) 1987-04-06 1988-04-06 형광표시관 및 그의 제조방법

Country Status (3)

Country Link
US (1) US4835445A (enExample)
JP (1) JPH0545009Y2 (enExample)
KR (1) KR910009991B1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2639211B2 (ja) * 1990-11-07 1997-08-06 日本電気株式会社 蛍光表示パネル
US5346748A (en) * 1992-01-08 1994-09-13 Nec Corporation Fluorescent display panel containing chip of integrated circuit with discrepancy markers to aid in lead bonding
US5736814A (en) * 1995-09-06 1998-04-07 Ise Electronics Corporation Vacuum flourescent display apparatus
DE102004034166B4 (de) * 2003-07-17 2015-08-20 Toyoda Gosei Co., Ltd. Lichtemittierende Vorrichtung
JP5066333B2 (ja) * 2005-11-02 2012-11-07 シチズン電子株式会社 Ｌｅｄ発光装置。
JP5058741B2 (ja) * 2007-09-27 2012-10-24 双葉電子工業株式会社 蛍光表示管
JP4567041B2 (ja) * 2007-09-28 2010-10-20 双葉電子工業株式会社 車載用蛍光表示管及びその製造方法
DE102012201935A1 (de) * 2012-02-09 2013-08-14 Robert Bosch Gmbh Verbindungsanordnung eines elektrischen und/oder elektronischen Bauelements
CN112530878A (zh) * 2019-09-18 2021-03-19 深圳市中光工业技术研究院 用于焊接电子元器件的基底及其制备方法、半导体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5885341U (ja) * 1981-12-07 1983-06-09 日本電気株式会社 印刷基板
JPS60208886A (ja) * 1984-03-31 1985-10-21 株式会社東芝 電子部品の製造方法
JPS6178127A (ja) * 1984-09-26 1986-04-21 Toshiba Corp 薄膜配線基板
US4774434A (en) * 1986-08-13 1988-09-27 Innovative Products, Inc. Lighted display including led's mounted on a flexible circuit board
JPH06122946A (ja) * 1992-08-25 1994-05-06 Nippon Steel Corp 耐粒界腐食性に優れたオーステナイト系ステンレス鋼
JPH06155847A (ja) * 1992-11-20 1994-06-03 Oki Electric Ind Co Ltd プリンタ装置
JPH06250984A (ja) * 1993-02-23 1994-09-09 Hitachi Ltd 分散処理システム

Also Published As

Publication number Publication date
US4835445A (en) 1989-05-30
JPH0545009Y2 (enExample) 1993-11-16
KR880013211A (ko) 1988-11-30
JPS63159261U (enExample) 1988-10-18

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