KR910009249B1 - 제1철 자석의 극판을 스퍼어터링하기 위한 자전관 음극 - Google Patents

제1철 자석의 극판을 스퍼어터링하기 위한 자전관 음극 Download PDF

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Publication number
KR910009249B1
KR910009249B1 KR1019840007652A KR840007652A KR910009249B1 KR 910009249 B1 KR910009249 B1 KR 910009249B1 KR 1019840007652 A KR1019840007652 A KR 1019840007652A KR 840007652 A KR840007652 A KR 840007652A KR 910009249 B1 KR910009249 B1 KR 910009249B1
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South Korea
Prior art keywords
pole
magnet
sputtering
pole plate
plate
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Expired
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KR1019840007652A
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English (en)
Korean (ko)
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KR850005004A (ko
Inventor
아아첼트 한스
키이젤 좰그
쿠크라 라이넬
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레이볼드 앗크티엔게젤샤프트
아이첼트, 오싱
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Publication of KR850005004A publication Critical patent/KR850005004A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3441—Dark space shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Thin Magnetic Films (AREA)
KR1019840007652A 1983-12-05 1984-12-04 제1철 자석의 극판을 스퍼어터링하기 위한 자전관 음극 Expired KR910009249B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP3343904.4 1983-12-05
DE3343904 1983-12-05

Publications (2)

Publication Number Publication Date
KR850005004A KR850005004A (ko) 1985-08-19
KR910009249B1 true KR910009249B1 (ko) 1991-11-07

Family

ID=6216066

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840007652A Expired KR910009249B1 (ko) 1983-12-05 1984-12-04 제1철 자석의 극판을 스퍼어터링하기 위한 자전관 음극

Country Status (6)

