KR910007380B1 - 투광성 전도박막 침착장치 및 방법 - Google Patents
투광성 전도박막 침착장치 및 방법 Download PDFInfo
- Publication number
- KR910007380B1 KR910007380B1 KR1019830005817A KR830005817A KR910007380B1 KR 910007380 B1 KR910007380 B1 KR 910007380B1 KR 1019830005817 A KR1019830005817 A KR 1019830005817A KR 830005817 A KR830005817 A KR 830005817A KR 910007380 B1 KR910007380 B1 KR 910007380B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- depositing
- combustion chamber
- metal
- metal material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000151 deposition Methods 0.000 title claims description 91
- 238000000034 method Methods 0.000 title claims description 48
- 239000010409 thin film Substances 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 claims description 110
- 239000010408 film Substances 0.000 claims description 61
- 230000008021 deposition Effects 0.000 claims description 57
- 239000000463 material Substances 0.000 claims description 45
- 238000002485 combustion reaction Methods 0.000 claims description 41
- 239000007769 metal material Substances 0.000 claims description 36
- 239000004065 semiconductor Substances 0.000 claims description 33
- 229910044991 metal oxide Inorganic materials 0.000 claims description 28
- 150000004706 metal oxides Chemical class 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 14
- 239000001301 oxygen Substances 0.000 claims description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
- 229910052760 oxygen Inorganic materials 0.000 claims description 13
- 229910052718 tin Inorganic materials 0.000 claims description 12
- 229910052738 indium Inorganic materials 0.000 claims description 11
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 11
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 9
- 229910001882 dioxygen Inorganic materials 0.000 claims description 8
- 229910001220 stainless steel Inorganic materials 0.000 claims description 8
- 239000010935 stainless steel Substances 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 239000011701 zinc Substances 0.000 claims description 6
- 238000000427 thin-film deposition Methods 0.000 claims description 5
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 claims description 4
- 239000000088 plastic resin Substances 0.000 claims description 4
- -1 candium Chemical compound 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims 1
- 238000007736 thin film deposition technique Methods 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 7
- 125000004429 atom Chemical group 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052787 antimony Inorganic materials 0.000 description 5
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 4
- 125000004430 oxygen atom Chemical group O* 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 229910006404 SnO 2 Inorganic materials 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 3
- 239000012799 electrically-conductive coating Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical group [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 229910000979 O alloy Inorganic materials 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000012789 electroconductive film Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000002784 hot electron Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- OTLGFUHTYPXTTG-UHFFFAOYSA-M indium(3+);oxygen(2-);hydroxide Chemical compound [OH-].[O-2].[In+3] OTLGFUHTYPXTTG-UHFFFAOYSA-M 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002687 intercalation Effects 0.000 description 1
- 238000009830 intercalation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/138—Manufacture of transparent electrodes, e.g. transparent conductive oxides [TCO] or indium tin oxide [ITO] electrodes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/10—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
- H10F71/107—Continuous treatment of the devices, e.g. roll-to roll processes or multi-chamber deposition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Photovoltaic Devices (AREA)
- Manufacturing Of Electric Cables (AREA)
- Physical Vapour Deposition (AREA)
- Non-Insulated Conductors (AREA)
- Electrodes Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/448,139 US4605565A (en) | 1982-12-09 | 1982-12-09 | Method of depositing a highly conductive, highly transmissive film |
| US448,139 | 1982-12-09 | ||
| US448139 | 1982-12-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR850003480A KR850003480A (ko) | 1985-06-17 |
| KR910007380B1 true KR910007380B1 (ko) | 1991-09-25 |
Family
ID=23779157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019830005817A Expired KR910007380B1 (ko) | 1982-12-09 | 1983-12-08 | 투광성 전도박막 침착장치 및 방법 |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US4605565A (enExample) |
| EP (1) | EP0112132B1 (enExample) |
| JP (1) | JPH0622202B2 (enExample) |
| KR (1) | KR910007380B1 (enExample) |
| AU (1) | AU564776B2 (enExample) |
| BR (1) | BR8306745A (enExample) |
| CA (1) | CA1219968A (enExample) |
| DE (1) | DE3379489D1 (enExample) |
| ES (2) | ES8505838A1 (enExample) |
| IN (1) | IN163675B (enExample) |
| MX (1) | MX155196A (enExample) |
| ZA (1) | ZA838885B (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4514437A (en) * | 1984-05-02 | 1985-04-30 | Energy Conversion Devices, Inc. | Apparatus for plasma assisted evaporation of thin films and corresponding method of deposition |
