KR910001093A - 알루미늄 또는 알루미늄 합금 표면의 전기화학적 그레이닝방법 및 이에 사용되는 전해질 - Google Patents
알루미늄 또는 알루미늄 합금 표면의 전기화학적 그레이닝방법 및 이에 사용되는 전해질 Download PDFInfo
- Publication number
- KR910001093A KR910001093A KR1019900008213A KR900008213A KR910001093A KR 910001093 A KR910001093 A KR 910001093A KR 1019900008213 A KR1019900008213 A KR 1019900008213A KR 900008213 A KR900008213 A KR 900008213A KR 910001093 A KR910001093 A KR 910001093A
- Authority
- KR
- South Korea
- Prior art keywords
- acid
- aluminum
- electrolyte
- aluminum alloy
- electrochemical
- Prior art date
Links
- 229910000838 Al alloy Inorganic materials 0.000 title claims 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims 8
- 229910052782 aluminium Inorganic materials 0.000 title claims 8
- 239000003792 electrolyte Substances 0.000 title claims 8
- 238000000034 method Methods 0.000 title claims 3
- 238000005469 granulation Methods 0.000 title 1
- 230000003179 granulation Effects 0.000 title 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 5
- 239000002253 acid Substances 0.000 claims 4
- 238000007743 anodising Methods 0.000 claims 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 3
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims 2
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 claims 2
- 150000001991 dicarboxylic acids Chemical class 0.000 claims 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 claims 2
- 235000006408 oxalic acid Nutrition 0.000 claims 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 claims 2
- 238000007517 polishing process Methods 0.000 claims 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 claims 2
- QBYIENPQHBMVBV-HFEGYEGKSA-N (2R)-2-hydroxy-2-phenylacetic acid Chemical compound O[C@@H](C(O)=O)c1ccccc1.O[C@@H](C(O)=O)c1ccccc1 QBYIENPQHBMVBV-HFEGYEGKSA-N 0.000 claims 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims 1
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 claims 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 claims 1
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 claims 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims 1
- FEWJPZIEWOKRBE-XIXRPRMCSA-N Mesotartaric acid Chemical compound OC(=O)[C@@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-XIXRPRMCSA-N 0.000 claims 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims 1
- IWYDHOAUDWTVEP-UHFFFAOYSA-N R-2-phenyl-2-hydroxyacetic acid Natural products OC(=O)C(O)C1=CC=CC=C1 IWYDHOAUDWTVEP-UHFFFAOYSA-N 0.000 claims 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims 1
- 239000001361 adipic acid Substances 0.000 claims 1
- 235000011037 adipic acid Nutrition 0.000 claims 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims 1
- VRAIHTAYLFXSJJ-UHFFFAOYSA-N alumane Chemical compound [AlH3].[AlH3] VRAIHTAYLFXSJJ-UHFFFAOYSA-N 0.000 claims 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims 1
- 239000007864 aqueous solution Substances 0.000 claims 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000001530 fumaric acid Substances 0.000 claims 1
- 239000004310 lactic acid Substances 0.000 claims 1
- 235000014655 lactic acid Nutrition 0.000 claims 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims 1
- 239000011976 maleic acid Substances 0.000 claims 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims 1
- 239000001630 malic acid Substances 0.000 claims 1
- 235000011090 malic acid Nutrition 0.000 claims 1
- 229960002510 mandelic acid Drugs 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229940014800 succinic anhydride Drugs 0.000 claims 1
- 239000011975 tartaric acid Substances 0.000 claims 1
- 235000002906 tartaric acid Nutrition 0.000 claims 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/16—Pretreatment, e.g. desmutting
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/04—Etching of light metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/03—Chemical or electrical pretreatment
- B41N3/034—Chemical or electrical pretreatment characterised by the electrochemical treatment of the aluminum support, e.g. anodisation, electro-graining; Sealing of the anodised layer; Treatment of the anodic layer with inorganic compounds; Colouring of the anodic layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Printing Plates And Materials Therefor (AREA)
- Sealing Battery Cases Or Jackets (AREA)
- Electroplating Methods And Accessories (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
- Electrolytic Production Of Metals (AREA)
- ing And Chemical Polishing (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 피스톤이 도시되는 측면도.
Claims (7)
- 2.5g/1 내지 20g/1 농도범위의 염산과 : 1 내지 100g/1농도범위의, 옥시산에서 선택되는 적어도 하나이상의 산 또는, 하나이상의 디카르복실산이나 그 유도체 또는, 이들의 혼합물로 구성되는 것을 특징으로 하는 알루미늄 또는 알루미늄 합금의 전기화학적 그레이닝용 전해질.
- 제1항에 있어서, 상기한 옥시산이 글리콜산, 락트산, 알파옥시부티르산, 만델산, 글리세르산, 말산, 타르타르산, 메소타르타르산, 시트르산으로 구성되는 그룹에서 선택되어지는 것을 특징으로 하는 알루미늄 또는 알루미늄 합금의 전기화학적 그레이닝용 전해질.