Country Link
US (1) US4572776A (enExample)
EP (1) EP0144572B1 (enExample)
JP (1) JPS60138070A (enExample)
KR (1) KR910009249B1 (enExample)
AT (1) ATE47504T1 (enExample)
DE (1) DE3480245D1 (enExample)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0689443B2 (ja) * 1984-11-14 1994-11-09 株式会社日立製作所 スパツタリング用タ−ゲツト
KR900001825B1 (ko) * 1984-11-14 1990-03-24 가부시끼가이샤 히다찌세이사꾸쇼 성막 지향성을 고려한 스퍼터링장치
DE3527626A1 (de) * 1985-08-01 1987-02-05 Leybold Heraeus Gmbh & Co Kg Zerstaeubungskatode nach dem magnetronprinzip
DE3601439C1 (de) * 1986-01-20 1987-04-09 Glyco Metall Werke Schichtverbundwerkstoff,insbesondere fuer Gleit- und Reibelemente,sowie Verfahren zu seiner Herstellung
US4855033A (en) * 1986-04-04 1989-08-08 Materials Research Corporation Cathode and target design for a sputter coating apparatus
CA1308060C (en) * 1986-04-04 1992-09-29 Tokyo Electron Limited Cathode and target design for a sputter coating apparatus
DE3624150C2 (de) * 1986-07-17 1994-02-24 Leybold Ag Zerstäubungskatode nach dem Magnetronprinzip
JPH07107188B2 (ja) * 1986-09-12 1995-11-15 松下電器産業株式会社 スパッタリングターゲット
DE3810175A1 (de) * 1988-03-25 1989-10-05 Elektronische Anlagen Gmbh Kathodenzerstaeubungsvorrichtung
US4892633A (en) * 1988-11-14 1990-01-09 Vac-Tec Systems, Inc. Magnetron sputtering cathode
US4865708A (en) * 1988-11-14 1989-09-12 Vac-Tec Systems, Inc. Magnetron sputtering cathode
JPH02194171A (ja) * 1989-01-20 1990-07-31 Ulvac Corp マグネトロンスパッタリング源
JPH02243761A (ja) * 1989-03-15 1990-09-27 Ulvac Corp マグネトロンスパッタリング源用電磁石の制御方法
DE4018914C1 (enExample) * 1990-06-13 1991-06-06 Leybold Ag, 6450 Hanau, De
US5080772A (en) * 1990-08-24 1992-01-14 Materials Research Corporation Method of improving ion flux distribution uniformity on a substrate
DE4120690A1 (de) * 1991-06-22 1992-12-24 Leybold Ag Targetvorrichtung aus ferromagnetischem material fuer eine magnetron-elektrode
US5174880A (en) * 1991-08-05 1992-12-29 Hmt Technology Corporation Magnetron sputter gun target assembly with distributed magnetic field
DE4135939A1 (de) * 1991-10-31 1993-05-06 Leybold Ag, 6450 Hanau, De Zerstaeubungskathode
US5407551A (en) * 1993-07-13 1995-04-18 The Boc Group, Inc. Planar magnetron sputtering apparatus
DE19648390A1 (de) * 1995-09-27 1998-05-28 Leybold Materials Gmbh Target für die Sputterkathode einer Vakuumbeschichtungsanlage
JP3886209B2 (ja) * 1997-06-02 2007-02-28 貞夫 門倉 対向ターゲット式スパッタ装置
US6432286B1 (en) * 1998-06-10 2002-08-13 David A. Glocker Conical sputtering target
US6235170B1 (en) * 1998-06-10 2001-05-22 David A. Glocker Conical sputtering target
US6224725B1 (en) * 1999-02-09 2001-05-01 Isoflux, Inc. Unbalanced magnetron sputtering with auxiliary cathode
US6359388B1 (en) 2000-08-28 2002-03-19 Guardian Industries Corp. Cold cathode ion beam deposition apparatus with segregated gas flow
US6783638B2 (en) * 2001-09-07 2004-08-31 Sputtered Films, Inc. Flat magnetron
GB0126721D0 (en) * 2001-11-07 2002-01-02 Bellido Gonzalez V Ferromagnetic magnetron
US6988463B2 (en) * 2002-10-18 2006-01-24 Guardian Industries Corp. Ion beam source with gas introduced directly into deposition/vacuum chamber
US6812648B2 (en) 2002-10-21 2004-11-02 Guardian Industries Corp. Method of cleaning ion source, and corresponding apparatus/system
EA201101662A1 (ru) * 2006-07-13 2012-05-30 Тиэр Коутингз Лимитед Устройство для нанесения покрытий и способ нанесения покрытий
JP5265149B2 (ja) 2006-07-21 2013-08-14 アプライド マテリアルズ インコーポレイテッド マルチカソード設計用冷却暗部シールド
US20080083611A1 (en) * 2006-10-06 2008-04-10 Tegal Corporation High-adhesive backside metallization
EP2162899B1 (en) * 2007-06-15 2015-01-21 Oerlikon Advanced Technologies AG Multitarget sputter source and method for the deposition of multi-layers
US8808513B2 (en) * 2008-03-25 2014-08-19 Oem Group, Inc Stress adjustment in reactive sputtering
US20090246385A1 (en) * 2008-03-25 2009-10-01 Tegal Corporation Control of crystal orientation and stress in sputter deposited thin films
US20100018857A1 (en) * 2008-07-23 2010-01-28 Seagate Technology Llc Sputter cathode apparatus allowing thick magnetic targets
US8482375B2 (en) * 2009-05-24 2013-07-09 Oem Group, Inc. Sputter deposition of cermet resistor films with low temperature coefficient of resistance
TWI338721B (en) * 2009-10-16 2011-03-11 Suntek Prec Corp A sputtering apparatus with a side target and a method for sputtering a workpiece having non-planer surfaces
JP5853487B2 (ja) * 2010-08-19 2016-02-09 東レ株式会社 放電電極及び放電方法
US8575565B2 (en) 2011-10-10 2013-11-05 Guardian Industries Corp. Ion source apparatus and methods of using the same
DE102013112861B4 (de) * 2013-01-15 2018-11-15 VON ARDENNE Asset GmbH & Co. KG Magnetronanordnung und Target für eine Magnetronanordnung
US9328410B2 (en) 2013-10-25 2016-05-03 First Solar, Inc. Physical vapor deposition tile arrangement and physical vapor deposition arrangement
TWI618809B (zh) * 2016-08-31 2018-03-21 Linco Technology Co Ltd 具高靶材利用率之磁性靶材陰極裝置
CN111996504A (zh) * 2020-07-10 2020-11-27 包头稀土研究院 铁磁性靶材磁控溅射装置
CN111996505B (zh) * 2020-07-10 2023-07-14 包头稀土研究院 磁控溅射铁磁性靶材的装置
CN114574830B (zh) * 2022-03-11 2024-03-26 陕西理工大学 用于磁控溅射靶阴极的磁铁布置结构
PL4283011T3 (pl) * 2022-05-26 2024-11-12 Instytut Fizyki Polskiej Akademii Nauk Urządzenie do rozpylania magnetronowego z targetu

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4198283A (en) * 1978-11-06 1980-04-15 Materials Research Corporation Magnetron sputtering target and cathode assembly
US4299678A (en) * 1979-07-23 1981-11-10 Spin Physics, Inc. Magnetic target plate for use in magnetron sputtering of magnetic films
JPS5893872A (ja) * 1981-11-30 1983-06-03 Anelva Corp スパツタリング装置
US4391697A (en) * 1982-08-16 1983-07-05 Vac-Tec Systems, Inc. High rate magnetron sputtering of high permeability materials
US4414086A (en) * 1982-11-05 1983-11-08 Varian Associates, Inc. Magnetic targets for use in sputter coating apparatus

Also Published As

Publication number Publication date
EP0144572A2 (de) 1985-06-19
KR850005004A (ko) 1985-08-19
US4572776A (en) 1986-02-25
ATE47504T1 (de) 1989-11-15
JPS60138070A (ja) 1985-07-22
JPH0373633B2 (enExample) 1991-11-22
DE3480245D1 (en) 1989-11-23
EP0144572B1 (de) 1989-10-18
EP0144572A3 (en) 1986-07-30

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