KR910002827B1 - 반도체칩의 다이본딩방법과 그 장치 - Google Patents

반도체칩의 다이본딩방법과 그 장치 Download PDF

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Publication number
KR910002827B1
KR910002827B1 KR1019880000342A KR880000342A KR910002827B1 KR 910002827 B1 KR910002827 B1 KR 910002827B1 KR 1019880000342 A KR1019880000342 A KR 1019880000342A KR 880000342 A KR880000342 A KR 880000342A KR 910002827 B1 KR910002827 B1 KR 910002827B1
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KR
South Korea
Prior art keywords
waveform
pressure
difference
resin
ejection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019880000342A
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English (en)
Korean (ko)
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KR880009428A (ko
Inventor
다케오 사토
야스히코 시미즈
Original Assignee
가부시키가이샤 도시바
아오이 죠이치
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 도시바, 아오이 죠이치 filed Critical 가부시키가이샤 도시바
Publication of KR880009428A publication Critical patent/KR880009428A/ko
Application granted granted Critical
Publication of KR910002827B1 publication Critical patent/KR910002827B1/ko
Expired legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting

Landscapes

  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Coating Apparatus (AREA)
KR1019880000342A 1987-01-19 1988-01-18 반도체칩의 다이본딩방법과 그 장치 Expired KR910002827B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62009578A JPS63177530A (ja) 1987-01-19 1987-01-19 ダイボンデイング方法とその装置
JP62-9578 1987-01-19

Publications (2)

Publication Number Publication Date
KR880009428A KR880009428A (ko) 1988-09-15
KR910002827B1 true KR910002827B1 (ko) 1991-05-06

Family

ID=11724194

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880000342A Expired KR910002827B1 (ko) 1987-01-19 1988-01-18 반도체칩의 다이본딩방법과 그 장치

Country Status (3)

Country Link
US (1) US4874444A (https=)
JP (1) JPS63177530A (https=)
KR (1) KR910002827B1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5074443A (en) * 1989-12-20 1991-12-24 Nordson Corporation Adaptor for liquid dispensing syringe
JPH03290715A (ja) * 1990-04-07 1991-12-20 Iwashita Eng Kk 圧力センサを有する定量吐出装置の圧力変更型吐出量安定ディスペンス制御装置
KR940009257B1 (ko) * 1990-07-10 1994-10-06 무사시엔지니어링 가부시기가이샤 액체 정량 토출장치
US5423889A (en) * 1994-06-24 1995-06-13 Harris Corporation Process for manufacturing a multi-port adhesive dispensing tool
JP2716940B2 (ja) * 1994-09-05 1998-02-18 株式会社東芝 ダイボンディング方法とその装置
JP3498877B2 (ja) 1995-12-05 2004-02-23 株式会社東芝 半導体製造装置および半導体装置の製造方法
US5772814A (en) * 1996-01-26 1998-06-30 Branson Ultrasonic Corporation Welding system and method of setting welding machine parameters
JP2804951B2 (ja) * 1996-02-23 1998-09-30 九州日本電気株式会社 精密定量吐出方法および吐出装置
US6399425B1 (en) * 1998-09-02 2002-06-04 Micron Technology, Inc. Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices
US20020189541A1 (en) * 2001-06-14 2002-12-19 Lily Chao Glue dropping machine
US6857543B2 (en) * 2001-12-01 2005-02-22 Shipley Company, L.L.C. Low volume dispense unit and method of using
TWI286086B (en) * 2005-04-11 2007-09-01 Unaxis Int Trading Ltd Method for operating a pneumatic device for the metered delivery of a liquid and pneumatic device
JP4749141B2 (ja) * 2005-12-07 2011-08-17 トリニティ工業株式会社 塗装システム
US20090317544A1 (en) * 2008-05-15 2009-12-24 Zao "Intermetcomposit" Method and Device for Gasodynamically Marking a Surface with a Mark
US8464902B2 (en) 2009-01-09 2013-06-18 Nordson Corporation Apparatus and method for pulsed dispensing of liquid
US20120040477A1 (en) * 2010-08-13 2012-02-16 Frank Yu Ai epoxy adjustment
JP5853164B2 (ja) * 2012-04-24 2016-02-09 パナソニックＩｐマネジメント株式会社 液体供給装置、液体吐出装置及び液体供給方法
KR102450258B1 (ko) * 2019-06-25 2022-09-30 창저우 밍실 로봇 테크놀로지 컴퍼니 리미티드 디스펜싱 제어 장치 및 그에 의한 접착제 토출 제어 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3347418A (en) * 1965-10-23 1967-10-17 Polaroid Corp Liquid dispenser utilizing controlled gas pressure
US3499580A (en) * 1968-07-02 1970-03-10 Frank B Smith Pressure pour apparatus and component thereof
US3666143A (en) * 1970-06-22 1972-05-30 Murray Weston Automatic fluid dispensing apparatus with manual override
US4164001A (en) * 1978-04-04 1979-08-07 Patnaude Edmond J Speed compensating control system
JPS55119471A (en) * 1979-03-09 1980-09-13 Matsushita Electric Ind Co Ltd Adhesive coating method
US4334636A (en) * 1979-12-27 1982-06-15 Paul William A Apparatus for handling gasket-forming material
US4675301A (en) * 1985-04-01 1987-06-23 Eastman Kodak Company Method for correcting for changes in air pressure above a liquid to be dispensed from a container mounted on a probe
JPS6397259A (ja) * 1986-10-14 1988-04-27 Shinkawa Ltd ペ−スト吐出装置

Also Published As

Publication number Publication date
KR880009428A (ko) 1988-09-15
JPH0567057B2 (https=) 1993-09-24
US4874444A (en) 1989-10-17
JPS63177530A (ja) 1988-07-21

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