- 제1항 또는 제2항에 있어서, 상기한 디카르복실산이 옥살산, 말론산, 숙신산, 글루타르산, 아디프산, 피멜산, 수베린산, 아젤라인산, 말레인산, 푸마르산, 프탈산, 이소프탈산, 테레프탈산, 헤메멜리트산, 트리멜리트산, 트리메신산으로 구성되는 그룹에서 선택되어지는 것을 특징으로 하는 알루미늄 또는 알루미늄 합금의 전기화학적 그레이닝용 전해질.
- 상기항들 중 어느 1항에 있어서, 상기한 디카르복실산의 유도체가 무수숙신산, 무수말레인산, 무수프탈산으로 구성되는 그룹에서 선택되어지는 것을 특징으로 하는 알루미늄 또는 알루미늄 합금의 전기화학적 그레이닝용 전해질.
- 상기한 항들중 어느 1항의 전해질의 수용액 내에서 알루미늄 판과 대응극의 거리 10 내지 250mm, 전해온도 10℃ 내지 40℃, 바람직하게는 10 내지 30볼트의 교류를 전류밀도 0.5 내지 10A/dm2로 30초 내지 5분 동안 흘려서 하나 또는 그 이상의 알루미늄 판재를 전기화학적으로 표면처리하는 것을 특징으로 하는 알루미늄 또는 알루미늄 합금 표면의 연마 또는 그레이닝 방법.
- 제5항에 있어서, 그레이닝이 시행된 판재를 황산, 인산, 옥살산 및 이들의 혼합물로부터 선택되는 양극처리 전해질을 포함하는 양극처리욕 내에 침지시키는 공정과, 상기 욕내에 직류를 흘리는 공정으로 구성되는 양극처리 방법을 포함하는 것을 특징으로 하는 알루미늄 알루미늄 합금 표면의 연마 또는 그레이닝 방법.
- 제6항에 있어서, 양극처리된 상기판재를 감광층으로 코팅하는 공정을 포함하는 것을 특징으로 하는 알루미늄 또는 알루미늄 합금 표면의 연마 또는 그레이닝 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT84942A/89 | 1989-06-05 | ||
IT8984942A IT1235332B (it) | 1989-06-05 | 1989-06-05 | Granitura elettrochimica di superfici in alluminio o in lega di alluminio |
Publications (1)
Publication Number | Publication Date |
---|---|
KR910001093A true KR910001093A (ko) | 1991-01-30 |
Family
ID=11326178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900008213A KR910001093A (ko) | 1989-06-05 | 1990-06-04 | 알루미늄 또는 알루미늄 합금 표면의 전기화학적 그레이닝방법 및 이에 사용되는 전해질 |
Country Status (13)
Country | Link |
---|---|
US (1) | US5064511A (ko) |
EP (1) | EP0401601B1 (ko) |
JP (1) | JPH0324289A (ko) |
KR (1) | KR910001093A (ko) |
AT (1) | ATE114740T1 (ko) |
AU (1) | AU5617690A (ko) |
BR (1) | BR9002643A (ko) |
CA (1) | CA2018180A1 (ko) |
DD (1) | DD298364A5 (ko) |
DE (1) | DE69014418T2 (ko) |
HU (1) | HUT54316A (ko) |
IT (1) | IT1235332B (ko) |
ZA (1) | ZA904194B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040071381A (ko) * | 2003-02-06 | 2004-08-12 | 임병식 | 금속표면 전해연마용 전해액 조성물 |
Families Citing this family (22)
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JPH06275473A (ja) * | 1993-03-19 | 1994-09-30 | Matsushita Electric Ind Co Ltd | アルミ電解コンデンサ用陽極箔の製造方法 |
US7964085B1 (en) | 2002-11-25 | 2011-06-21 | Applied Materials, Inc. | Electrochemical removal of tantalum-containing materials |
US20060105182A1 (en) * | 2004-11-16 | 2006-05-18 | Applied Materials, Inc. | Erosion resistant textured chamber surface |
JP2005056786A (ja) | 2003-08-07 | 2005-03-03 | Denso Corp | スパークプラグ |
US7910218B2 (en) * | 2003-10-22 | 2011-03-22 | Applied Materials, Inc. | Cleaning and refurbishing chamber components having metal coatings |
US7618769B2 (en) * | 2004-06-07 | 2009-11-17 | Applied Materials, Inc. | Textured chamber surface |
EP1616959A1 (en) | 2004-07-07 | 2006-01-18 | Icon Genetics AG | Biological safe transient protein expression in plants |
US7670436B2 (en) | 2004-11-03 | 2010-03-02 | Applied Materials, Inc. | Support ring assembly |
US7579067B2 (en) | 2004-11-24 | 2009-08-25 | Applied Materials, Inc. | Process chamber component with layered coating and method |
US8617672B2 (en) | 2005-07-13 | 2013-12-31 | Applied Materials, Inc. | Localized surface annealing of components for substrate processing chambers |
US7762114B2 (en) | 2005-09-09 | 2010-07-27 | Applied Materials, Inc. | Flow-formed chamber component having a textured surface |
US9127362B2 (en) | 2005-10-31 | 2015-09-08 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
US20070113783A1 (en) * | 2005-11-19 | 2007-05-24 | Applied Materials, Inc. | Band shield for substrate processing chamber |
US8647484B2 (en) | 2005-11-25 | 2014-02-11 | Applied Materials, Inc. | Target for sputtering chamber |
