KR910005401A - 실리콘 식각방법을 이용한 자기정렬방식의 고주파용 소자제조방법 - Google Patents

실리콘 식각방법을 이용한 자기정렬방식의 고주파용 소자제조방법 Download PDF

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Publication number
KR910005401A
KR910005401A KR1019890012476A KR890012476A KR910005401A KR 910005401 A KR910005401 A KR 910005401A KR 1019890012476 A KR1019890012476 A KR 1019890012476A KR 890012476 A KR890012476 A KR 890012476A KR 910005401 A KR910005401 A KR 910005401A
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KR
South Korea
Prior art keywords
high frequency
frequency device
self
silicon etching
fabrication method
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KR1019890012476A
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English (en)
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KR0137949B1 (ko
Inventor
홍찬희
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문정환
금성일렉트론 주식회사
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Priority to KR1019890012476A priority Critical patent/KR0137949B1/ko
Publication of KR910005401A publication Critical patent/KR910005401A/ko
Application granted granted Critical
Publication of KR0137949B1 publication Critical patent/KR0137949B1/ko

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Bipolar Transistors (AREA)

Abstract

내용 없음

Description

실리콘 식각방법을 이용한 자기정렬방식의 고주파용 소자제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도 (A) (D)는 본 발명의 제조 고정도.

Claims (1)

  1. 액티브영역정의 및 필드산화막을 형성한후(제2도A) LTO증착 또는 열산화막형성(200A에서)과 베이스전극을 위한 P+이온주입하고 (제2도B), 진성베이스 영역정의 및 실리콘 식각, 진성베이스영역에 P이온을 주입하고(제2도C)난후 측벽공간 형성 및 폴리증착과 n+이온주입 및 폴리식각을 하는 공정에 의한 실리콘식각방법을 이용한 자기정렬방식의 고주파용 소자제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890012476A 1989-08-31 1989-08-31 실리콘 식각방법을 이용한 자기정렬 방식의 소자 제조방법 KR0137949B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019890012476A KR0137949B1 (ko) 1989-08-31 1989-08-31 실리콘 식각방법을 이용한 자기정렬 방식의 소자 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019890012476A KR0137949B1 (ko) 1989-08-31 1989-08-31 실리콘 식각방법을 이용한 자기정렬 방식의 소자 제조방법

Publications (2)

Publication Number Publication Date
KR910005401A true KR910005401A (ko) 1991-03-30
KR0137949B1 KR0137949B1 (ko) 1998-06-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890012476A KR0137949B1 (ko) 1989-08-31 1989-08-31 실리콘 식각방법을 이용한 자기정렬 방식의 소자 제조방법

Country Status (1)

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KR (1) KR0137949B1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105990135B (zh) * 2015-02-05 2018-12-07 北大方正集团有限公司 多晶硅发射极晶体管制造方法

Also Published As

Publication number Publication date
KR0137949B1 (ko) 1998-06-01

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