KR910002762B1 - 반도체장치 - Google Patents

반도체장치 Download PDF

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Publication number
KR910002762B1
KR910002762B1 KR1019870013120A KR870013120A KR910002762B1 KR 910002762 B1 KR910002762 B1 KR 910002762B1 KR 1019870013120 A KR1019870013120 A KR 1019870013120A KR 870013120 A KR870013120 A KR 870013120A KR 910002762 B1 KR910002762 B1 KR 910002762B1
Authority
KR
South Korea
Prior art keywords
package
lead
printed wiring
wiring board
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019870013120A
Other languages
English (en)
Korean (ko)
Other versions
KR880006780A (ko
Inventor
히로미치 사와야
Original Assignee
가부시키가이샤 도시바
아오이 죠이치
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 도시바, 아오이 죠이치 filed Critical 가부시키가이샤 도시바
Publication of KR880006780A publication Critical patent/KR880006780A/ko
Application granted granted Critical
Publication of KR910002762B1 publication Critical patent/KR910002762B1/ko
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10696—Single-in-line [SIL] package
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10871—Leads having an integral insert stop

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
KR1019870013120A 1986-11-20 1987-11-20 반도체장치 Expired KR910002762B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP86-277329 1986-11-20
JP61-277329 1986-11-20
JP61277329A JPS63129652A (ja) 1986-11-20 1986-11-20 半導体装置

Publications (2)

Publication Number Publication Date
KR880006780A KR880006780A (ko) 1988-07-25
KR910002762B1 true KR910002762B1 (ko) 1991-05-04

Family

ID=17582010

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870013120A Expired KR910002762B1 (ko) 1986-11-20 1987-11-20 반도체장치

Country Status (3)

Country Link
US (1) US4807087A (https=)
JP (1) JPS63129652A (https=)
KR (1) KR910002762B1 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD316251S (en) 1988-12-19 1991-04-16 Mosaic Semiconductor, Inc. In-line semiconductor package
IT1235832B (it) * 1989-07-18 1992-11-03 Sgs Thomson Microelectronics Coniatura dei telai tranciati per ripristinare il parallelismo delle superfici dei piedini in vista della loro piegatura definitiva in contenitori single in line.
US5113314A (en) * 1991-01-24 1992-05-12 Hewlett-Packard Company High-speed, high-density chip mounting
JP2971637B2 (ja) * 1991-06-17 1999-11-08 富士通株式会社 半導体装置
US5352851A (en) * 1992-09-08 1994-10-04 Texas Instruments Incorporated Edge-mounted, surface-mount integrated circuit device
JP3117828B2 (ja) * 1992-12-28 2000-12-18 ローム株式会社 合成樹脂封止型電子部品及びそのリード端子の曲げ加工方法
JP2586098Y2 (ja) * 1993-05-24 1998-12-02 株式会社村田製作所 電子部品およびその実装構造
JPH07235361A (ja) * 1993-12-29 1995-09-05 Amp Japan Ltd テープキャリア型電気コネクタ及びその製造方法
TW303427B (https=) * 1994-06-10 1997-04-21 Sony Co Ltd
US5588849A (en) * 1994-10-18 1996-12-31 The Whitaker Corporation Connector with pin terminals adapted for surface mounting
US5659950A (en) * 1995-03-23 1997-08-26 Motorola, Inc. Method of forming a package assembly
US6247940B1 (en) * 1999-08-23 2001-06-19 Avaya Technology Corp. Connector having improved high-voltage surge performance
USD730849S1 (en) * 2012-10-05 2015-06-02 Tower Mfg Corp Universal ground fault circuit interrupter (GFCI) printed circuit board package
USD725054S1 (en) * 2013-07-31 2015-03-24 Tower Manufacturing Corporation Ground fault circuit interrupter (GFCI) printed circuit board package
JP1646470S (https=) * 2019-05-14 2019-11-25
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53149558A (en) * 1977-05-27 1978-12-27 Kubota Ltd Treateddgrain conveyinggout device in grain processing device
US4387413A (en) * 1980-12-24 1983-06-07 Rca Corporation Semiconductor apparatus with integral heat sink tab
JPS5914348U (ja) * 1982-07-19 1984-01-28 日本電気株式会社 樹脂封止型半導体装置
US4521828A (en) * 1982-12-23 1985-06-04 At&T Technologies, Inc. Component module for piggyback mounting on a circuit package having dual-in-line leads
US4656442A (en) * 1984-02-27 1987-04-07 Toko, Inc. Hybrid circuit device

Also Published As

Publication number Publication date
US4807087A (en) 1989-02-21
JPH0466392B2 (https=) 1992-10-23
KR880006780A (ko) 1988-07-25
JPS63129652A (ja) 1988-06-02

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