EP1826022B1 (en) * | 2006-02-28 | 2008-11-26 | Agfa Graphics N.V. | A method for making a lithographic printing plate support |
US20080003411A1 (en) * | 2006-06-29 | 2008-01-03 | Joseph Hunter | Aluminum lithographic substrate and method of making |
US7981262B2 (en) | 2007-01-29 | 2011-07-19 | Applied Materials, Inc. | Process kit for substrate processing chamber |
US7942969B2 (en) | 2007-05-30 | 2011-05-17 | Applied Materials, Inc. | Substrate cleaning chamber and components |
JP5831440B2 (ja) | 2012-12-17 | 2015-12-09 | 株式会社ダイヤメット | 粉末冶金用原料粉末 |
US9101954B2 (en) | 2013-09-17 | 2015-08-11 | Applied Materials, Inc. | Geometries and patterns for surface texturing to increase deposition retention |
JP2018119184A (ja) * | 2017-01-26 | 2018-08-02 | 株式会社Adeka | 電解エッチング液組成物、電解エッチング方法、電解エッチングされた基材、アルミニウム電解コンデンサ用電極材、及びコンデンサ |
JP6525035B2 (ja) * | 2017-08-29 | 2019-06-05 | 日本軽金属株式会社 | アルミニウム部材及びその製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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NL6613586A (ko) * | 1966-09-27 | 1968-03-28 | ||
US4052275A (en) * | 1976-12-02 | 1977-10-04 | Polychrome Corporation | Process for electrolytic graining of aluminum sheet |
US4174269A (en) * | 1978-06-21 | 1979-11-13 | Ppg Industries, Inc. | Method of treating electrodes |
JPS56135095A (en) * | 1980-03-26 | 1981-10-22 | Mitsubishi Chem Ind Ltd | Manufacture of supporter for planographic process block |
US4276129A (en) * | 1980-06-25 | 1981-06-30 | Matsushita Electric Industrial Co., Ltd. | Method for producing foil electrodes for electrolytic capacitor |
US4396468A (en) * | 1981-12-21 | 1983-08-02 | American Hoechst Corporation | Three phase graining of aluminum substrates |
JPS60163423A (ja) * | 1984-02-03 | 1985-08-26 | 昭和アルミニウム株式会社 | 電解コンデンサ電極用アルミニウム箔のエツチング方法 |
-
1989
- 1989-06-05 IT IT8984942A patent/IT1235332B/it active
-
1990
- 1990-05-23 DE DE69014418T patent/DE69014418T2/de not_active Expired - Fee Related
- 1990-05-23 EP EP90109843A patent/EP0401601B1/en not_active Expired - Lifetime
- 1990-05-23 AT AT90109843T patent/ATE114740T1/de not_active IP Right Cessation
- 1990-05-24 US US07/527,904 patent/US5064511A/en not_active Expired - Fee Related
- 1990-05-31 AU AU56176/90A patent/AU5617690A/en not_active Abandoned
- 1990-06-01 ZA ZA904194A patent/ZA904194B/xx unknown
- 1990-06-01 DD DD90341254A patent/DD298364A5/de not_active IP Right Cessation
- 1990-06-04 BR BR909002643A patent/BR9002643A/pt not_active Application Discontinuation
- 1990-06-04 KR KR1019900008213A patent/KR910001093A/ko not_active Application Discontinuation
- 1990-06-04 HU HU903321A patent/HUT54316A/hu unknown
- 1990-06-04 CA CA002018180A patent/CA2018180A1/en not_active Abandoned
- 1990-06-05 JP JP2145525A patent/JPH0324289A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040071381A (ko) * | 2003-02-06 | 2004-08-12 | 임병식 | 금속표면 전해연마용 전해액 조성물 |
Also Published As
Publication number | Publication date |
---|---|
US5064511A (en) | 1991-11-12 |
DD298364A5 (de) | 1992-02-20 |
IT1235332B (it) | 1992-06-26 |
BR9002643A (pt) | 1991-08-20 |
DE69014418D1 (de) | 1995-01-12 |
EP0401601A1 (en) | 1990-12-12 |
HU903321D0 (en) | 1990-10-28 |
DE69014418T2 (de) | 1995-04-20 |
EP0401601B1 (en) | 1994-11-30 |
IT8984942A0 (it) | 1989-06-05 |
HUT54316A (en) | 1991-02-28 |
CA2018180A1 (en) | 1990-12-05 |
AU5617690A (en) | 1990-12-06 |
JPH0324289A (ja) | 1991-02-01 |
ATE114740T1 (de) | 1994-12-15 |
ZA904194B (en) | 1991-03-27 |
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