| US4639277A (en) * | 1984-07-02 | 1987-01-27 | Eastman Kodak Company | Semiconductor material on a substrate, said substrate comprising, in order, a layer of organic polymer, a layer of metal or metal alloy and a layer of dielectric material |
| DE3781990T2 (de) * | 1986-03-12 | 1993-02-18 | Murayama Yoichi | Kontinuierliche plattierungsanordnung eines schnell bewegenden films. |
| JPH0734332B2 (ja) * | 1986-03-12 | 1995-04-12 | 株式会社ト−ビ | 透明導電性フイルムの製造方法 |
| US4842705A (en) * | 1987-06-04 | 1989-06-27 | Siemens Aktiengesellschaft | Method for manufacturing transparent conductive indium-tin oxide layers |
| JP2686266B2 (ja) * | 1988-01-28 | 1997-12-08 | 株式会社日立製作所 | 受光素子の製造方法 |
| US5008215A (en) * | 1989-07-07 | 1991-04-16 | Industrial Technology Research Institute | Process for preparing high sensitivity semiconductive magnetoresistance element |
| DE69317035T2 (de) * | 1992-11-09 | 1998-06-10 | Chugai Ings Co | Herstellungsverfahren eines Kunststoffformkörpers mit elektromagnetischer Abschirmung |
| US5698262A (en) * | 1996-05-06 | 1997-12-16 | Libbey-Owens-Ford Co. | Method for forming tin oxide coating on glass |
| US6153271A (en) * | 1999-12-30 | 2000-11-28 | General Vacuum, Inc. | Electron beam evaporation of transparent indium tin oxide |
| KR20010078862A (ko) * | 2001-05-02 | 2001-08-22 | 조육형 | 산화물 증착 플라스틱 필름의 연속 열처리 방법 및 시스템 |
| EP1289025A1 (fr) * | 2001-08-30 | 2003-03-05 | Universite De Neuchatel | Procédé de dépot d'une couche d'oxyde sur un substrat et cellule photovoltaique utilisant ce substrat |
| ATE488614T1 (de) * | 2002-08-28 | 2010-12-15 | Moxtronics Inc | Hybridstrahl-beschichtungssystem und verfahren zur herstellung von zno-schichten |
| WO2004072329A1 (en) * | 2003-02-14 | 2004-08-26 | The University Of Hong Kong | Device for and method of generating ozone |
| US20070054158A1 (en) * | 2005-09-07 | 2007-03-08 | Ovshinsky Stanford R | Combination of photovoltaic devices and batteries which utilize a solid polymeric electrolyte |
| US9276142B2 (en) | 2010-12-17 | 2016-03-01 | First Solar, Inc. | Methods for forming a transparent oxide layer for a photovoltaic device |
| US8476105B2 (en) | 2010-12-22 | 2013-07-02 | General Electric Company | Method of making a transparent conductive oxide layer and a photovoltaic device |
| JP2014107421A (ja) * | 2012-11-28 | 2014-06-09 | Shimadzu Corp | 成膜装置、放射線検出器および放射線検出器の製造方法 |
| WO2015115237A1 (ja) * | 2014-01-28 | 2015-08-06 | 株式会社カネカ | 透明電極付き基板およびその製造方法 |
| RU2609764C1 (ru) * | 2015-10-26 | 2017-02-02 | Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский университет "Московский институт электронной техники" (МИЭТ) | Способ получения аморфных пленок халькогенидных стеклообразных полупроводников с эффектом фазовой памяти |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4170662A (en) * | 1974-11-05 | 1979-10-09 | Eastman Kodak Company | Plasma plating |
| US4342631A (en) * | 1980-06-16 | 1982-08-03 | Illinois Tool Works Inc. | Gasless ion plating process and apparatus |
| US4336277A (en) * | 1980-09-29 | 1982-06-22 | The Regents Of The University Of California | Transparent electrical conducting films by activated reactive evaporation |
| GB2085482B (en) * | 1980-10-06 | 1985-03-06 | Optical Coating Laboratory Inc | Forming thin film oxide layers using reactive evaporation techniques |
| US4417092A (en) * | 1981-03-16 | 1983-11-22 | Exxon Research And Engineering Co. | Sputtered pin amorphous silicon semi-conductor device and method therefor |
| JPS5880877A (ja) * | 1981-11-10 | 1983-05-16 | Konishiroku Photo Ind Co Ltd | 太陽電池及びその製造方法 |
-
1982
- 1982-12-09 US US06/448,139 patent/US4605565A/en not_active Expired - Lifetime
-
1983
- 1983-11-29 ZA ZA838885A patent/ZA838885B/xx unknown
- 1983-11-30 IN IN801/DEL/83A patent/IN163675B/en unknown
- 1983-12-06 ES ES527828A patent/ES8505838A1/es not_active Expired
- 1983-12-08 CA CA000442836A patent/CA1219968A/en not_active Expired
- 1983-12-08 KR KR1019830005817A patent/KR910007380B1/ko not_active Expired
- 1983-12-08 MX MX199667A patent/MX155196A/es unknown
- 1983-12-08 EP EP83307497A patent/EP0112132B1/en not_active Expired
- 1983-12-08 DE DE8383307497T patent/DE3379489D1/de not_active Expired
- 1983-12-08 BR BR8306745A patent/BR8306745A/pt unknown
- 1983-12-08 JP JP58232222A patent/JPH0622202B2/ja not_active Expired - Lifetime
- 1983-12-08 AU AU22231/83A patent/AU564776B2/en not_active Ceased
-
1985
- 1985-02-12 ES ES540320A patent/ES8700977A1/es not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| MX155196A (es) | 1988-02-01 |
| IN163675B (enExample) | 1988-10-29 |
| KR850003480A (ko) | 1985-06-17 |
| AU564776B2 (en) | 1987-08-27 |
| ES540320A0 (es) | 1986-11-16 |
| EP0112132A2 (en) | 1984-06-27 |
| CA1219968A (en) | 1987-03-31 |
| ES527828A0 (es) | 1985-06-16 |
| ES8700977A1 (es) | 1986-11-16 |
| JPS59117178A (ja) | 1984-07-06 |
| EP0112132B1 (en) | 1989-03-22 |
| EP0112132A3 (en) | 1985-07-03 |
| DE3379489D1 (en) | 1989-04-27 |
| ZA838885B (en) | 1984-07-25 |
| ES8505838A1 (es) | 1985-06-16 |
| BR8306745A (pt) | 1984-07-17 |
| JPH0622202B2 (ja) | 1994-03-23 |
| AU2223183A (en) | 1984-06-14 |
| US4605565A (en) | 1986-08-12 |
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