PL4283011T3 - Urządzenie do rozpylania magnetronowego z targetu - Google Patents

Urządzenie do rozpylania magnetronowego z targetu

Info

Publication number
PL4283011T3
PL4283011T3 PL22461556.7T PL22461556T PL4283011T3 PL 4283011 T3 PL4283011 T3 PL 4283011T3 PL 22461556 T PL22461556 T PL 22461556T PL 4283011 T3 PL4283011 T3 PL 4283011T3
Authority
PL
Poland
Prior art keywords
sputtering target
magnetron device
magnetron
sputtering
target
Prior art date
Application number
PL22461556.7T
Other languages
English (en)
Inventor
Krzysztof Fronc
Michał Chojnacki
Andreas Glenz
Original Assignee
Instytut Fizyki Polskiej Akademii Nauk
Prevac Spółka Z Ograniczoną Odpowiedzialnością
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Instytut Fizyki Polskiej Akademii Nauk, Prevac Spółka Z Ograniczoną Odpowiedzialnością filed Critical Instytut Fizyki Polskiej Akademii Nauk
Publication of PL4283011T3 publication Critical patent/PL4283011T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
PL22461556.7T 2022-05-26 2022-05-26 Urządzenie do rozpylania magnetronowego z targetu PL4283011T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP22461556.7A EP4283011B1 (en) 2022-05-26 2022-05-26 Magnetron device for sputtering target

Publications (1)

Publication Number Publication Date
PL4283011T3 true PL4283011T3 (pl) 2024-11-12

Family

ID=82100407

Family Applications (1)

Application Number Title Priority Date Filing Date
PL22461556.7T PL4283011T3 (pl) 2022-05-26 2022-05-26 Urządzenie do rozpylania magnetronowego z targetu

Country Status (2)

Country Link
EP (1) EP4283011B1 (pl)
PL (1) PL4283011T3 (pl)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5952957B2 (ja) * 1980-06-16 1984-12-22 日電アネルバ株式会社 マグネトロン型スパッタ装置のカソ−ド部
EP0054619A1 (de) 1980-12-22 1982-06-30 GebràœDer Sulzer Aktiengesellschaft Servomotor mit Differentialkolben
DE3331406A1 (de) * 1983-08-31 1985-03-14 Leybold-Heraeus GmbH, 5000 Köln Zerstaeubungskatode
DE3429988A1 (de) * 1983-12-05 1985-06-13 Leybold-Heraeus GmbH, 5000 Köln Magnetronkatode zum zerstaeuben ferromagnetischer targets
ATE47504T1 (de) * 1983-12-05 1989-11-15 Leybold Ag Magnetronkatode zum zerstaeuben ferromagnetischer targets.
JPS6338576A (ja) * 1986-08-01 1988-02-19 Anelva Corp スパツタリング装置
JPH05295537A (ja) * 1992-04-23 1993-11-09 Kobe Steel Ltd コバルト合金スパッタリングターゲット材料
PL234256B1 (pl) * 2016-03-21 2020-01-31 Inst Fizyki Polskiej Akademii Nauk Sposób wytwarzania cienkich warstw stopów metali z galem metodą rozpylania magnetronowego

Also Published As

Publication number Publication date
EP4283011B1 (en) 2024-08-21
EP4283011A1 (en) 2023-11-29

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